Vinav Patel — Software Engineer
- Hands-on ASIC Physical Design Implementation experience on Fusion Compiler,ICC2 and Innovus. - Involved in 10+ successful physical design tape outs of multi-million gates complex chips of Networking, Graphics and Mobile Processor Chips in 3nm, 5nm, 7nm,16nm and 28nm technologies. - Expertise in ASIC Physical design from RTL to GDSII which includes Floorplan, PnR, Timing Closure, - ECO Implementation , VCLP, Formality, PV and all Sign Off Checks. - Exposure of Full Chip Work, SubSystem or IP Execution, Block Level Execution - Recognized with Pat on Back & Core Value Award for handling the critical blocks and best support in the project execution multiple times within Organization :: PROFESSIONAL SKILLS: - PnR : Innovus, ICC2, Fusion Compiler - STA : Primetime (PT) - Extraction: StarRC - FEV: Conformal - Power Analysis: RedHawk - Physical Verification : IC Validator, Caliber - Scripting Languages: Tcl
Stackforce AI infers this person is a Semiconductor Physical Design Engineer with extensive ASIC expertise.
Location: Bengaluru, Karnataka, India
Experience: 12 yrs 1 mo
Career Highlights
- Hands-on experience in ASIC Physical Design Implementation.
- Involved in 10+ successful physical design tape outs.
- Recognized multiple times for critical project support.
Work Experience
Intel Corporation
Structural Physical Design Engineer (2 yrs 2 mos)
Tech Mahindra Cerium Pvt Ltd
Site Leader Ahmedabad (5 mos)
Project Manager ASIC Physical Design (1 yr 9 mos)
Project Lead Physical Design Engineer (1 yr 3 mos)
Eximius Design
Staff Physical Design Engineer (3 mos)
Senior Physical Design Engineer (1 yr 10 mos)
eInfochips (An Arrow Company)
Senior Physical Design Engineer (9 mos)
ASIC Physical Design Engineer (3 yrs 8 mos)
eiTRA - eInfochips Training & Research Academy Ltd
Physical Design Trainee (5 mos)
Education
Bachelor's Degree at Nirma Institute Of Technology
Diploma Engineer at Nirma Institute of Diploma Studies