sairam gopavarapu — Software Engineer
Having 6 years of experience in VLSI physical Implementation and timing closure for blocks, subsystem and full chip designs. • very good knowledge on full chip & sub systems PnR closure, tcreation of multiple voltage regions, TMAC Insertions and RDL Routing on critical nets, as per requirements. Efficient in high count macro placement based on data flow diagram. • Skilled at analyzing and solving IR drop & EM issues. • Good at Timing driven placement to improve timing for complex designs. • Experienced with 130nm,55nm,14nm, 7nm,6nm and 5nm Technologies. • Physical Chip Design including Synthesis, PnR, STA and Physical Verification.
Stackforce AI infers this person is a VLSI Physical Design Engineer with expertise in advanced semiconductor technologies.
Location: Hyderabad, Telangana, India
Experience: 8 yrs 5 mos
Skills
- Physical Design
- Vlsi
Career Highlights
- 6 years of VLSI physical design experience
- Expert in timing closure and PnR
- Skilled in advanced technology nodes down to 5nm
Work Experience
Qualcomm
Senior Physical Design Engineer (2 yrs 3 mos)
AMD
Physical Design Engineer (5 yrs 11 mos)
Cypress Semiconductor Corporation
Physical Design Engineer (3 mos)
L&T Technology Services Limited
Physical Design Engineer (3 mos)
Education
B.Tech at Loyola Institute of Technology and Management, Loyola Nagar, Dhulipalla (Village), Sattenapalli (Mandal), PIN-522412(CC-A4)