Vipin Malav — Product Engineer
Presently serving as a Senior Embedded Software Engineer at SumUp Services GmbH. Previous professional background includes: 1. Holding the role of Lead Senior Engineer at Qualcomm India Pvt Ltd, specializing in storage device drivers for a duration of 3.6 years. Proficient in UFS, eMMC, NVMe, NAND, and NOR Technologies. 2. Serving as a Wireless Engineer at TeamF1 Networks (D-Link India), accumulating 7 years of experience in network security and wireless management. Demonstrated expertise in wireless networks, actively contributing to the advancement of 802.11 technologies, crafting wireless drivers, and implementing feature sets for major clients in India and the US. Possesses a B-Tech Degree in Computer Science and Engineering from NIT Jaipur, a distinguished educational institution in India.
Stackforce AI infers this person is a Senior Embedded Software Engineer with expertise in Fintech and Wireless Networking.
Location: Baden, Aargau, Switzerland
Experience: 13 yrs 8 mos
Skills
- Embedded Software
- Linux
- Device Drivers
- Embedded Systems
- Wireless Networking
- Network Security
Career Highlights
- Expert in embedded software and firmware development.
- Proficient in wireless networking and security protocols.
- Strong background in storage device driver development.
Work Experience
Trapeze Group Europe / UK
Embedded Architect (1 yr 6 mos)
SumUp
Senior Embedded Software Engineer (1 yr 7 mos)
Qualcomm
Senior Lead Engineer (1 yr 1 mo)
Senior Engineer (2 yrs 4 mos)
TeamF1 Networks Private Limited
Wireless Engineer (7 yrs 1 mo)
Education
Bachelor of Technology (B.Tech.) at Malaviya National Institute of Technology Jaipur