Sep 2024 – Dec 2025 · 1 yr 3 mos · Austin, Texas, United States · Hybrid

Sep 2023 – Sep 2024 · 1 yr · Tempe, Arizona, United States · Hybrid

• ● Attained proficiency in the fundamentals of solid-state devices, specializing in MOSFET technology, under the mentorship of Dr. Stephen Goodnick.
• ● Spearheaded initial procedures to facilitate meetings and discussions with industrial partner TSMC, ensuring alignment with their specific requirements.
• ● Utilized the Synopsys Sentaurus suite to conduct simulations and analyze silicon FinFET and GAAFET configurations, systematically exploring variations in physical parameters such as gate length, width, roughness, and homogeneity.

Aug 2023 – Dec 2023 · 4 mos · Tempe, Arizona, United States · Hybrid

• EEE 203 - Signals and Systems; assisting students during office hours in labs and homework about signal transformations, convolutions, types of systems, Fourier Transforms, Z Transforms, Sampling, etc.

May 2023 – Aug 2023 · 3 mos · Phoenix, Arizona, United States · On-site

• ● Conducted an in-depth study on the particle count relationship between N4 p-metal gate layer tools and refurbished kits, presenting compelling findings to TSMC directors
• ● Led a FAB-wide Total Organic Carbon (TOC) mitigation project, offering innovative solutions and ideas through rigorous data analysis; recognized as the AMC sponsor of the department
• ● Analyzed Transmission Electron Microscopy (TEM) images of wafers to precisely measure layer thickness post-equipment processes for performance evaluations
• ● Acquired expertise in quality control, inspection procedures, and defects identification, while becoming proficient in key TSMC systems; actively shadowed a senior process engineer for supplemental knowledge
• ● Reviewed technical documentation, including equipment manuals, operating procedures, and training materials, ensuring consistent and accurate use of Applied Materials, ASM, and TEL equipment and processes

May 2022 – May 2023 · 1 yr · Phoenix, Arizona, United States

• ● Immersed in the day-to-day operations of an applications engineer, demonstrating proficiency with sophisticated lab equipment
• ● Collaborated with senior applications engineers on test bench automation, customer ticket completion, and finalizing reports for cross-functional team presentations
• ● Utilized oscilloscopes, logic analyzers, and other tools for troubleshooting, debugging, testing, and code collaboration
• ● Conducted industrial research on existing mobile chargers and refrigerators to identify potential markets for PMIC devices; contributed significantly to the largest multichannel eFuse project to date
• ● Developed a Python and Arduino-based channel combination tester for multi-channel ICs, resulting in a 500% improvement in in-lab chip testing efficiency
• ● Designed and simulated novel PCB using Cadence for external PGOOD and FLT pin implementation in PMIC devices

Sep 2021 – Mar 2022 · 6 mos · Tempe, Arizona, United States

• ● Tested for updates, bugs, inconsistencies, redundancies, improvements on an engineering software
• ● Assisted implementation of Laplace circuit analysis by fixing object representation in parent repository
• ● Worked with professor and graduate students under their mentorship

Aug 2021 – May 2022 · 9 mos · Tempe, Arizona, United States

• ● Assisted over thirty students in their respective teams regarding budget forms, project deliverables, team norms
• ● Training how to use machines, welding stations, band saws, and some principles of 3D printing
• ● Conducted skill sessions about the use of MATLAB, Analog Discovery Kit, and LinkedIn profile/Resume building tips

Apr 2018 – Jun 2018 · 2 mos · Hyderabad, Telangana, India

• A summer internship for human resources organised by Oakridge International School at InsideView