Mohd Fariz Maarof

Product Engineer

Penang, Malaysia11 yrs experience
Most Likely To SwitchHighly Stable

Key Highlights

  • Expertise in silicon and package test program development.
  • Proven ability to enhance yield and optimize processes.
  • Strong cross-functional collaboration and project management skills.
Stackforce AI infers this person is a Semiconductor Engineering expert with a focus on test program development and process optimization.

Contact

Skills

Core Skills

Product R&dMechanical Product DesignProduction EngineeringMethods EngineeringSemiconductor Process

Other Skills

ATE Hardware DevelopmentValidationCross-functional CollaborationVendor ManagementDesign ValidationFailure Analysis SupportGlobal CollaborationProcess ImprovementTest Program DevelopmentData AnalysisDebuggingProcess ManagementCross-functional Team LeadershipCadence AllegroSemiconductor Process Technology

About

Seasoned professional with comprehensive experience in silicon and package test program development. Expertise spans digital content debugging, yield enhancement, and process optimization. Familiar with ATE test hardware platform development, including PCB schematic and layout validation, and well-versed in end-to-end SMT process engineering. Proven ability to align pre- and post-silicon activities with critical product timelines.

Experience

11 yrs
Total Experience
5 yrs 6 mos
Average Tenure
10 yrs
Current Experience

Intel corporation

3 roles

Product Development Engineer (ATE Test Hardware Development)

Promoted

Jun 2022Present · 3 yrs 11 mos

  • ATE Hardware Development (Sort and Class)
  • Collaborated with cross-functional teams to develop and validate Automated Test Equipment (ATE) loadboards for Intel package and silicon testing.
  • Led working groups to manage and implement ATE loadboard design changes and requests across multiple product lines.
  • Executed hardware board First Article Inspections (FAI) to ensure validation and readiness for high-volume engineering release.
  • Utilized industry-standard software including Argus, Cadence Allegro, and Mentor Graphics for the validation of TIU/SIU layout designs and T-spec files.
  • Managed external vendor relationships from initial engagement to product execution, consistently meeting project schedules.
  • Leveraged expertise in the Advantest V93K CTH handler ATE tester platform.
Product R&DMechanical Product DesignATE Hardware DevelopmentValidationCross-functional CollaborationVendor Management

Product Development Engineer (Factory Tools Development)

Jun 2020Jun 2022 · 2 yrs

  • Factory Tools Development
  • Failure Analysis Support: Employ Intel-standard tools to identify failing pins on the package substrate during various testing phases (Class Test, validation, production), using tester channel numbers for precise physical location.
  • Global Collaboration: Coordinate with cross-functional engineering teams (Product, Production, FA, QRE) across Intel's worldwide facilities to manage product setups and troubleshoot issues.
  • Design Validation: Validate TIU and substrate designs through schematic and layout analysis using Cadence Allegro and Mentor Graphics xPCB Viewer.
  • Process Improvement: Drive collaborative working groups with stakeholders to enhance existing tools and address operational requests.
Product R&DDesign ValidationFailure Analysis SupportGlobal CollaborationProcess Improvement

Product Development Engineer (Sort/Class Test Program Development)

Jun 2016Jun 2020 · 4 yrs

  • Sort/Class Test Program Development
  • Developed, integrated, and validated test programs for Intel Server products, collaborating closely with Content and Module owners (Scan, Array, PLL, Reset, etc.) throughout the development lifecycle.
  • Supported comprehensive testing across both Class Test (unit/package) and Sort Test (wafer) phases within the Manufacturing Validation Engineering division.
  • Delivered production-ready test programs, consistently achieving high yield rates and minimized test times.
  • Standardized and distributed efficient workflows and Best Known Methods (BKMs) to stakeholders, leading to significant test time reductions during first silicon validation.
  • Facilitated pre-silicon mock debug sessions, utilizing learnings from previous silicon stepping failures to prevent recurring issues.
  • Drove product working groups and collaborated with stakeholders on reject validation processes to ensure all Quality Assurance (QA) requirements and timelines were met.
  • Leveraged expertise with Automated Test Equipment (ATE) platforms, including Advantest CMT/HDMX, for both package and wafer level testing.
  • Performed in-depth data and results analysis using specialized tools (Trace, CB, SQLP, Excel) to drive continuous improvement.
  • Executed critical debugging, implemented recovery flows, profiled test instance currents, and resolved pattern/preamble/plist failures to optimize program quality and efficiency.
Product R&DProduction EngineeringTest Program DevelopmentData AnalysisDebugging

Mfs technology (m) sdn. bhd.

Process Engineer (SMT Flexible Printed Circuit)

Jun 2015Jun 2016 · 1 yr · Kawasan Perindustrian Batu Berendam

  • Front-End Production & Process Management
  • Led cross-functional teams in troubleshooting and resolving complex production line issues.
  • Managed full lifecycle of Panasonic pick-and-place machines (NPM-W, CM212, CM313) from programming and startup to troubleshooting and technician training.
  • Translated customer feedback into actionable OPLs and briefings, ensuring process compliance and reducing defect recurrence.
  • Drove significant yield improvements through rigorous machine qualification, preventative maintenance, and dedicated process optimization efforts.
  • Directed technician teams to meet stringent daily/monthly targets for yield, quality, and throughput.
  • Implemented cost reduction activities and improved efficiency through optimized maintenance schedules.
  • Executed through Root Cause and Corrective Action (RCCA) protocols for all FA requests.
  • Back-End Process Control & QA Coordination
  • Orchestrated the introduction of new Jigs through effective coordination with engineering teams.
  • Developed training curriculum and briefed operators on rework procedures.
  • Ensured strict adherence to ESD and grounding standards across the back-end line.
  • Performed advanced X-Ray inspections to verify hidden component solder integrity.
  • Collaborated with QA and QC departments to resolve quality issues stemming from customer feedback.
  • Managed all aspects of Jigs maintenance, cleaning schedules, and vendor relations for procurement and repair.
Methods EngineeringSemiconductor ProcessProcess ManagementCross-functional Team Leadership

Education

Universiti Tun Hussein Onn Malaysia

Electronic Engineering Microelectronics — Microelectronics

Jan 2011Jan 2015

Kolej Matrikulasi Johor (KMJ)

Certificate — Physical Science

Jan 2009Jan 2010

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