Boopathy Jayaraman

Product Engineer

Bengaluru, Karnataka, India23 yrs 10 mos experience

Key Highlights

15+ years in semiconductor and systems integration programs.
Expert in 2.5D/3D IC packaging and PCB validation.
Proven track record in Agile/DevOps transformation.

Stackforce AI infers this person is a Semiconductor and Electronics Validation Expert with extensive experience in Agile methodologies.

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Skills

Core Skills

Product ValidationProgram ManagementQuality ManagementProduct Lifecycle ManagementManufacturingComputer-aided DesignPcb Assembly

Other Skills

AllegroProduct EngineeringPhysical DesignEDA3dicChipletAPDProduct DemonstrationStakeholder EngagementContinuous Integration (CI)Team LeadershipCFTProject ManagementIC packagingPrompt Engineering

About

Senior Program Leader with 15+ years driving end-to-end delivery of semiconductor, EDA, and systems integration programs across global teams. Expert in 2.5D/3D IC packaging, PCB and tool validation, enabling silicon-to-system product execution in high-volume environments. Proven track record in Agile/DevOps transformation, program governance, stakeholder alignment, and OSAT/vendor management. Google-certified Project Manager and CSM with strong focus on roadmap execution, automation, and release excellence at scale. Passionate about building high-performance engineering organizations and leading strategic initiatives in advanced packaging and electronic product development.

Experience

23 yrs 10 mos

Total Experience

Average Tenure

Current Experience

Cadence design systems

Senior Principal Engineer - Product Validation

Sep 2009 – Present · 16 yrs 9 mos · Bengaluru · Hybrid

Reviewing the product requirements and specifications for implementing the various new features for the Global EDA Tools.
Owned strategy and deployment of an integrated Allegro PCB Designer – Allegro Package Designer – Sigrity co-design and simulation methodology, enabling concurrent die–package–board development with electrical sign-off.
Exposed to ASIC design flow -RTL, STA, CTS, and Physical Design.
Exposed to Agile software development, CI/CD process and Enterprise Software release process.
Developed competencies across IC packaging, EDA flows, validation methodologies, and hardware bring-up.
Led module design scaling through reusable architecture and methodology development, reducing design cycle time and enabling multi-program deployment.
Specialized in PCB, Advanced IC packaging (COWOS), Chiplet, 3DIC , DFM , SI/PI simulation flows, Board bring up and Post-silicon activities.
Planning for all QA activities like Tesplan, Test Automation , Test strategy for New features, Platform testing(Windows & Linux) ,Regressions for various releases and ensuring release readiness.
Implementing Enterprise AI solutions into the products.
Prioritization of issues and getting them fixed in timely manner.

AllegroProduct EngineeringPhysical DesignEDA3dicChiplet+24

Ge energy connections

Engineer

Dec 2006 – Sep 2009 · 2 yrs 9 mos

Revised the electronic assemblies with necessary ECN and prepared the necessary BOM for manufacturing.
Developed the new electronics module and Re-Engineering the existing electronics module with implementing the latest technology and advanced packaging.
Prepared the schematic diagram, detailed circuit analysis and all engineering technical documents
Performing the testing, Integration, Calibration, Trouble Shooting of PCBs till Component level including both assemblies related and testing related technical problems in manufacturing
Conforming DFM/DFT compliance for the new product design.
.

ReliabilityProduct Lifecycle ManagementAPDECAD -MCADManufacturingTesting+3

Ge energy, hyderabad – india

Lead Engineer

Dec 2006 – Sep 2009 · 2 yrs 9 mos

PCB designing for various IO cards, Data Acquisition board, and Testing the products. Led PCB design and productization efforts for IO cards and data acquisition boards, ensuring compliance with UL, Seismic, and Class standards. Coordinated system planning activities, vendor selection, and production readiness through BOM rationalization and part lifecycle monitoring. Interfaced with mechanical teams to finalize form-fit-function alignment, optimizing designs for production scale-up and serviceability. Managed ECAD library workflows and qualified new vendors for part introduction requests, ensuring compliance with design standards, footprint accuracy, and sourcing feasibility. Implemented design automation flows, earning an “Outstanding” award for improving execution efficiency. Conducted root-cause analysis using DMAIC/DFSS methodologies to enhance product reliability for distributed control systems (DCS) and TMR applications.

Vignani technologies pvt ltd.

Design Engineer

Apr 2006 – Dec 2006 · 8 mos

Component selection, Circuit and PCB designing, Prototyping, testing and proving the functionality.
Re-Engineering the product to current Technologies for miniaturization.
Board Bring up testing & FPGA coding.
Feasibility study, Implementation & documentation.
Interacting with mechanical team for ECAD & MCAD interaction on various projects.

Manufacturing Process ImprovementComputer-Aided Design (CAD)Design for ManufacturingECAD-MCADPrinted Circuit Board (PCB) DesignDebugging+2

Vignani technologies, bangalore -india

Design Engineer

Apr 2006 – Dec 2006 · 8 mos

Supported new product introductions by value-engineering PCBs for miniaturization and ROHS compliance. Performed quality and functionality testing to ensure manufacturability and reliability of re-engineered products.

S k solutions

Project Associate

Aug 2002 – Apr 2006 · 3 yrs 8 mos

Procuring the components & and interacting with various vendors.
Interacting with various vendors for manufacturing & and assembling the boards to bring the product depending on the demand.

PCB Assembly