ArunPrabhu Vijayan

Product Engineer

Bengaluru, Karnataka, India19 yrs 8 mos experience
Highly Stable

Key Highlights

  • Designed MSIM conflict handler for 200 million users.
  • Strong debugging skills in critical Layer-1 issues.
  • Expertise in RF Drivers and Embedded Software Integration.
Stackforce AI infers this person is a Mobile Communications Architect with deep expertise in Embedded Systems and RF technologies.

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Skills

Core Skills

Embedded Systems

Other Skills

Embedded SoftwareC++Technical Project LeadershipDebuggingDevice Drivers3GPPGSMUMTSTCP/IPGPRSTesting3GProtocol StacksMobile DevicesClearQuest

About

Experience Experience in different areas of Mobile Phone Software architecture (MSIM, Embedded Software Integration, RF Drivers, Platform Layer 1 Receiver, Platform wake-up, Multimedia framework, UI & OEM Interface). Current role Presently working as a Radio access unit software architect in Intel Mobile Communications. Core Competency • Designed and developed MSIM conflict handler at RF interface layer for SR-DSDS. Product used by over 200million people around the globe. • Strong debugging skills in solving critical Layer-1 related issues. • Strong RTOS & Embedded Design fundamentals. • Strong Data Structures knowledge(Completed DS Design -1 course in Stanford University) • Work experience in L1 Burst Reception & RF Drivers. • Work experience in DSDS(Dual Sim Dual Standby) • Work experience in Wake-up/Board Bring-up in mobile HW chipsets. • Work experience in Receiver concepts like AFC (Automatic Frequency Correction). • Experience in GSM Platform Layer1 (Receiver control & signal processing side). • Experience in Crash Debugging in T32. • Experience on test equipment like CMW500.CMU200, Agilent8960. • Knowledge of 2G/3G & LTE software/hardware architectures & concepts. • Knowledge in Configuration Management (Clear Case, Perforce, Synergy), Change Request Management, (Clear Quest), tools for SW development. • Experience in Software Integration of Broadcom, QUALCOMM & Intel chipsets to Samsung Phones. • Experience in fixing & analyzing field issues from Protocol Stack (Layer4) to Layer1 in Broadcom, QUALCOMM & Intel chipsets.

Experience

19 yrs 8 mos
Total Experience
4 yrs 6 mos
Average Tenure
1 yr 9 mos
Current Experience

Apple

Senior Firmware Engineer

Sep 2024Present · 1 yr 8 mos · Bangalore Urban, Karnataka, India · Hybrid

Embedded SoftwareC++Embedded Systems

Intel corporation

2 roles

Member Of Technical Staff & Software Architect

Promoted

Mar 2019Sep 2024 · 5 yrs 6 mos

Embedded Systems

RF Driver Engineer

May 2013Feb 2019 · 5 yrs 9 mos

Renesas mobile corporation

Senior Enggineer

Apr 2011May 2013 · 2 yrs 1 mo

  • Working on GSM Layer1 Platform development.

Samsung india software operations

Lead Software Engineer

Sep 2008May 2011 · 2 yrs 8 mos

  • Presently working in SISO(Samsung India Software Operations,Bangalore) as a Lead Engineer in SHP OEM(Protocol Stack Interface,SIM Toolkit Interface,WLAN Interface) Software development for Broadcom21331 Chipsets based Samsung Handsets.

Aricent

Software Enggineer

Sep 2006Sep 2008 · 2 yrs

  • GSM L1 Controller Development & Support in TI Chipsets & Audio/Voice Multimedia frameworks development.Experienced in designing MP3,AAC & MIDI sound drivers for players to suit mobile chipsets.

Education

Birla Institute of Technology and Science, Pilani

Master of Science (MS) — software systems

Jan 2011Jan 2014

Velammal Enggineering College,Chennai

BE — Electronics & Commincation

Jan 2002Jan 2006

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