Mayank Surana

Software Engineer

Bengaluru, Karnataka, India10 yrs 3 mos experience

Most Likely To SwitchHighly Stable

Key Highlights

9+ years of experience in 5G, LTE, and 3G development.
Expert in Physical Layer Firmware and wireless communication protocols.
Proven track record in leading firmware development projects.

Stackforce AI infers this person is a Telecommunications expert with a strong focus on 5G and LTE technologies.

Contact

Skills

Core Skills

5g New Radio (nr)Physical LayerLte3g

Other Skills

EngineeringFirmware DevelopmentTestingWideband Code Division Multiple Access (WCDMA)Computer NetworkingMobile CommunicationsTCP/IPDNSEthernetSIPPythonCMatlabMicrosoft OfficeMicrosoft Excel

About

Senior Engineer with 9+ years of diverse experience in 5G, LTE & 3G design and development. Experienced Physical Layer Firmware developer with expertise on 5G & LTE 3GPP standards and Wireless Communication protocols.

Experience

10 yrs 3 mos

Total Experience

2 yrs

Average Tenure

3 yrs 11 mos

Current Experience

Mediatek

Staff Engineer

Jun 2022 – Present · 3 yrs 11 mos

NR firmware development

Engineering5G New Radio (NR)Physical Layer

Samsung research india institute

Lead Engineer

Dec 2020 – Jun 2022 · 1 yr 6 mos · India

Engineering

Mavenir

Member of Technical staff-II

Jun 2020 – Dec 2020 · 6 mos · Bengaluru, Karnataka, India

Engineering

Mediatek

2 roles

Senior Engineer

Promoted

Jun 2017 – Jun 2020 · 3 yrs

Responsibilities: Ownership of LTE Bit Rate Processing (Control) module - PBCH & PDCCH
Design and development of LTE (Rel 14/15) features: - License Assisted Access (LAA) and E-UTRAN New Radio Dual Connectivity (EN-DC)
Involved in Modem bring-up activities across different Modem generations. (includes Memory management, Interface changes etc.)
Development & modification of code/scripts used for BRP Fw Unit testing, Target testing and JSP Integration testing.
Enhancement & maintenance of existing 3GPP features. (includes Firmware code optimization, Customer issue analysis, internal issue analysis etc.)

EngineeringLTEPhysical Layer

Engineer

Jul 2016 – May 2017 · 10 mos

Responsibilities: Ownership of 3G BRP (Control) Module - R99 and AGCH
Design and development of 3G & LTE features: - Low power Reception (R99), Dynamic Memory Downlaod - LTE & 3G, T+W for 3g.
Development and modification of scripts used for BRP trace capture.
Involved in 3G (BRP) Fw code optimization, Unit Testing, Customer issue support, Target testing etc.

Engineering3GLTE