Ayush Verma

Product Engineer

Ithaca, New York, United States2 yrs 2 mos experience
Most Likely To Switch

Key Highlights

  • Expertise in Organic Electronics and Quantum Materials.
  • Proven track record in Semiconductor Engineering.
  • Strong interdisciplinary foundation in Mechanical Engineering.
Stackforce AI infers this person is a Materials Science and Engineering specialist with a focus on Semiconductor and Biomedical applications.

Contact

Skills

Core Skills

Organic ElectronicsSuperconductorsSemiconductor EngineeringStatistical Data AnalysisMechanical EngineeringMaterial Characterization3d PrintingMechanical Product DesignAdditive ManufacturingProcess EngineeringData Analysis

Other Skills

ANOVAANSYSANSYS ProductsAlgorithmsAutoCADBlock CopolymersCommunicationCommunity OutreachComputed Axial LithographyComputer-Aided Design (CAD)Content StrategyDesign of Experiments (DOE)Direct Ink WritingEngineeringFSW

About

I am a graduate researcher at the Sibley School of Mechanical and Aerospace Engineering, Cornell University, focusing on Organic Electronics and the polymer-solution-based synthesis of advanced quantum materials. My graduate thesis under the Wiesner group explores mesoporous thin-film superconductors on silicon substrates for integration into microelectronics and semiconductor nanofabrication. I hold a bachelor’s degree in Mechanical Engineering from NSUT Delhi (formerly NSIT, University of Delhi), where my thesis centered on the microstructural characterization and mechanical evaluation of underwater friction stir-processed aluminum alloy 1100. I recently served as a CDSEM Metrology Engineering Intern (R&D) at Intel Corporation within the Logic Technology Development group. I worked on Critical Dimension Scanning Electron Microscopy (CDSEM) for 18A & 14A logic nodes, focusing on surface charge mitigation, precision recipe development, and CD variability monitoring across multiple layers. My contributions included optimizing copper-based CDSEM experiments, improving autofocus/stigmation performance, and publishing validated engineering recipes that enhanced tool consistency for Intel’s next-generation microprocessors. Earlier, I engineered auxetic scaffolds for biomedical applications during my tenure at the Singapore Centre for 3D Printing (SC3DP), NTU Singapore. My undergraduate journey spanned projects in solid-state joining, additive manufacturing, and vehicle dynamics, shaping a strong interdisciplinary foundation. For additional details, please see the experience section. My academic publications are listed on Google Scholar (https://scholar.google.com/citations?user=GnwhW8gAAAAJ&hl=en), and I actively share mentorship and guidance via my Topmate (https://shorturl.at/7koix) page.

Experience

Intel corporation

LTDM CDSEM Metrology Engineering Intern, R&D

May 2025Aug 2025 · 3 mos · Oregon, United States · On-site

  • Logic Technology Development Module: Critical Dimension Scanning Electron Microscope (CDSEM) Team under Lithography Group.
  • Hands-on experience with Intel® CDSEM Metrology tools for advanced logic nodes (18A & 14A); focused on enhancing image fidelity in backend Developed Check CD layers through surface charge mitigation by employing a voltage-applying static eliminator (ionizer), SEM tuning, and recipe optimization
  • Conducted precision experiments using Copper CDSEM tools to mitigate autofocus and stigmation challenges; optimized ionization exposure time, reducing surface charge effects by ~60% and improving lot-to-lot imaging consistency
  • Leveraged internal platforms from Intel and Hitachi to monitor CD variability and drive improvements in tool performance across multiple layers
  • Published SPM-validated CD engineering recipes for multiple product chips defined surface potential thresholds to enable robust and repeatable metrology for Intel's Next Gen microprocessors
  • Conducted AMP characterization across MT and VIA layers comparing single point, multi point and ellipse techniques to optimize CD
  • Reach out to me at: ayush.verma@intel.com
Scanning Electron Microscopy (SEM)Python (Programming Language)JMPStatistical Process Control (SPC)Microsoft Visual Studio CodeResearch+5

Cornell university

2 roles

Graduate Research Assistant

Promoted

Oct 2024Present · 1 yr 5 mos · On-site

  • Developed PS-microsphere integrated BCP inks for 3D printing hierarchically porous superconductors with multi-scale ordering based on solution based block co-polymer self assembly
  • Optimized polymerization and ink rheology to enable stable direct ink writing of mesostructured niobia lattices.
  • Achieved phase-pure NbN nitrides via two-step thermal treatments; validated structural/magnetic properties via SAXS, WAXS, and VSM.
  • Explored CAL-compatible ink formulations and PS functionalization for next-gen superconducting quantum materials via Volumetric Additive Manufacturing (VAM).
  • Exploring Pluronics structure (P84, P123) directed gyroidal morphologies using TEOS and Phenol resols based carbonaceous precursors
  • Advisor: Prof. Ulrich Wiesner,
  • The Wiesner Group, Department of Materials Science and Engineering.
  • Reach out to me at: av588@cornell.edu
Suspension PolymerisationVibrating Sample MagnetometryVolumetric Additive ManufacturingComputed Axial LithographyOrganic ElectronicsSuperconductors+8

Teaching Assistant

Aug 2024Dec 2024 · 4 mos · On-site

  • MAE 4300 Engineers & Society
JMP

Netaji subhas institute of technology

Undergraduate Research Assistant

Aug 2023May 2024 · 9 mos · Delhi, India · On-site

  • Bachelor Thesis Project with Metrology and Micro-Measurement Lab, Jamia Millia Islamia, New Delhi:
  • Developed a mathematical model in Design of Experiments (DOE) to predict the effects of welding parameters on Underwater Friction Stir Welding (UFSW) of AA1100-H18, achieving 82% accuracy using ANOVA and Response Surface Methodology (RSM) for a central composite rotatable design (1 paper under review).
  • Achieved 97% joint efficiency in UFSW of AA1100-H18 using DOE-optimized parameters; validated outcomes via ASTM-standard tensile, impact, and hardness tests, and quantified grain refinement and Hall–Petch hardening across weld zones (SZ, TMAZ, HAZ) using SEM and optical microscopy.
  • Investigated weld defect mechanisms such as tunneling and void formation driven by tool-material interaction and thermal gradients; co-authored 1 accepted and 1 under-review paper in Springer Nature journals on UFSW process–structure–property relationships.
ANOVAANSYSDesign of Experiments (DOE)FSWMATLABMaterial Characterization+10

Nanyang technological university singapore

Visiting Research Intern- SC3DP

May 2023Aug 2023 · 3 mos · Singapore · On-site

  • Design of 3D-printed Lego-like scaffolds/lattices based on auxetic structures for biomedical applications
  • Designed 3D-printed LEGO-like auxetic scaffolds on SolidWorks reducing 25% stress-shielding in cell-migration based bone engineering
  • Verified 90% alignment of simulated predictions with experimental tests for lattice prototypes under compressive loads on a UTM
  • Reviewed the state-of-the-art AI techniques for lattice design AM optimization.
  • Reach out to me at: n2208273c@e.ntu.edu.sg
3D PrintingAutoCADCommunicationEngineeringMaterial CharacterizationMaterials Science+5

Ku leuven

Research Intern

May 2022Oct 2022 · 5 mos · Leuven, Flemish Region, Belgium · Remote

  • Explored AM processes, hybrid techniques, and diverse material combinations including polymers, metals, ceramics, and biomaterials
  • Analyzed structural challenges, process adaptability, and functional material design to propose a unified MMAM framework
  • Published work:
  • 1) https://doi.org/10.3390/ma16155246 (Materials, MDPI)
Additive ManufacturingData AnalysisReporting & AnalysisResearch

Escorts kubota limited

Process Engineering Intern- ECE

Jan 2022Mar 2022 · 2 mos · Faridabad, Haryana, India · On-site

  • Project-based on Telehandlers & Compact Hydra Cranes
  • Published work:
  • 1) https://iopscience.iop.org/article/10.1088/1757-899X/1258/1/012019 (Presented in ICMSMT 2022 followed by an issue in IOP Science: Materials Science and Engineering)
  • Reach out to me at: ayush.verma@escorts.co.in
Process EngineeringAutoCADSOLIDWORKSSolid EdgeStatistical Process Control (SPC)ANSYS

Netaji subhas institute of technology

Undergraduate Research Assistant

Jul 2021Dec 2021 · 5 mos · New Delhi, India · On-site

  • Developed a mathematical model using the Central Composite Rotatable Design (CCRD) approach to predict the effects of welding input parameters on the angular distortion, bead geometry, and weld dilution during the MIG Welding of Aluminium Alloy 8011 thus obtaining an optimum range of the input factors for a flawless bead geometry upto 82% accuracy using Response Surface Methodology and ANOVA.
  • Published work: (Materials Today: Proceedings)
  • 1) https://doi.org/10.1016/j.matpr.2021.12.095 (Presented in ICMPC 2022)
  • 2) https://doi.org/10.1016/j.matpr.2022.02.063
  • 3) https://doi.org/10.1016/j.matpr.2022.02.065
  • Reach out to me at: ayush.verma.ug20@nsut.ac.in
ANOVAAutoCADCommunicationData AnalysisDesign of Experiments (DOE)Literature Reviews+11

Education

Cornell University

Master of Science - MS (Thesis) — Mechanical Engineering

Aug 2024Jun 2026

Netaji Subhas Institute of Technology

Bachelor of Technology - BTech — Mechanical Engineering

Jan 2020Jan 2024

DAV PUBLIC SCHOOL SRESHTHA VIHAR DELHI-110092

Class-XII — Computer Science

Apr 2006Apr 2020

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