VANDNA DHINGRA — Product Engineer
Working as a Back-end engineer for Physical Design department. Have worked on high-frequency chip closure at lower technology nodes (45nm and 16nm). Hands-on practice on the flow RTL to GDS-II using EDA tools. Key Experiences on: - Synthesis : Hands-on experience on Design-Compiler with IP hardening by RTL hacking, reducing power and area at synthesis using SPG and WLM modelling. - Floor-planning : Good grasp of board-level requirement and thus understanding logical connectivity s so as to prepare a refine placement stratergies - Placement and Routing : Worked on TIMING vs CONGESTION trade-off for SoC with huge logic size and attained successful closure. Awareness of CCD and NON-CCD flow at CTS and knowledge of building standalone H-TREE. - EDA capability: Design-Compiler( Synopsys ), STAR RC, Innovus( Cadense ), ICC2 ( Design Planning) - Strong understanding of Physical Design Flow and its correct applications - Knowledge of TCL based scripting and flow development. - Always Interested to learn more and become more efficient. - Strong interpersonal, communication and management skills. - Strong debugging and problem solving skills
Stackforce AI infers this person is a Backend-focused Physical Design Engineer in the semiconductor industry.
Location: Bengaluru, Karnataka, India
Experience: 10 yrs
Career Highlights
- Expertise in RTL to GDS-II flow for high-frequency chips.
- Strong understanding of Physical Design Flow applications.
- Hands-on experience with advanced EDA tools.
Work Experience
Arm
Staff Engineer (10 mos)
ASIC Physical Design Engineer (3 yrs 2 mos)
Qualcomm
Senior Engineer (1 yr 6 mos)
Engineer (1 yr 8 mos)
NXP Semiconductors
Design Engineer (1 yr 6 mos)
Intern (5 mos)
WIPRO
Summer Intern (2 mos)
EC-Organiztion
President (1 yr)
ISTE STUDENTS ASSOCIATION-ITNU
Marketing Head (11 mos)
Education
Bachelor of Technology (B.Tech.) at Nirma Institute Of Technology
SSC at MAHESHWARI VIDYAPEETH