VANDNA DHINGRA

Product Engineer

Bengaluru, Karnataka, India10 yrs experience
Highly Stable

Key Highlights

  • Expertise in RTL to GDS-II flow for high-frequency chips.
  • Strong understanding of Physical Design Flow applications.
  • Hands-on experience with advanced EDA tools.
Stackforce AI infers this person is a Backend-focused Physical Design Engineer in the semiconductor industry.

Contact

Skills

Other Skills

Microsoft OfficeLeadershipC++Public SpeakingResearchSocial MediaMicrosoft WordTeachingMarketingCOnline AdvertisingPowerPointTrainingHDL ProgrammingBasic HTML

About

Working as a Back-end engineer for Physical Design department. Have worked on high-frequency chip closure at lower technology nodes (45nm and 16nm). Hands-on practice on the flow RTL to GDS-II using EDA tools. Key Experiences on: - Synthesis : Hands-on experience on Design-Compiler with IP hardening by RTL hacking, reducing power and area at synthesis using SPG and WLM modelling. - Floor-planning : Good grasp of board-level requirement and thus understanding logical connectivity s so as to prepare a refine placement stratergies - Placement and Routing : Worked on TIMING vs CONGESTION trade-off for SoC with huge logic size and attained successful closure. Awareness of CCD and NON-CCD flow at CTS and knowledge of building standalone H-TREE. - EDA capability: Design-Compiler( Synopsys ), STAR RC, Innovus( Cadense ), ICC2 ( Design Planning) - Strong understanding of Physical Design Flow and its correct applications - Knowledge of TCL based scripting and flow development. - Always Interested to learn more and become more efficient. - Strong interpersonal, communication and management skills. - Strong debugging and problem solving skills

Experience

10 yrs
Total Experience
1 yr 11 mos
Average Tenure
10 mos
Current Experience

Arm

Staff Engineer

Aug 2025Present · 10 mos · Bangalore Urban, Karnataka, India · On-site

Google

ASIC Physical Design Engineer

May 2022Jul 2025 · 3 yrs 2 mos · Bengaluru, Karnataka, India

Qualcomm

2 roles

Senior Engineer

Promoted

Oct 2020Apr 2022 · 1 yr 6 mos

  • Physical Design Engineer

Engineer

Feb 2019Oct 2020 · 1 yr 8 mos

  • Physical Design Engineer

Nxp semiconductors

2 roles

Design Engineer

Jul 2017Jan 2019 · 1 yr 6 mos

  • Working as a Back-end Engineer in the Physical Design department of Digital Networking Department. Working on RTL to GDS-II flow for high-frequency chips at 16nm technology node.

Intern

Jan 2017Jun 2017 · 5 mos

  • Worked as an Intern at NXP Semiconductors, Noida. As a Back-end Engineer in Digital Networking- Physical Design Department. I learned about SoC developement, Planning, Routing, STA. And gained complete understanding of RTL-GDSII flow and later undertook session on the same for the new-joiners.

Wipro

Summer Intern

Jun 2016Aug 2016 · 2 mos · Ahmedabad

  • The training involved learning about implementation of surveillance systems (Camera, Servers, Software etc), use of SMPS boxes, real time application of switches and routers in various projects by Wipro. Training also involved study of arrays of backup batteries for switches and routers and implementation of access control mechanisms. Apart from technical know-how some basics of Project Management and a study of RFP was undertaken during the training.

Ec-organiztion

President

Aug 2015Aug 2016 · 1 yr

  • It Included Management, Marketing, Networking, Organizing Events etc

Iste students association-itnu

Marketing Head

Apr 2015Mar 2016 · 11 mos · Nirma University

Education

Nirma Institute Of Technology

Bachelor of Technology (B.Tech.)

Jan 2013Jan 2017

MAHESHWARI VIDYAPEETH

SSC — SCIENCE

Jan 2009Jan 2013

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