Pramod Chandra — CEO
Interested in R&D electronic pakaging activity especially thermal aspects (cooling challenges). My workprofile include design and thermal activities...card level and system level packaging of electronic equipment with focus in heat manangment issues from high dissipating boards, chipset and compact models like AMCs. Specialties: Worked in higly ambitious and challenging assignments such and RRH and GPON, DWDM products. Developed and validated CFD models to optimize thermal performance and electronics cooling, focusing on LRU (Line Replaceable Unit) thermal management. Provided design recommendations based on steady-state and transient thermal simulations, optimizing component placement, airflow paths, and enclosure designs to improve heat dissipation and system stability. Applied heat transfer, thermodynamics, and fluid mechanics principles to design effective thermal management systems and solve complex thermal issues in both new and existing products. Troubleshot and resolved thermal and airflow issues by combining CFD analysis with empirical data, ensuring products met thermal requirements and operational safety standards. Expertly selected and optimized thermal interface materials (TIM), heatsinks, and fans to enhance heat dissipation and ensure efficient thermal management Collaborated with design, testing, and reliability teams to define thermal specifications, integrate thermal insights into product design, and validate performance through testing and simulation data. Led the development of thermal validation test plans (including thermocouple placement), and analyzed experimental data to refine simulation models and improve accuracy. Utilized Python for automating simulation processes, reducing model development time while maintaining accuracy and quality. Delivered clear and detailed thermal simulation reports, presenting findings and design recommendations to stakeholders and cross-functional teams. Currently working in LRU,BPCU AND GCU for various aircraft programs
Stackforce AI infers this person is a Thermal Engineering expert specializing in electronic cooling solutions for aerospace and telecommunications.
Location: Bengaluru, Karnataka, India
Experience: 9 yrs 10 mos
Skills
- Thermal Engineering
- Product Development
Career Highlights
- Expert in thermal management for electronic systems.
- Led development of patented cooling solutions.
- Over 10 years of experience in R&D.
Work Experience
Collins Aerospace
Principal Engineer (2 mos)
Senior Lead Engineer (2 yrs 7 mos)
Centre for Development of Telematics (C-DOT)
Senior Research Engineer (7 yrs 1 mo)
Research Engineer (7 yrs 1 mo)
Education
Master of Technology (MTech) at National Institute of Technology, Tiruchirappalli
Bachelor of Technology (BTech) at Rajiv Gandhi Proudyogiki Vishwavidyalaya
Mathematics at Vikram Higher secondary school, Bhopal, M.P