Sep 2012 – Jul 2024 · 11 yrs 10 mos · Bangalore

• ❖ Power execution and optimization team manager
• ❖ Currently working as a PPAT (Power Performance and Thermal) team lead responsible for power and thermal execution and optimization for all Qualcomm Snapdragon chipsets on Windows platform.
• 𝑲𝒆𝒚 𝑹𝒆𝒔𝒑𝒐𝒏𝒔𝒊𝒃𝒊𝒍𝒊𝒕𝒊𝒆𝒔 -
• ➢ Building and managing power thermal test team for multimedia & modem technology
• ➢ Power Thermal measurement & breakdown analysis for all Qualcomm Snapdragon chips
• ➢ SW power feature validation & BSP verification via continuous integration & level-based test
• ➢ Thermal skin temperature analysis and optimization, thermal mitigation analysis and optimization.
• ➢ Hours of battery life (HOBL) power impact analysis.
• ➢ Automation Architect for power thermal test framework & tools development
• ❖ Platform test team manager
• ➢ Managed Windows platform test team responsible for validating BSP, RIL (Radio Interface Layer), DATA, PEP (Power Engine Plugin), KPI (Key Performance Index), stability, power & performance on Windows phones and always-connected PCs, based on Qualcomm Snapdragon Premium tier chipsets.
• ➢ Responsible of platform feature validation through continuous integration and level testing. Assuring the BSP quality through various gating at different levels of software development and integration, like BAT (Basic Acceptance Testing) Q1-Q5 ( Quality level gates) and release testing.
• ❖ Manufacturing solution validation for QRD customers.
• ➢ Validation of manufacturing factory solution for Windows Phone OEMs using the Qualcomm Snapdragon Platform. This included testing of software solutions for various aspects like R&D, PCBA testing, MMI testing, Device Provisioning and locking, Service Center and Refurbishment.
• ❖ Telematics test team manager
• ➢ Lead Telematics platform SW test team involved in validating “Vehicle Networks” (CAN/Lin, Ethernet, eAVB, MOST etc) in Qualcomm across Android, QNX and Linux (IVI and Telematics) platforms for Snapdragon (9x28, 9x40 and 9x50) chipsets.

Oct 2011 – Sep 2012 · 11 mos · Bangalore

• ➢ Infosys is operating in Hardware Product Design & Semiconductor Systems services.
• ➢ Our team is responsible for building this group & business.
• 𝑴𝒚 𝒓𝒆𝒔𝒑𝒐𝒏𝒔𝒊𝒃𝒊𝒍𝒊𝒕𝒊𝒆𝒔 𝒊𝒏𝒄𝒍𝒖𝒅𝒆𝒔 -
• ❖ Defining, Creating & Presenting Semiconductor Services offerings to semiconductor OEM & ODM.
• Involves high level buisness & technical discussions with VP, CTO & CEOs .
• ❖ Creating & Developing potential business strategies & opportunities.
• ❖ Developing & Presenting Hardware System Architecture & prototype of the proposed product solution.
• ❖ Hiring, building & Mentoring the team.

Nov 2009 – Oct 2011 · 1 yr 11 mos · Bangaon Area, India, Lund Sweden

• ST-Ericsson, Lund/Bangalore
• Sub Project Manager
• November 2009 - October 2011
• ➢ ST-Ericssion is a major mobile platform vendor in the market, they have legacy EMP platforms like R13/1/2/3, Hassium, and platforms designed for Android, Meego. STE has a regression test site in Lund (Sweden) for platform validation, in the year 2009 STE has decided to move the test site to Bangalore.
• ➢ Cybercom Sweden was handling this site for 5 years in Lund. Cybercom India has taken over the project of moving the test site to Bangalore and continues its operations.
• ➢ Regression testing, test framework, test applications development for Android are major responsibilities of the team.
• ➢ Test areas like Telephony, Core PF, Connectivity, Multimedia, BT etc. are validated.
• 𝑲𝒆𝒚 𝑹𝒆𝒔𝒑𝒐𝒏𝒔𝒊𝒃𝒊𝒍𝒊𝒕𝒊𝒆𝒔 -
• ❖ I was responsible for building the team from scratch and take care of regression test site operations.
• ❖ Project planning and moving operations from ST-Ericsson Lund office to Bangalore office
• ❖ Test network requirements gathering
• ❖ Technical coordination with vendor for test network planning, delivery and validation of test network.
• ❖ Responsible for test orders delivery and technical coordination with development teams.
• ❖ Test framework design and automation object lead.

Oct 2004 – Nov 2009 · 5 yrs 1 mo

• ✔ Interdigital, USA
• Technology Architect
• January 2007 – May 2009 (2 Years 4 Months)
• ❖ Development, integration of InterDigital’s Dual Mode UMTS / GSM / GPRS protocol stack
• The objective of the project is to sustain/enhance the UMTS handset side Layer 1 controller and integrate with other access stratum modules of the project.
• ❖ Also, to provide a high-quality testing support to increase the functional & code coverage, unearth more defects in the existing SW. This project also deals with release activities and ER fixes for URRC and URLC layers. As a part of this project we have fixed many ERs related to URRC e.g: issues related to RRC connection establishment, measurements, BCCH activation time, cell update, cell search, DCH and FACH state related, measurements, Cell search and uncovered may implementation bugs.
• ✔ Texas Instruments, France
• Technology Architect
• October 2005 – December 2006 (1 Years 2 Months)
• ❖ Layer 1 controller Development, Integration Testing for 2G & 3G Multimode Mobile Handset For Texas Instruments
• ❖ The aim of the project is to develop an adaptation layer between TI 2G layer 1 and DoCoMo L2&L3 protocols. So that the integrated solution will be able to perform the common GSM/GPRS Idle Mode functions, GSM dedicated mode functions and GPRS Transfer mode functions
• ✔ Samsung, South Korea
• Technology Architect
• March 2005 – June 2005 (4 Months)
• ❖ I was responsible for functional and system testing of the handset. The testing includes manual testing of different application like Basic voice call, video call, SMS, WCDMA dialup using USB, Bluetooth, IrDA, Phonebook, converter, and settings. And system testing includes performance and power management testing. Reporting bugs to the developers using bug tracking system JIRA.
• ✔ Vodafone, UK
• Technology Architect
• January 2005 – February 2005 (2 Months)
• GSM,GPRS and UMTS Handset Testing

Oct 2001 – Sep 2004 · 2 yrs 11 mos

• GSM/GPRS Protocol Layers Research Engineering
• ❖ Design and Development of MM/GMM/SMSCB protocol layers for GSM/GPRS protocol stack
• ❖ The aim of this project is to develop MM (Mobility Management), GMM (GPRS Mobility Management) and SMSCB on the MS side.
• ❖ The main function of the Mobility Management and GPRS Mobility management sub layer is to support the mobility of user terminals, such as informing the network of its present location and providing user identity confidentiality. A further function of the MM sub layer is to provide connection management services to the different entities of the upper Connection Management (CM) sub layer.
• ❖ SMS provides a means to transfer short messages between a GSM(and GPRS) MS and an SME via a Service Centre(SC). The SC serves as an inter working and relaying function of the message transfer between the MS and the SME. The short message point-to-point service comprise of two basic services: SM MT (Short Message Mobile Terminated Point-to-Point); SM MO (Short Message Mobile Originated Point-to-Point).
• 𝑴𝒂𝒋𝒐𝒓 𝑹𝒆𝒔𝒑𝒐𝒏𝒔𝒊𝒃𝒊𝒍𝒊𝒕𝒊𝒆𝒔:
• 1. Design and implementation of MM/GMM/SMS module on MS side.
• 2. Simulate the network side MM/GMM/SMS module for testing
• 3. Porting the module onto Linux and SBOS
• 4. Integrating the MM/GMM/SMS module with other modules and testing.
• 5. Integrating the MM/GMM/SMSCB module with L1 controller