Kuldeep Sharma

Software Engineer

Chennai, Tamil Nadu, India11 yrs 1 mo experience
Highly Stable

Key Highlights

  • 9.5 years of experience in Application Packaging and Virtualization.
  • Expertise across multiple domains including Banking and Retail.
  • Strong willingness to learn new technologies and domains.
Stackforce AI infers this person is a versatile Application Packaging Engineer with experience in Banking and Retail sectors.

Contact

LinkedIn

Skills

Other Skills

VirtualizationInformation TechnologyApplication PackagingScriptingSystem Center Configuration Manager (SCCM)

About

An Application packaging Engineer with total 9.5 years of experience in Application Packaging and Virtualisation. Worked with different domains like Banking, Retail, Hi Tech, Semiconductors and clients from UK, US. Willing to learn new domains and technology to enhance my skills. Love to Write at my own.

Experience

Astrazeneca

Senior Engineer

Apr 2022 – Nov 2022 · 7 mos

Fiserv

Systems Engineering - Specialist

Sep 2019 – Apr 2022 · 2 yrs 7 mos · Noida, Uttar Pradesh, India

Citixsys - ivend retail

Senior Application Packaging Engineer

Jul 2019 – Sep 2019 · 2 mos

Central board of indirect taxes

Tax Assistant

May 2016 – Jul 2019 · 3 yrs 2 mos · Mumbai Metropolitan Region

  • Worked on handling IT related work and Applications management

Tata consultancy services

IT Analyst

May 2011 – Feb 2016 · 4 yrs 9 mos · Gurugram, Haryana, India

  • Worked as Application Packaging and Virtualisation Engineer on various domains like Retail, Semiconductor, Hi Tech, Banking.

Education

H.R.INSTITUTE OF TECHNOLOGY, MORTA, GHAZIABAD

Bachelor of Technology - BTech — Computer Science

Jan 2006 – Jan 2010

J K G Senior Secondary School

10th Class

Jan 2003 – Jan 2004

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