Manish Goel — VP of Engineering
A Product Engineering expert and excellent people leader with a passion for designing convergence cycles in terms of Product chipset requirements, system performance, power & thermal optimizations, architecture, die-size optimizations, design validation, physical design closure, post-silicon validation, software & customer enablement. Collaborated with product management, SoC teams & software teams to deliver on the product vision and end-user experiences. Currently Manish is Chipset Project Engineer/Chief Engineer/Engineering lead for XR (VR + AR) chipset where he is responsible for entire engineering deliverables for the Chipset comprising multiple SOC’s. Manish is responsible for engineering – signoff on features, planning, execution across multiple teams, resolving engineering challenges and ensure product meets customer requirements. Before current role Manish was leading System performance and thermal teams for Qualcomm chipsets @India. In this role he closely collaborated along with Product & Worldwide engineering teams to come up with right definition of product use cases, define performance and thermal requirements and ensure products meets the specs when it’s shipped to customers. Under Manish leadership, team has defined and delivered system performance & thermal of 30+ chipsets in 28,14,10,8,7,4nm process nodes comprising 5G, 4G, 3G, 2G Modem, Camera, Video, Graphics, CPU, Low power compute, AI, WLAN and audio systems. Before that Manish was SOC design manager/SOC Engineering lead where he lead planning and execution of Mobile SOC working along with architecture, IP, SOC design, SOC verification, DFT, physical design and post-silicon teams. Over the years, Manish has closely collaborated across global business, lead engineering teams to enable close to 40+ mobile chipsets and seen them going into mass production. Key areas of expertise: + Enable new product designs by understanding customer requirements and driving arch, system performance, power, thermal & SOC requirements to meet customer & market use cases, performance & power benchmarks + Deep understanding of Mobile Systems, XR Systems, SOC design cycle and resolving Silicon issues and enabling timely launches + Hiring and building world class teams + Influence global stakeholders working in matrix reporting structure Manish is strong leader & collaborator and is postgraduate from Indian Institute of Technology, Kharagpur.
Stackforce AI infers this person is a Semiconductor Engineering expert with a focus on chipset development and system performance.
Location: San Diego, California, United States
Experience: 24 yrs 11 mos
Skills
- Chipset
- System Architecture
- System Performance
- Thermal Management
- Soc Design
- Vlsi
- Validation Management
- Mobile Soc
- Soc Design Verification
- Project Management
- Pre-silicon Verification
- Verification Ip Design
Career Highlights
- Led delivery of 30+ chipsets in multiple process nodes.
- Expert in chipset engineering for XR technologies.
- Strong leadership in cross-functional engineering teams.
Work Experience
Qualcomm
Senior Director | Chipset Project Engineer | Chief Engineer XR Chipset (5 yrs 3 mos)
Senior Director Of Engineering | Head of System Performance & Thermal teams (3 yrs 6 mos)
Director Of Engineering (2 yrs 6 mos)
Senior Engg. Manager (2 yrs)
Engg. Staff Manager (2 yrs 4 mos)
Nokia
Wireless Modem Project Leader/Manager (2 yrs 5 mos)
Team Leader (1 yr 10 mos)
Cadence Design Systems
Senior Design Engineer (1 yr 1 mo)
Intel
Senior Design Engineer (4 yrs 5 mos)
Education
M-Tech at Indian Institute of Technology, Kharagpur
Electronics and Communications Engineering at Kurukshetra University