Soumen Chakraborty — VP of Engineering
Several years of experience in FW architecture design, system engineering, power optimization, physical layer performance and MIPS optimizations in multi mode modem. Worked on standardization (3GPP, WiMAX) for 4G/5G technologies. Currently leading Modem Firmware Architecture group at Intel. Working on control architecture optimization, MIPS and memory optimization in multi RAT modem. Member of patent review committee at Intel. Leading patent and publication forum, within Physical Layer Group at Intel. 40+ publications and issued/filed patents. 9 Conference/Journal papers Ability to lead teams and also conduct independent work. Proven track record of executing complex engineering projects involving several teams spread across different location. Several years of experience with modem commercialization and customer interfacing.
Stackforce AI infers this person is a leader in Wireless Communications and Modem Technologies.
Location: Bengaluru, Karnataka, India
Experience: 20 yrs 8 mos
Career Highlights
- Led Modem Firmware Architecture group at Intel.
- 40+ publications and issued/filed patents.
- Proven track record in complex engineering projects.
Work Experience
Qualcomm
Senior Director of Engineering (4 mos)
Director, Engineering (6 yrs 6 mos)
Intel Corporation
Technical Director Firmware Architecture (Principal Engineer) (3 yrs 6 mos)
FW Architect (1 yr 7 mos)
Broadcom
Manager (Senior Principal Engineer) , Systems Design (3 yrs 9 mos)
Beceem Communications
Staff Design Engineer (4 yrs 4 mos)
Samsung Electronics
Senior Software Engineer (1 yr)
Education
B.Tech and M.Tech at Indian Institute of Technology, Kharagpur
CBSE at Delhi Public School, Bokaro
CBSE at RKMV Deoghar