Sridhar Gunnam

Software Engineer

Santa Clara, California, United States9 yrs 10 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • Expert in embedded systems and computer vision.
  • Developed a 360-degree camera system for augmented reality.
  • Proficient in ASIC design and validation.
Stackforce AI infers this person is a specialist in Embedded Systems and Computer Vision for Augmented Reality applications.

Contact

Skills

Core Skills

Embedded SystemsDebuggingComputer VisionAsicVlsi

Other Skills

360-degree camera systemsAugmented RealityBaremetalCC++CMOSClock-tree SynthesisComputer ArchitectureDSPDesign VerificationDigital Circuit DesignDigital Signal ProcessingEmbedded SoftwareFirmwareFloor Planning

About

Experienced in software bring-up, system validation, camera systems, and augmented reality hardware. Areas of interest include Embedded Systems, Computer Vision, and ASIC/FPGA development. Key Words: OpenCV, C, C++, DSP, ASIC, Baremetal, FPGA, Debugging, RTOS, Multi-threading Recent Work: Pre/Post silicon validation, writing c/c++ code for testing chips in emulation. Master's Thesis: Built 360-degree camera Systems and did system-level power and performance characterization. Prev Work: IC Design implementation, including automatic placement and routing, signoff, etc.

Experience

Nvidia

ASIC Design Engineer

Oct 2020Present · 5 yrs 5 mos · Santa Clara, California, United States

Magic leap

VLSI and Embedded SW

Nov 2018Apr 2020 · 1 yr 5 mos · Miami/Fort Lauderdale Area

  • System validation and bring-up
  • Debugging system software
  • Embedded Software Experience
  • Worked on DSP's, General Purpose Cores.
  • Proficient in C, C++, assembly
  • Knowledgable in Electrical Engineering like working with scopes and signal generators and basic circuits.
System validationDebuggingEmbedded SoftwareCC++DSP+1

Arizona state university

Research Assistant at METEOR Studios

Feb 2017Jul 2018 · 1 yr 5 mos · Tempe

  • Generating real-world content for VR is challenging in terms of capturing and processing at high resolution and high frame-rates. The content needs to represent a truly immersive experience, where the user can look around in a 360-degree view and perceive the depth of the scene. The existing solutions only capture and offload the compute load to the server. But offloading large amounts of raw camera feeds takes longer latencies and poses difficulties for real-time applications. By capturing and computing on the edge, we can closely integrate the systems and optimize for low latency. However, moving the traditional stitching algorithms to battery constrained device needs at least three orders of magnitude reduction in power. We believe that the close integration of capture and compute stages will lead to reduced overall system power.
  • We approach the problem by building a hardware prototype and characterize the end-to-end system bottlenecks of power and performance. The prototype has 6 IMX274 cameras and uses the Nvidia Jetson TX2 development board for capture and computation. We found that capturing is bottlenecked by sensor power and data-rates across interfaces, whereas compute is limited by the total number of computations per frame. Our characterization shows that redundant capture and redundant computations lead to high power, a huge memory footprint, and high latency. The existing systems lack hardware-software co-design aspects, leading to excessive data transfers across the interfaces and expensive computations within the individual subsystems. Finally, we propose mechanisms to optimize the system for low power and low latency. We emphasize the importance of the co-design of different subsystems to reduce and reuse the data. For example, reusing the motion vectors of the ISP stage reduces the memory footprint of the stereo correspondence stage. Our estimates show that pipelining and parallelization on custom FPGA can achieve real time stitching.
360-degree camera systemsPower characterizationPerformance characterizationHardware prototypeNvidia Jetson TX2Computer Vision+1

Broadcom limited

IC Design Engineer

Jul 2013Jul 2016 · 3 yrs · Bengaluru Area, India

  • Backend IC design flow - block level work in Floor Planning - Placement - Clock-tree Synthesis - Routing - Design Verification
  • Static Timing Analysis - ECO fixing - Power Analysis (Static and Dynamic IR Drop)
IC DesignFloor PlanningPlacementClock-tree SynthesisRoutingDesign Verification+3

Education

Arizona State University

Master’s Degree — Electrical and Electronics Engineering

Jan 2016Jan 2018

National Institute of Technology Karnataka

Bachelor’s Degree

Jan 2009Jun 2013

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