May 2017 – Jul 2017 · 2 mos · Hyogo, Japan

• Deep Reactive Ion Etching (Minimal)
• Performed experiments on Deep Reactive Ion Etching machine funded by Japanese Government
• Proposed application of Radio frequency and Direct Current through DC electrodes to increase efficiency
• Avoided coupling loss between electrodes and ground by using spacers made of plastic by 3D image printer
• Improved the etch rate for Electrostatic Clamping by 200% from 100nm/min to 300nm/min
• Minimal Wafer and Chamber Temperature
• Replaced match and source generator with one having thermocouple to measure temperature while processing
• Implemented low pass filter to remove noisy Radio frequency signals of source(100MHz) and bias(13MHz)
• Matched source using trimmer capacitor and analysed data which was verified by thermal dots
• Discovered that excess temperature was not a root cause for Minimal shut down at customer’s site

May 2016 – Jul 2016 · 2 mos · Hyderabad Area, India

• Improved noise coupling using Teflon liner in TSVs
• Simulated models using Comsol-Multiphysices with both SiO2 and Teflon AF1600 as liner in TSVs
• Chip level integration using TSVs with Teflon AF1600 as liner material resulted in improved noise coupling
• Performance of TSVs enhanced by 5% compared to conventional SiO2 based liner
• Detection of Ammonia gas using Modified MOS capacitor
• Fabricated Modified MOS capacitor using standard CMOS process flow
• Utilized carbonized polymer film by pyrolysis as insulator in place of metal oxide in modified MOS capacitor
• Implemented X-Ray Diffraction spectroscopy to confirm that residue obtained is amorphous carbon
• Measured capacitance change by Precision impedance analyzer result in successful detection of ammonia gas