P

Paul Morrow

Director of Engineering

Hillsboro, Oregon, United States23 yrs 6 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • Over 15 years of experience in semiconductor engineering.
  • Expert in metrology and magnetic materials characterization.
  • Proven track record in project management and engineering leadership.
Stackforce AI infers this person is a Semiconductor Engineering expert with extensive experience in metrology and materials science.

Contact

Skills

Core Skills

Semiconductor IndustryMetrology

Other Skills

e-beam lithographyphotolithographyion millingmetal depositionmicromagnetic simulationsVSMUHV-STMGMR measurementse-beam evaporationmicro-magnetic modelingXRDManufacturing Operations ManagementProject PlanningProject ManagementEngineering

Experience

23 yrs 6 mos
Total Experience
7 yrs 9 mos
Average Tenure
16 yrs 7 mos
Current Experience

Intel corporation

2 roles

Engineering TD Manager

Promoted

May 2017Present · 8 yrs 11 mos

MetrologySemiconductor Industry

Process Engineer

Aug 2009Apr 2017 · 7 yrs 8 mos

MetrologySemiconductor Industry

Nist

NRC Postdoctoral Fellow

Jul 2008Jul 2009 · 1 yr

  • MSEL/Metallurgy division/Magnetic materials group
  • Fabrication/characterization of magnetic nanostructure arrays for studies of magnetic switching field distributions. Included e-beam and photolithography, lift-off and ion milling techniques, metal deposition, and VSM.
  • Extensive micromagnetic simulations using OOMMF developed at NIST. Included grain- and grain-boundary-dependent magnetic behavior, edge damage due to patterning, and pinning mechanisms.
MetrologySemiconductor Industrye-beam lithographyphotolithographyion millingmetal deposition+2

Rensselaer polytechnic institute

2 roles

Graduate Research Assistant

Promoted

May 2004Jun 2008 · 4 yrs 1 mo

  • Construction of a non-magnetic STM module to be integrated into a pre-existing home-made UHV-STM system. The STM was used for contact giant magneto-resistance (GMR) measurements on free-standing multilayered Co/Cu nanocolumns grown by oblique-angle deposition (OAD).
  • Rebuild of a high vacuum e-beam evaporation system; including disassembly, refurbishing/modification/machining, reassembly, etc.
  • OOMMF (micro-magnetic modeling software provided by NIST) to perform simulations that helped explain the anisotropic magnetic behavior of the samples described in my main project.
  • Other techniques: AFM, VSM, SEM, XPS, RHEED, and extensive use of XRD pole figures for texture analysis of nanostructures grown by OAD. .
  • Software: MS Office, Maple, MATLAB, LabVIEW, C++, Origin, and some Linux-based applications.
MetrologySemiconductor IndustryUHV-STMGMR measurementse-beam evaporationmicro-magnetic modeling+1

Graduate Teaching Assistant

Aug 2002May 2004 · 1 yr 9 mos

  • Physics II Studio: Managed in-class activities, homework, grading, extensive exam reviews, and some lectures.
  • Received the Walter Eppenstein Award (best graduate teaching assistant for an undergraduate course) for 2003.

Education

Rensselaer Polytechnic Institute

Ph. D. — Physics

Jan 2002Jan 2008

Wofford College

B.S. — Physics

Jan 1998Jan 2002

Stackforce found 100+ more professionals with Semiconductor Industry & Metrology

Explore similar profiles based on matching skills and experience