Chandan Kumar

Software Engineer

Hyderabad, Telangana, India10 yrs 2 mos experience

Most Likely To SwitchHighly Stable

Key Highlights

8+ years in Electronic Product Design and Development.
Expert in Signal, Power, and Thermal Integrity.
Proficient in Firmware Development for various platforms.

Stackforce AI infers this person is a highly skilled engineer in Electronics Hardware and Embedded Systems.

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Skills

Core Skills

Electronics Hardware DesignEmbedded Systems

Other Skills

Signal IntegrityPower IntegrityThermal IntegrityFirmware DevelopmentReliability SimulationsEMI/EMC analysisSchematic AnalysisDerating AnalysisMTBF calculationReliability PredictionMicrosoft OfficePowerPointMicrosoft WordMicrosoft ExcelEnglish

About

8+ years of Experience in Electronic Product Design and Development(R&D), High Speed HW design and Development, PCB Board level Simulations (Hyperlynx, Sigrity, ADS), Signal Integrity, Power Integrity, Thermal Integrity, Firmware Development for microcontroller, processor, FPGA, Reliability Simulstions (PTC Windchill),Derating Analysis, C, Embedded C, C++, PCIe Gen2, SATA Gene, USB3.0, Ethernet, CSI, DSI

Experience

10 yrs 2 mos

Total Experience

3 yrs 4 mos

Average Tenure

4 yrs 5 mos

Current Experience

Qualcomm

Senior Lead Engineer

Nov 2021 – Present · 4 yrs 5 mos · Hyderabad, Telangana, India · On-site

Signal IntegrityPower IntegrityThermal IntegrityFirmware DevelopmentReliability SimulationsElectronics Hardware Design+1

Mistral solutions pvt. ltd

Module Lead - Product Design

Aug 2021 – Nov 2021 · 3 mos · Bangalore Urban, Karnataka, India · On-site

Eldaas technologies pvt. ltd.

Technical Lead Product Design (R&D)

Feb 2016 – Aug 2021 · 5 yrs 6 mos · Bengaluru, Karnataka, India · On-site

Having 5+ years of experience in in Electronics Industry as a Embedded Hardware & Software Development Engineer.
Having good experience in Signal Integrity, Power Integrity, Thermal Integrity and EMI/EMC analysis using Hyperlynx.
Having good experience in Schematic Analysis, Derating Analysis as per MIL-C, MTBF calculation, Reliability Prediction using PTC Windchill software.
Having good experience in Hardware development of Microcontroller, microprocessor and FPGA Boards with High speed interfaces like Pcie Gen2

Signal IntegrityPower IntegrityThermal IntegrityEMI/EMC analysisSchematic AnalysisDerating Analysis+4