Ram Babu

Software Engineer

Hyderabad, Telangana, India5 yrs experience

Most Likely To SwitchHighly Stable

Key Highlights

Delivered two successful tapeouts at Qualcomm.
Expertise in Innovus, ICC2, and Prime Time.
Strong background in low-power and digital ASIC design.

Stackforce AI infers this person is a Semiconductor Physical Design Engineer with expertise in ASIC design and EDA tools.

Contact

Skills

Core Skills

Physical DesignLow-power DesignDigital Asic Design

Other Skills

Place & RouteFloorplanningInnovusICC2Tcl AutomationDigital Hardware DesignECOIR and EM analysisLayout Versus Schematic (LVS)Floor PlansApplication-Specific Integrated Circuits (ASIC)TCLLinuxICCTiming

Experience

5 yrs

Total Experience

3 yrs 2 mos

Average Tenure

5 yrs

Current Experience

Mediatek

ASIC Physical Design Engineer

Sep 2025 – Present · 8 mos · Remote

Qualcomm

Physical Design Engineer

Jan 2024 – May 2025 · 1 yr 4 mos · Bangalore · On-site

Handled Block level PnR implementation

Digital Hardware DesignInnovusPhysical DesignDigital ASIC Design

Juntran technologies pvt ltd

ASIC Physical Design Engineer

May 2021 – Present · 5 yrs · Hyderabad, Telangana, India · Hybrid

Experienced Physical Design Engineer | 2 - Tapeout | Supported 4HMs | Innovus & ICC2 | Tcl Automation
I’m a Physical Design Engineer with over 3 years of hands-on experience in cutting-edge SoC implementation flows, including floorplanning, placement, CTS, routing, and STA closure. I had the opportunity to contribute to two successful tapeouts while working with a top-tier Qualcomm client.
With strong expertise in EDA tools like Cadence Innovus and Synopsys ICC2, I specialize in automating design flows using Tcl scripting, improving runtime efficiency and consistency across PD stages. My work has involved optimizing performance, power, and area (PPA), debugging timing violations, and collaborating with cross-functional teams across multiple project milestones.
I’m passionate about learning the latest advancements in semiconductor technology, and I thrive in fast-paced environments where innovation meets silicon.

Place & RouteFloorplanningInnovusICC2Tcl AutomationPhysical Design+1