R

Ranjeet Mishra

Product Engineer

Bengaluru, Karnataka, India8 yrs 11 mos experience

Key Highlights

  • Expertise in Physical Design and Low Power techniques.
  • Led multiple successful projects in semiconductor design.
  • Strong background in SoC and ASIC development.
Stackforce AI infers this person is a Semiconductor Design Engineer with expertise in Physical Design and Low Power methodologies.

Contact

Skills

Core Skills

Soc Backend EngineeringProject ManagementPhysical DesignLow Power Design

Other Skills

Backend activity planningResource planningData managementProduct specification enhancementPackage assessmentChip protocol exposureFull PD of WIFI-BLE platform ASICFloor-planningLow Power technique designingTiming signoff closureSilicon debugClock Tree planningTiming analysisLow Power solution developmentFull development flow

About

To work with an organization which provides me opportunity for learning and growth in semiconductor, and utilize my capabilities to accomplishment it’s goal.

Experience

8 yrs 11 mos
Total Experience
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Average Tenure
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Current Experience

Texas instruments india

Physical Design Engineer

Apr 2026Present · 2 mos

Texas instruments

2 roles

SoC Backend Lead Engineer

Mar 2024Apr 2026 · 2 yrs 1 mo

  • Led Backend activity of project with 5-member team. Work involved project execution planning & review,
  • resource planning, Data management, responsible for receivables and deliverables across different domain.
  • Work involved discussion with PLM & market team to assess the requirement of product in market. Product
  • spec enhancement in-form of multiple protocol support.
  • Worked closely with Analog (RF), Architect to assess DIE & device PIN requirement, Design and DFT to
  • plan BE requirement and push PPAS goals.
  • Work related to Package assessment like package type selection, ARC rule signoff, ESD signoff, STACK-
  • DIE option validation and IO PAD finalization.
  • Gained exposure of multiple chip protocols like SDIO, SDMMC, SPI, xSPI, UART, I2C, I2S, ADC.
  • Have exposure to paper submission (5)/presentation in TI internal conferences.
Backend activity planningResource planningData managementProduct specification enhancementPackage assessmentChip protocol exposure+2

Senior Physical Design Engineer

Nov 2020Mar 2024 · 3 yrs 4 mos

  • Responsible for full PD of WIFI-BLE platform ASIC end to end closure. Work includes floor-planning &
  • memory type selection, PG resistance estimation, IO placement, CHIP PINOUT feedback generation,
  • CTS spec generation, Clock-QOR optimization.
  • Responsible for full PNR methodology creation of device. Work includes utilization enhancement, DIE area
  • reduction, critical interface IO-MUXING feedback generation, Low Power technique designing, IR-drop
  • handling, switch expansion strategy, IORING area utilization.
  • Expertise in UPF designing for devices and consulted by different business unit for UPF in TI.
  • Designed methodology to solve TI specific Low Power device problem by defining UPF construct. This
  • further get adapted across different business unit in TI.
  • Hands on experience of timing signoff closure technique and methodology development for DRV fixing,
  • IO timing closure strategy, CAD Flow enhancement
  • Involved in silicon debug, RF issue debug, Board level parameter and generating feedback from layout.
Full PD of WIFI-BLE platform ASICFloor-planningLow Power technique designingTiming signoff closureSilicon debugPhysical Design+1

Samsung india

Senior Design Engineer

Dec 2018Nov 2020 · 1 yr 11 mos · Bengaluru, Karnataka, India

  • Responsible for all aspects of Physical Design for Full-chip/Blocks covering Floor-planning, Budgeting, Clock Tree planning & analysis, Placement, Scan reordering/analysis, Clock tree synthesis, Placement optimizations, Routing, Timing and SI analysis/closure, ECO tasks (both timing and functional), EM/IR, DRC, LVS, ERC analysis & fixes, Low Power solution development & implementation.
  • Effective communicator to provide status of the progress with 2 weeks ahead than schedule.
  • Completed PHYSICAL DESIGN/STA of SOC block with 82 memory & 2 PLLs, 1.8m instances, working at 400Mhz with 135k ports & (6000um*400um) aspect ratio in 7nm technology.
  • Expertise in congestion analysis in placement. Develop guides for placement structure using categories blockages. Resolved SCANDEF issues which impact congestion.
  • Expertise in SCAN reordering/analysis and successfully resolve the timing impact of SCANDEF ordered connection.
  • Successfully completed SPINE CLOCK structure for further reduction of latency and skew.
  • Designed and Automated power-plan flow for the project of CLOCK multi-height cells with no IR issues.
  • Completed RDL routing of IOPAD, DECAP cell placement around PLL and power-plan over PLL.
  • Successfully completed TESTCHIP TOP (mainly focused on physical verification and issues) with IO-PAD cell placement and RING power structure development in 8nm technology.
Physical DesignClock Tree planningTiming analysisLow Power solution developmentProject Management

Nxp semiconductors

2 roles

Design Engineer

Jul 2017Dec 2018 · 1 yr 5 mos · Noida, Uttar Pradesh, India

  • Responsible for full development of flow: Floor planning, Bus/Pin Planning, Clock Tree Synthesis, Placement, Optimization, Routing, Parasitic Extraction, Static Timing Analysis, IR drop analysis, Physical Verification and Sign Off
  • Effective communicator to provide status of the progress, problem and solution to management and other engineers
  • Participated in developing methodologies, flow automation and improvements on existing flows to increase productivity.
  • Completed PHYSICAL DESIGN/STA of SOC block with 42 memory, 0.8m instances working at 1.4Ghz in 16nm technology.
  • Successfully executed ECOs of two blocks with functional changes required during MTO. Derived manual clock path for bunch of flops for setup failure fix.
  • Successfully build manual balance tree for CTS which combined H-TREE solution by Synopsys and MULTI-SOURCE TAP point locator with manual script.
Full development flowClock Tree SynthesisStatic Timing AnalysisPhysical VerificationPhysical DesignProject Management

Design Engineer INTERN

Jan 2017Jun 2017 · 5 mos · Noida, Uttar Pradesh, India

  • Trained in physical design/STA (Digital Networking) of SOC development team.
  • Main work focused on clock tree synthesis during internship
  • Familiar with industry standard CAD methodologies from Synopsys and/or Mentor
  • Did many experiment, simulations, analysis on MICA simulator for mesh structure of CTS.
  • Deliver methodology and design flows for simulator tool.

Dkop labs pvt. ltd.

Embedded system and design

Jun 2015Jul 2015 · 1 mo · Noida, Uttar Pradesh, India

  • Here, I learned about micro-controller and its coding. Did many ARDUINO based project.

Education

Thapar Institute of Engineering & Technology

Bachelor's degree

Jan 2013Jan 2017

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