Govind S

Software Engineer

Kochi, Kerala, India4 yrs 9 mos experience

Highly Stable

Key Highlights

Expert in high-speed board design for embedded systems.
Proficient in power architecture development using various regulators.
Experienced in complex hardware involving advanced protocols.

Stackforce AI infers this person is a Hardware Engineer specializing in embedded systems and high-speed board design.

Contact

Skills

Core Skills

Hardware DesignEmbedded Systems

Other Skills

Microprocessor and Microcontroller Based System DesignImage Sensor based Camera board designsVarious Digital and Analog Circuit designsDC-DC Power DesignLayout ReviewSignal Integrity Power IntegrityBoard Bring Up and DebuggingDesign ValidationDDR4LPDDR4LPDDR5eMMCNAND FlashNOR FlashuSD cards

About

4+ years experienced Hardware Engineer (High Speed Board Designer) Specialized in high-speed board design for embedded systems having complex hardware involving Microprocessors (Ambarella Edge AI SoCs), DDR4, LPDDR4, LPDDR5, eMMC, NOR/NAND Flash, uSD storage, image sensors. Experienced in developing power architectures using Switching regulators, LDOs, Load switches. Protocols(PHY):DDR4, LPDDR5/5x, LPDDR4/4x, MMc, PCIe, USB 3.2 Gen1, USB 2.0, MIPI CSI D-PHY, 1G ETHERNET( 1G ), SDIO, PoE++, I2C, SPI, UART, I2S

Experience

4 yrs 9 mos

Total Experience

4 yrs 7 mos

Average Tenure

2 mos

Current Experience

Arm

Senior Engineer (Hardware Design)

Feb 2026 – Present · 2 mos · Bengaluru · Hybrid

Arm Platform design

Vvdn technologies

2 roles

Sr. Hardware Engineer

Sep 2025 – Feb 2026 · 5 mos

Hardware Design Engineer

Jul 2021 – Oct 2025 · 4 yrs 3 mos

Microprocessor and Microcontroller Based System Design with DDR4, LPDDR4, LPDDR4X, LPDDR5, LPDDR5X, eMMC, NAND Flash, NOR Flash, uSD cards, Ethernet RGMII, POE++ etc.
Image Sensor based Camer board designs for camera based products
Various Digital and Analog Circuit designs
Tool : OrCAD Capture CIS
Component Selection
DC-DC Power Design:
LDO, Buck, Boost, Buck- Boost, Flyback converters
Protocols: USB3.2 gen1, USB2.0, 1G Ethernet RGMII, MIPI D PHY, PCIe, PoE++, I2C, UART, SPI, QSPI, SDIO, I2S
Layout Review
Signal Integrity Power Integrity, PDN Analysis
Board Bring Up and Debugging.
Design Validation using Oscilloscope Data, Eye diagrams etc.
Equipment : Multimeters, DSO, MSO, RTP, Bench Power Supply, Current Probes, Electronic Load, Function Generators, Battery Simulators