Pavan Kumar G. — Software Engineer

• A highly Self-motivated & Self-managed Individual Contributor, looking forward to understand the Hardware System Architecture and Design to provide an optimum hardware end to end solution for Board / Product Designs in COGS and Performance. • Hardware design experience: System Architecture and High speed board design for Carrier Ethernet and Wireless backhaul devices. • Designed mother board designs using MIPS Microprocessors, FPGAs (Altera and Xilinx) and switch fabrics up to 38 layers of PCB. • Feasibility Analysis: Experience in working with cross-functional teams such as power, thermal, mechanical, regulatory and Signa integrity teams. • Board bring-up, functional testing, EVT, DVT and MVT testing phases covered. • Power supply design: Board level Power supply design using single phase, multi-phase DC-DC regulators and LDOs. • Familiar with EMI/EMC, Compliance, DFM and DFT. • Synchronization techniques: Sync-E, 1588 • Manage complete life cycle of a product- Ideation, delivery and sustenance using Agile and other proprietary tools. • Worked on WLAN technologies like 802.11n and 802.11ac for calibration and production phases. • Schematic entry tools: Dx Designer and Cadence OrCAD Capture, • Layout CAD tools: Candence Allegro for stackup and layout verification. • Optical transceivers: SFP, SFP+, SFP28, QSFP28, CFP2. • Test and Measurement(T&M) instruments: Oscilloscopes, Spectrum analyzers, multimeters etc. • Communication and peripheral interfaces: I2C, PMBus, MDIO/MDC, SPI, DDR, PCI, SPI, XGMII, XFI, XAUI buses

Stackforce AI infers this person is a Hardware Engineer specializing in telecommunications and high-speed digital design.

Location: Bangalore, Karnataka, India

Experience: 12 yrs

Skills

Hardware Design
Printed Circuit Board (pcb) Design
Component Engineering
Design Analysis

Career Highlights

Expert in high-speed board design and hardware architecture.
Proficient in cross-functional collaboration for product development.
Extensive experience in PCB design and validation processes.

Work Experience

Cisco

Hardware Engineer (2 yrs 4 mos)

AMD

Senior Hardware Development Engineer (2 yrs 5 mos)

Tejas Networks

Lead Engineer R&D (11 mos)

Senior Engineer R&D (3 yrs)

L&T Technology Services Limited

Senior Hardware Engineer (1 yr)

Proxim Wireless

Design Validation Engineer (2 yrs 4 mos)

Trainee Engineer (Hardware Design) (11 mos)

Education

BTech - Bachelor of Technology at Guru Ghasidas University

XII at Jawahar Navodaya Vidyalaya - JNV

High School at Jawahar Navodaya Vidyalaya - JNV

at Cisco Networking Academy

Pavan Kumar G.

Software Engineer

Bangalore, Karnataka, India12 yrs experience

Highly Stable

Key Highlights

Expert in high-speed board design and hardware architecture.
Proficient in cross-functional collaboration for product development.
Extensive experience in PCB design and validation processes.

Stackforce AI infers this person is a Hardware Engineer specializing in telecommunications and high-speed digital design.

Contact

Skills

Core Skills

Hardware DesignPrinted Circuit Board (pcb) DesignComponent EngineeringDesign Analysis

Other Skills

EthernetTechnical DocumentationX86Technical RequirementsCommunicationTechnical PresentationsElectronic EngineeringEnglishDesign SpecificationsUSB3.0Digital DesignsElectronic HardwareDebuggingCOGSDDR

About

Experience

12 yrs

Total Experience

2 yrs 7 mos

Average Tenure

2 yrs 4 mos

Current Experience

Cisco

Hardware Engineer

Feb 2024 – Present · 2 yrs 4 mos · Bengaluru, Karnataka, India · On-site

Amd

Senior Hardware Development Engineer

Sep 2021 – Feb 2024 · 2 yrs 5 mos · Bengaluru, Karnataka, India

Complete ownership of complex platform design.
Responsible for circuit design, layout review, SI/PI review, and reliability checks.
Interface with cross-functional teams like Layout, SI/PI, Mechanical/Thermal, FW, BIOS.
➢ Schematic entry tools: Design Entry HDL
➢ Layout CAD tools: Candence Allegro for stack-up and layout verification.
➢ Test and Measurement(T&M) instruments: Oscilloscopes, multimeters etc.
➢ Communication and peripheral interfaces: I2C, PMBus, USB, SPI etc..

Hardware DesignEthernet

Tejas networks

2 roles

Lead Engineer R&D

Oct 2020 – Sep 2021 · 11 mos

Involved in architecture design, Development, Implementation and validation of products.
collaborated with internal and external stakeholder and cross-functional teams to drive key aspect of product solution definition, execution and validation.
Involved in reviews and evaluation of designs and project activities for compliance with systems design and development guidelines and standards, in providing tangible feedback to improve product quality and mitigate failure risk.
monitored new members of team and motivate them to be proactive.

Printed Circuit Board (PCB) DesignEthernet

Senior Engineer R&D

Oct 2017 – Oct 2020 · 3 yrs

Tejas is a telecom equipment manufacturer company established in Year 2000 with a mission to innovate leading edge, high quality, and excellent telecommunication products for its customers.
worked across the different projects to develop innovative products for telecom industry involving innovative technologies.
➢ Schematic entry tools: Dx Designer
➢ Layout CAD tools: Candence Allegro for stack-up and layout verification.
➢ Optical transceivers: SFP, SFP+, SFP28, QSFP28, CFP2.
➢ Test and Measurement(T&M) instruments: Oscilloscopes, multimeters etc.
➢ Communication and peripheral interfaces: I2C, PMBus, MDIO/MDC, SPI, DDR, PCI, SPI, XGMII, XFI, XAUI, GAUI, CAUI.

Component EngineeringDesign Analysis

L&t technology services limited

Senior Hardware Engineer

Jan 2016 – Jan 2017 · 1 yr · Chennai Area, India

L&T Technology Services Limited (LTTS) is a global leader in Engineering and R&D (ER&D) services.
PCB design engineer
➢ Schematic entry tools: Dx Designer, Cadence OrCAD Capture, Design Entry HDL.
➢ Layout CAD tools: Candence Allegro for stack-up and layout verification.
➢ Simulation tools: Hyperlynx.

Design AnalysisTechnical Documentation

Proxim wireless

2 roles

Design Validation Engineer

Aug 2014 – Dec 2016 · 2 yrs 4 mos

Component EngineeringDesign Analysis

Trainee Engineer (Hardware Design)

Aug 2013 – Jul 2014 · 11 mos

Proxim Wireless provides Point-to-Point Point-to-Multipoint and WLAN solutions for wireless internet, video surveillance and backhaul applications.
Mother board Design:
➢ Board bring-up, functional testing, EVT, DVT and MVT testing phases covered.
➢ Power supply design: Board level Power supply design using single phase, multi-phase DC-DC regulators and LDOs.
➢ perform EMI/EMC, Compliance, DFM and DFT.
➢ Manage complete life cycle of a product- Ideation, delivery and sustenance using Agile.
➢ Worked on WLAN technologies like 802.11n and 802.11ac for calibration and production phases.
➢ Schematic entry tools: Cadence OrCAD Capture
➢ Layout CAD tools: Candence Allegro for stack-up and layout verification.
➢ Optical transceivers: SFP, SFP+, SFP28, QSFP28, CFP2.
➢ Test and Measurement(T&M) instruments: Oscilloscopes, Spectrum analyzers, power supllies, Network analyzers, multimeters etc.
➢ Communication and peripheral interfaces: I2C, PMBus, SGMII and RGMII