Rachana Rao — Product Engineer
Currently I’m working at development of logic technology at Intel Technology India(Pvt.) Ltd. I have worked as Process Integration Engineer involve in fabrication and Characterization of GaN HEMTs on SiC in class 100/1000 clean room. I have more than 5 years of clean room experience. My current research interest is in developing GaN HEMT devices for high power and high frequency applications. Prior, I have worked as Project Assistant at Center for Nano Science and Engineering at IISc. During this period I have worked on developing GaN RF HEMTS on Si.
Stackforce AI infers this person is a Semiconductor Engineering specialist with a focus on device fabrication and integration.
Location: Bengaluru, Karnataka, India
Experience: 7 yrs 1 mo
Skills
- Integration Engineering
- Semiconductor Engineering
- Lithography
Career Highlights
- Over 5 years of clean room experience.
- Expertise in GaN HEMT devices for high power applications.
- Strong background in semiconductor fabrication and characterization.
Work Experience
Intel Corporation
Process Integration Development Engineer (10 mos)
AGNIT Semiconductors Pvt Ltd
Process Integration Engineer (3 mos)
Process Engineer (3 yrs 9 mos)
Indian Institute of Science (IISc)
Project Assistant (2 yrs 6 mos)
Education
M.Tech at Dayananda Sagar Institutions
