Daivik Reddy Bhaskar

Product Engineer

United States0 mo experience

Key Highlights

  • Achieved timing closure with WNS < 0.05ns.
  • Reduced dynamic power by 15-20% through optimization.
  • Maintained DRC/LVS clean signoff with high area utilization.
Stackforce AI infers this person is a Semiconductor Physical Design Engineer with expertise in RTL-to-GDSII flows.

Contact

Skills

Core Skills

Rtl-to-gdsiiStatic Timing AnalysisPhysical Design

Other Skills

Synopsys ICC2PrimeTimeStarRCIC ValidatorPower PlanningDRC/LVS SignoffCadence Virtuoso Layout XLCadence VirtuosoParasitic Aware DesignPhysical VerificationFinFET LayoutFrequency SynthesisClock Design28nm UMCParasitic-Aware Routing

About

I'm passionate about full RTL-to-GDSII chip implementation and timing closure in advanced nodes. At ChipEdge Technolgies, I've executed end-to-end physical design on three tapeout-ready SoC projects working in 14nm FinFET and 28nm CMOS technologies. ๐—›๐—ถ๐—ด๐—ต๐—น๐—ถ๐—ด๐—ต๐˜๐˜€: โ€ข Closed timing with WNS < 0.05ns across all three designs (Falcon, JBI, ChipTop) โ€ข Reduced dynamic power by 15โ€“20% through targeted power gating โ€ข Achieved DRC/LVS-clean signoff with 80%+ area utilization on every design โ€ข Hands-on with the full PD flow: synthesis, floorplanning, power planning, placement, CTS, routing, STA, signoff ๐—ง๐—ผ๐—ผ๐—น๐˜€: Synopsys Design Compiler, IC Compiler II (ICC2), PrimeTime, StarRC, IC Validator (ICV); Cadence Virtuoso (Layout XL, PVS) ๐—ฆ๐—ธ๐—ถ๐—น๐—น๐˜€: RTL-to-GDSII, Static Timing Analysis (STA), Place & Route, Clock Tree Synthesis, Power Planning, DRC/LVS Signoff, TCL Scripting ๐—ฆ๐—ฒ๐—ฒ๐—ธ๐—ถ๐—ป๐—ด: Spring 2027 / Summer 2027 Physical Design internships or co-ops. Open to connecting with PD engineers, hiring managers, and recruiters. Feel free to message me directly.

Experience

0 mo
Total Experience
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Average Tenure
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Current Experience

Chipedge technologies pvt ltd

Physical Design Intern

Jun 2024 โ€“ Dec 2024 ยท 6 mos ยท Bengaluru, India

  • Executed full RTL-to-GDSII physical design flow for 3 tapeout ready SoC projects (ChipTop, JBI, Falcon) in 14nm FinFET and 28nm CMOS technologies using Synopsys ICC2, PrimeTime, StarRC, and IC Validator.
  • ๐—ง๐—ถ๐—บ๐—ถ๐—ป๐—ด ๐—–๐—น๐—ผ๐˜€๐˜‚๐—ฟ๐—ฒ: Achieved WNS < 0.05ns across all designs; resolved critical path violations through incremental ECOs, hold buffering, and placement aware optimization using PrimeTime TCL scripts.
  • ๐—ฃ๐—ผ๐˜„๐—ฒ๐—ฟ ๐—ข๐—ฝ๐˜๐—ถ๐—บ๐—ถ๐˜‡๐—ฎ๐˜๐—ถ๐—ผ๐—ป: Reduced dynamic power by 15-20% per design via targeted power gating of idle clock domains; validated savings in PrimeTime-PX with SAIF annotated simulations.
  • ๐—”๐—ฟ๐—ฒ๐—ฎ & ๐—ฆ๐—ถ๐—ด๐—ป๐—ผ๐—ณ๐—ณ: Reduced cell area by ~12% through synthesis optimization and post-route ECO compaction; maintained over 80 percent area utilization with DRC/LVS clean signoff using IC Validator.
  • ๐—™๐—น๐—ผ๐˜„ ๐—ข๐˜„๐—ป๐—ฒ๐—ฟ๐˜€๐—ต๐—ถ๐—ฝ: Hands on across synthesis, floorplanning, power planning, placement, CTS, routing, STA, and physical verification, independently driving each SoC from RTL to GDSII.
Synopsys ICC2PrimeTimeStarRCIC ValidatorRTL-to-GDSIIStatic Timing Analysis

Epitome circuits

Layout Design Intern

Jun 2023 โ€“ Jun 2024 ยท 1 yr ยท Bengaluru, India

  • Built foundational physical design skills through hands on layout, parasitic aware design, and DRC/LVS signoff across 28nm CMOS and 18nm FinFET technologies using Cadence Virtuoso Layout XL, directly applicable to digital PD work in advanced nodes.
  • ๐—ฃ๐—ฎ๐—ฟ๐—ฎ๐˜€๐—ถ๐˜๐—ถ๐—ฐ ๐—”๐˜„๐—ฎ๐—ฟ๐—ฒ ๐——๐—ฒ๐˜€๐—ถ๐—ด๐—ป: Optimized transistor placement and metal routing to minimize parasitic delay and improve signal integrity, the same principles applied during digital PD routing and post route ECO.
  • ๐—ฆ๐—ถ๐—ด๐—ป๐—ฎ๐—น ๐—œ๐—ป๐˜๐—ฒ๐—ด๐—ฟ๐—ถ๐˜๐˜† & ๐—ฆ๐—ต๐—ถ๐—ฒ๐—น๐—ฑ๐—ถ๐—ป๐—ด: Applied coaxial, side wall, and cut layer shielding on critical nets to reduce crosstalk and coupling, which translates directly to SI aware routing strategies in digital flows.
  • ๐—™๐—ถ๐—ป๐—™๐—˜๐—ง ๐—Ÿ๐—ฎ๐˜†๐—ผ๐˜‚๐˜ ๐—˜๐—ณ๐—ณ๐—ฒ๐—ฐ๐˜๐˜€: Designed high density 6T SRAM bit cell in 18nm FinFET; mitigated latch up and LOD effects via guard rings and dummy devices, achieving approximately 12 percent area reduction.
  • ๐——๐—ฅ๐—–/๐—Ÿ๐—ฉ๐—ฆ ๐—ฆ๐—ถ๐—ด๐—ป๐—ผ๐—ณ๐—ณ: Performed iterative DRC/LVS verification at every stage of the layout cycle using Cadence PVS, ensuring foundry compliance and clean signoff, the same discipline required for digital PD signoff.
Cadence Virtuoso Layout XLDRC/LVS SignoffPhysical Design

Education

Rutgers Universityโ€“New Brunswick

Master of Science - MS โ€” Electrical and Computer Engineering

Jan 2026 โ€“ Dec 2027

JSS Academy Of Technical Education Karnataka

Bachelor of Engineering - BE

Aug 2019 โ€“ May 2023

Presidency College, Bangalore

PU โ€” PCME

Jun 2017 โ€“ Mar 2019

Presidency School

Jun 2006 โ€“ Apr 2017

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