Sundarraj Chandran

Software Engineer

Bengaluru, Karnataka, India15 yrs 8 mos experience

Highly Stable

Key Highlights

9+ years in Electronics Thermal Design
Expert in thermal simulation and validation
Led thermal design for multiple storage devices

Stackforce AI infers this person is a Thermal Engineering expert in the Electronics industry.

Contact

Skills

Core Skills

Thermal DesignThermal Validation

Other Skills

ModelingComputational Fluid Dynamics (CFD)FlothermComsolSol gel preparationPresentation SkillsANSYS IcepakHeat and Mass TransferDesign of Experiments (DOE)TeamworkExperimental DesignElectronics coolingANSYS FLUENTPro EResearch

About

9+ years of industry experience in Electronics Thermal design. Proficient in thermal simulation and validation. End to end thermal design support for electronics product from initial design stage to final validation. Supported thermal design of multiple form factor storage devices - microSD/ USB / portable SSD/ M.2 SSD.

Experience

Sandisk

Principal Engineer

Feb 2025 – Present · 1 yr 1 mo · Bengaluru

Western digital

2 roles

Principal Engineer

Promoted

Sep 2020 – Jan 2025 · 4 yrs 4 mos

Thermal design for M.2 SSD
o Steady state and Transient Simulation analysis at the early stages to understand thermal risks and explore possible solutions
o RC matrix extraction to enable system level throttling/performance study
o Thermal Validation of actual drives carried out to confirm if performance/thermal spec is met
o Carried out multiple OEM customers thermal validation test to ensure drive meets customer requirements

ModelingComputational Fluid Dynamics (CFD)Thermal DesignThermal Validation

Staff Engineer

Oct 2016 – Aug 2021 · 4 yrs 10 mos

Thermal design of microSD express card
o Thermal solution implemented at various levels – high conductive substrate, mold compound, placement optimization to realize high power consuming 800MBps microSD card.
o Thermal simulation models for multiple host environments were built enabling thermal behavior estimation of card in use case scenarios
o Thermal solutions suggested at host level for adoption of SD Express cards
Thermal design of USB drives
o Early simulation prediction for new lidset designs reducing thermal risks for final products
o Introduced thermal solutions for power hungry USB Extreme products with 1000MBps performance

Thermal validationFlothermThermal DesignThermal Validation