Dec 2024 – Present · 1 yr 3 mos

Mar 2024 – Dec 2024 · 9 mos

• 1. EDA/CAD:- Leading strong team responsible for delivering EDA solutions from transistor level design to system level designs. This cover all design aspects on transistor level design, RTL2GDS flows, validation methodologies, logic design tools, post silicon/emulation tools/flows/methods. Works very closely with EDA vendors, major fab houses across globe. Responsible for EDA budget management, project management and solution development teams.
• 2. Customer Engineering: Leading a team of HW professionals able to design and debug mobility products powered by Qualcomm technologies. The team got rich experience in the field of application processor, Power Management, RF technologies, RF front end component. This team owns all tier of Qualcomm Snapdragon products and responsible to work with all major OEM/ODM across the globe. Team works closely with all Qualcomm customers for all products in Mobile, Compute, XR, Automotive and IoT markets.
• 3. India Hardware Operations:- Managing this dynamic team which manages all aspects of growth of a site. Team consists of experts in resource management, logistics, govt. affairs, employee engagement, import/export, business intelligence etc. This team orchestrate all site level operations for HW teams span across Bangalore, Noida and Hyderabad.
• 4. PMIC: This team is responsible for system design, circuit design and post silicon aspects of Qualcomm power management solutions getting used in various Qualcomm chipset platforms. This team is responsible for Power Management IC design for Snapdragon processors powering mobile, compute, automotive, XR and IOT platforms
• 5. Post Silicon:- Driving this group of talented professionals doing PTE activities of RF transceivers and electrical validation of high speed digital peripherals

Sep 2019 – Present · 6 yrs 6 mos

• Driving industry-academia partnership to foster innovation and fuel research pipeline in Indian academia. Working closely with top engineering colleges towards talent , research pipeline development

Jan 2019 – Mar 2024 · 5 yrs 2 mos

• 1. Leading ~200 strong team responsible for delivering EDA solutions from transistor level design to system level designs. This cover all design aspects on transistor level design, RTL2GDS flows, validation methodologies, logic design tools, post silicon/emulation tools/flows/methods. Works very closely with EDA vendors, major fab houses across globe. Responsible for EDA budget management, project management and solution development teams. Our developed solutions are bringing quality methods to design all complex technologies and protocols of Qualcomm in cutting edge FinFET nodes.
• 2. Also leading a very large physical design execution team (~300+) responsible for hardening various complexity SoC IPs and cores for latest and complex process nodes. This team takes care of implementing various complexity designs in "netlist to GDSII" mode and ensures that all GDSII are available on time for various Qualcomm SoCs targeting mainstream Snapdragon and adjacent markets. Execution journey of the team consists of innovation, schedule consciousness and on time delivery with high quality. On average team is delivering hard macros for 10+ SoCs per year.

Aug 2017 – Dec 2018 · 1 yr 4 mos

• After setting up a successful world class team on Hardware Application Engineering I took over few more new charters on top. With addition of new charters right now driving a team of ~150 professionals responsible for:
• 1) HW Application Engineering:
• 2) System design and post silicon tests for Power Management Chips
• 3) Post silicon characterization of RF chips for various cellular protocols
• 4) Post silicon testing for all high speed interfaces
• 5) System Level Test infrastructure
• These charters bring a new dimension of system design with cross pollination of ideas from post silicon tuning to commercialization. Team works very closely with Silicon Design (pre and post silicon) of various chips, Software Development (Linux/Android and various others), Product Test Engineering, Product Management, Sales/Marketing ecosystem to drive leadership of Qualcomm products. Worked with all major OEMs/ODMs across the globe making smart devices using Qualcomm technologies. With wide scope of the team we also funnel ideas to SoC planning system to drive features to make future platform robust and better than competitions.

May 2017 – Jun 2017 · 1 mo · Bengaluru Area, India

• Leading a team of HW professionals able to design and debug mobility products powered by Qualcomm technologies. Built the team almost from scratch and right now having 60+ energetic professionals helping in commercializing Qualcomm solution across all world wide customers. The team got rich experience in the field of application processor, base band system, RF technologies, RF front end component and Power Management solutions. This team owns all tier of Qualcomm Snapdragon products and responsible to work with all major OEM/ODM across the globe with special focus on North America, China, India and rest of South Asia. We have successfully commercialized Snapdragon solution for high to low end Smartphones, tablets, cellular and non cellular IoT applications and automotive solutions based on Qualcomm products. Works very close to Silicon Design, Software Development, Product Test Teams, Sales/Marketing ecosystem to fuel the market with smart products.

Dec 2015 – May 2017 · 1 yr 5 mos · Bengaluru Area, India

• Driving a team of 30+ talented hardware professionals responsible for providing all technical support to Qualcomm customer during their product commercialization. This team is responsible for providing technical trainings to all mobile device OEM/ODMs. Apart from that we own technical troubleshooting during design or production phase of customer final product. Team is considered to be best experts in HW, SW and Board Designs on Qualcomm platform who who are considered as true partner for all mobility device manufacturers across the globe. In terms of skillset developed expertise for baseband application procession, multimedia, power management and RF solutions. Working very closely with marketing, engineering and field engineers to deploy Qualcomm solution smoothly across all geographies and all major mobility OEM/ODMs.

May 2014 – Dec 2015 · 1 yr 7 mos · Bengaluru Area, India

• Lead a team of 100+ smart professionals responsible for delivering cutting edge CPU and GPU cores for Qualcomm products. Started with a team of 10 people and started hardening 32 bit multi core ARM subsystem implementation. Delivered CPUs for several mobile products with Fmax target close to the extreme max of process node limit. Later assumed responsibility of GPU physical implementation and deleivered implemented IP for several mobile SoCs. Developed the skillset and grown the team to 100+ members which can deal with several programs simultaneously all the way from PPA definition to final GDS delivery. Worked very closely with EDA ecosystem and drove their product strategies. Developed enough skillset in the team so that team can simultaneously implement these high frequency cores both in Synopsys as well as Cadence platforms. Delivered high performance CPU/GPU for all technology nodes starting from 28LP to 14nm FinFet. Dealt with several types of ARM core hardening starting from A7 to A72. This team is today marked as one of the high performance teams within Qualcomm.

Feb 2013 – Mar 2014 · 1 yr 1 mo · Bengaluru Area, India

• Responsible for developing core multimedia IPs like Camera, Video and Display cores. Firstly developed a team almost from scracth and grown to 30+ member. This high performance team was owning execution of physical implementation for multimedia cores/IPs for several Qualcomm mobile chipsets. Owned all pieces of physical design puzzle starting with power, performance and area (PPA) spec defition to all the way to final GDS delivery. During the course of the execution while exceling on performance team also saved extra area which helped SoC in reducing die size. This team today is high performing team and continuing in delivering multimedia IPs for various products. Dealt with various multimedia architectures and delivered in various process nodes starting from 28LP to lower.