Nishant Sharma

Product Engineer

Bengaluru, Karnataka, India5 yrs 7 mos experience

Most Likely To SwitchHighly Stable

Key Highlights

PhD candidate specializing in semiconductor devices and microfluidics.
Hands-on experience with advanced packaging techniques.
Strong communication skills bridging students and recruiters.

Stackforce AI infers this person is a Semiconductor and Energy Researcher with expertise in microfluidics and thermal management.

Contact

nishant131800@gmail.com LinkedIn

Skills

Core Skills

MicrofluidicsThermal ManagementHeterogeneous IntegrationCommunicationNetworkingUnderstanding Plant Operations

Other Skills

Chiplet based advance packagingFan-out wafer-level packagingFlexTrate processMicrosoft OfficeRecruitmentSemiconductor FabricationStrategic PlanningTeam LeadershipTechnical knowledgeWearable Technology

About

Just another particle in the universe, trying to figure out patterns in noise : Pursuing PhD at IISc Bangalore at Prof. Prosenjit Sen's MDHS Lab. My research focuses on the fabrication and heterogenous integration of semiconductor devices along with microfluidics. Passionate about machines, designs. An avid reader, mostly non-fiction, history, politics, and cognitive psychology. : If you love science, research, and stories, follow me for the latest updates!! You can mail me your queries on nishant131800@gmail.com

Experience

Ucla henry samueli school of engineering and applied science

Visiting Researcher

Jul 2025 – Jul 2025 · 0 mo · Los Angeles, California, United States · On-site

I had the incredible opportunity to work with Prof. S.S. Iyer (Subu) at UCLA CHIPS, where I gained hands-on experience with the FlexTrate process — a novel approach for the heterogeneous integration of unpackaged dies/chips within a polymer matrix, aligned with fan-out wafer-level packaging (FOWLP) strategies. As part of the effort to address thermal management challenges, I contributed to the design of a scheme involving the incorporation of thin films with varied surface roughness to enable active cooling of the FlexTrate platform. This would enable high-density chiplet integration with more effective thermal solutions.

Heterogeneous integrationThermal ManagementFlexTrate processFan-out wafer-level packaging

Indian institute of science (iisc)

Ph.D. Scholar

Aug 2021 – Present · 4 yrs 7 mos · Bangalore Urban, Karnataka, India · On-site

I am doing research at the Microfluidic Devices and Heterogenous Systems lab with Prof. Prosenjit Sen. My area of research is to explore the interconnecting technologies for 3D integration of the devices and provide an effective thermal management solution for the wearable devices, which are heterogeneously integrated on a flexible substrate using bare dielets.

MicrofluidicsThermal ManagementSemiconductor FabricationChiplet based advance packaging

Indian institute of technology, delhi

2 roles

Elected CAIC PG Convener

Aug 2020 – Jun 2021 · 10 mos · Hauz Khas, Delhi, India · On-site

Placement Coordinator

Jul 2020 – Jul 2021 · 1 yr · Hauz Khas, Delhi, India · On-site

Being one of the placement coordinators, bridged the gap between recruiters and students. The recruiters were connected to the right talents through meticulous communication and testing. It was an opportunity for me network with recruiters across the globe and pitch them for campus placement.

CommunicationNetworkingRecruitment

Nuclear power corporation of india limited

Internship at Atomic Station

Jun 2016 – Jul 2016 · 1 mo · Narora, India · On-site

I was an intern at the Narora Atomic Powerplant. The main project was to understand the functioning and control of the plant. As an intern, I worked at the compressor, chiller, turbine, generator, and cooling tower units. The fascinating part of the internship was to understand the in-depth functioning of these units through regular lectures by technical staff and various scientists across India. This was an opportunity to connect the theoretical knowledge with the functioning devices.

Understanding plant operationsTechnical knowledge