S S Gupta Kolluru (Naveen)

Product Engineer

Bengaluru, Karnataka, India13 yrs 8 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • 13+ years in Physical Design from RTL to GDS.
  • Proven track record of multiple tape-outs from 90nm to 3nm.
  • Expertise in DXIO, Memory Controller, and SOCs.
Stackforce AI infers this person is a Semiconductor Design Engineer with extensive experience in Physical Design and SoC implementation.

Contact

Skills

Core Skills

Physical DesignPhysical VerificationSoc Design

Other Skills

Power Performance Area (PPA)design optimizationdesign methodologiescustomer design issuestool bugscollaborationDXIOPCIe subsystemSerDesmemory controllerDDRfloorplanningpartitioningplacementCTS

About

13+ years of experience in Physical Design, from RTL to GDS, including formal verification, low power, physical verification, and signoff closure. Proven track record of multiple tape-outs in various nodes (90nm to 3nm). Skilled team builder and collaborator with expertise in DXIO, Memory Controller, SOCs, and Arm cores. Aspire to leverage my expertise in Physical Design to drive innovation and growth in a forward-thinking organization. Continuously learning and growing to achieve excellence in my field.

Experience

13 yrs 8 mos
Total Experience
2 yrs 8 mos
Average Tenure
6 yrs 7 mos
Current Experience

Cadence design systems

Principal Application Engineer

Nov 2019Present · 6 yrs 7 mos · Bengaluru, Karnataka, India · Hybrid

  • Drive design optimization for Power, Performance, and Area (PPA)
  • Develop and implement new flows and design methodologies
  • Identify and resolve the customer design issues and tool bugs
  • Collaborate with PE and RnD to enhance tool capabilities and performance
Power Performance Area (PPA)design optimizationdesign methodologiescustomer design issuestool bugscollaboration+2

Amd

Sr Silicon Design Engineer

Feb 2018Nov 2019 · 1 yr 9 mos · Greater Hyderabad Area · On-site

  • Implementation and signoff for 2 DXIO blocks in PCIe subsystem, interfacing with SerDes
DXIOPCIe subsystemSerDesPhysical DesignSoC Design

Intel corporation

SoC Design Engineer

Feb 2017Feb 2018 · 1 yr · Bengaluru, Karnataka, India · On-site

  • Implementation and signoff for 2 memory controller fabric blocks, interfacing with DDR
memory controllerDDRPhysical DesignSoC Design

Qualcomm inc

Senior Engineer

Feb 2014Feb 2017 · 3 yrs · Bengaluru, Karnataka, India · On-site

  • Implementation and signoff for Always-On Subsystem,DDRM,VCODEC
  • Worked on SoC top-level design: floorplanning, partitioning, placement, and CTS
  • Implementation and signoff for Modem subsystem: Partitioning using tile-flow,budgeting,PNR
floorplanningpartitioningplacementCTSPhysical DesignSoC Design

Einfochips (an arrow company)

Physical Design Engineer

Sep 2012Jan 2014 · 1 yr 4 mos · Bengaluru, Karnataka, India · On-site

  • Implementation and signoff for HMCIF (X-bar interfacing with IO’s and Memory)
  • Implementation of Hierarchical subsystem
Physical Design

Cadence design systems

Intern & Consultant AE

Sep 2011Sep 2012 · 1 yr · Bengaluru, Karnataka, India · On-site

Education

Birla Institute of Technology and Science, Pilani

Master's degree — Microelectronics

Jawaharlal Nehru Technological University, Kakinada

Bachelor's degree

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