Nagarjun Dhoddi

Software Engineer

Tiruvallur, Tamil Nadu, India14 yrs 9 mos experience

Most Likely To SwitchHighly Stable

Key Highlights

10 years of experience in LTE firmware development
Expertise in 3GPP LTE specifications and architecture
Proven track record in debugging and verification

Stackforce AI infers this person is a Firmware Development Engineer specializing in LTE technologies.

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Skills

Core Skills

Firmware DevelopmentLte Physical LayerEmbedded Systems

Other Skills

3GPP R12 LTE SPECDL Receiver DesignFirmware ArchitectureHW ASIC CharacteristicsBit Rate ProcessingUnit TestingHW Design VerificationDebuggingEmbedded DSP Firmware Development3GPP LTE L1MATLABTest StrategiesTest Plan Documentation

About

Bachelors in Communication Engineering from R.M.D.E.C. Having 10 years of experience in developing FW for LTE Physical layer

Experience

14 yrs 9 mos

Total Experience

7 yrs 4 mos

Average Tenure

11 yrs 1 mo

Current Experience

Mediatek

Staff Engineer

Mar 2015 – Present · 11 yrs 1 mo · Bengaluru, Karnataka, India

Work requires study and understanding of 3GPP R12 LTE SPEC 36.211, 36.212, 36.213 related to DL Receiver.
Involved in Design of DL BRP (Outer Receiver) FW Architecture and Interface with Higher layers/Inner Receiver/HW ASICs.
To Understand the characteristic and functionality of HW ASIC, to know its requirements and to decide the FW architecture to efficiently use the HW.
Implementation of LTE R12 Receiver Bit Rate Processing of DL channels PCFICH, PHICH, PDCCH , PDSCH and PBCH.
To verify the Correctness of FW module in internal UNIT test with test vectors Generated in Simulator.
To Verify the Correctness of HW ASIC Characteristics, after Chip Tape-out using HW Design Verification test, which Include Triggering only the HW with Test Vectors.
To Analyze, Debug and fix the issues seen in Different Testing Phases, happening Across the Globe (eg Field Trial with Real Chip, FPGA Simulated HW test).

3GPP R12 LTE SPECDL Receiver DesignFirmware ArchitectureHW ASIC CharacteristicsBit Rate ProcessingUnit Testing+4

Tata elxsi

Senior Engineer

Jul 2011 – Mar 2015 · 3 yrs 8 mos · Greater Chennai Area

3.5 years of experience in Embedded DSP Firmware development for 3GPP LTE
Physical Layer(L1).
1.5 years of experience in the 3GPP LTE L1 Firmware development over Texas Instruments DSP TI TMS 3206670.
3 months of experience in LTE UE Synchronization module development in MATLAB. This involves study of Customer Design documents and implementing in MATLAB.
6 months of experience in 3GPP LTE L1 (Release 8) stack development in MATLAB.
1.4 years of experience in the 3GPP LTE L1 Firmware development over Texas Instruments DSP TI TMS 3206488.
Good understanding in 3GPP LTE Physical Layer (L1).
Worked on Test Strategies and Test Plan documents, generating final Test Reports.