Jan 2024 – Sep 2025 · 1 yr 8 mos · Bangalore Urban, Karnataka, India · Hybrid

• Lead the thermal architecture team to work on FPGA products - Work with silicon and HW teams on thermally aware FPGA designs for future products; Integrate thermal design into Quartus SW flow; Package TIM and IHS performance studies to choose best path for products; Product and package reliability and their impact on temperature limits; Silicon package characterisation; Customer collateral generation and training; Platform level thermal solutions for future cooling needs (TIM, heat sinks, etc..)

Nov 2004 – Jan 2023 · 18 yrs 2 mos · Bengaluru, Karnataka, India · On-site

• Thermal architect - Programmable solution group (2019 - 2023)
• Work with silicon and HW design teams to analyse impact of IP placement and design; Integrate thermal design flow into Quartus SW for easy customer usage
• Client gaming architect - Concept systems 2015 - 2019
• Conceptualise and design the next gen of gaming systems that can highlight the potential of Intel products and help spur innovation; Develop the first, height adjustable, dual screen gaming system with highest performance in notebook FF; swappable compute brick notebooks; Integrate wearable VR systems with detachable compute and haptic feedback
• System thermal designer - Client 2012 - 2015
• Developed and demonstrated thermal innovation in multiple form factors - first notebook under 10mm with 30W+ cooling capability; dockable phone for enhanced performance; thinnest portable AIO with passive cooling systems; <10mm thick hinge design for AIO systems
• Thermal technology development engineer - Client thermal 2004 - 2011
• Develop, demonstrate and enable new thermal technology for notebooks and laptops - heat pipes, vapor chambers; heat spreaders; fan design; dust mitigation technologies; TIM characterisation and improvement; passive and active air movers

Jan 2003 – Jan 2004 · 1 yr

• Design and development of micro compressors and new product initiatives