Nov 2020 – Sep 2022 · 1 yr 10 mos · Bengaluru, Karnataka, India

• Working on Clarity™ 3D Solver: 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on Chip (SoC) designs.
• Working on Celsius™ Thermal Solver - industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures.

Jun 2018 – Nov 2020 · 2 yrs 5 mos

• Serving as an Field Application Engineer - Mentor Graphics India, A Siemens Business under PCB Technical Organization. Having a special focus on PCB analysis tools covering signal and power integrity, DDR, SERDES and 3D Electromagnetic Simulation and basic knowledge of core PCB tools and methodologies.
• Contribute to the success of Mentor Graphics by increasing customer satisfaction and productivity with Mentor Graphics' PCB analysis tools.
• Support and resolve all HyperLynx signal and power integrity software issues of our customers.
• Developing and delivering technical training on new features and product updates
• Tracking and updating customer issues using defined Mentor Graphics processes and tracking tools.
• Developing Technical content for Mentor's knowledge base.
• Communicating customers’ technical requirements as well as customer issues to the Product Team. This will include an understanding and communication of the urgency and impact of these issues on the product and sales teams.
• Involve and drive the Tool evaluation/benchmark; Technical product presentations; Methodology review; Tool deployment and adoption; drive competitive replacements, provide support to customers during critical project implementation phases.
• Work with the Technical account manager and worldwide account teams for forming strategies and successfully driving Mentor Graphics tools inside customer projects to enable business success for Mentor Graphics

Mar 2017 – Jun 2018 · 1 yr 3 mos

• Roles and Responsibilities:
• Responsible for Corporate Application Engineering (CAE) activities in the PCB System Design Analysis and Manufacturing
• Expertise on high-speed board design issues, signal-integrity (SI) and Power-integrity (PI) analysis and debug, techniques to solve SI/PI issues on boards
• From a technical stand-point, understanding customer needs, involve and work with their projects for using right methodologies and Mentor Graphics tools for successful project completion
• Involved and drive the Tool evaluation/benchmark; Technical product presentations; Methodology/flow development and review; Tool deployment and adoption; drive competitive replacements, Provide support to customers during critical Project delivery phases.
• Worked with Technical Account manager and World Wide account teams for forming strategies and successfully driving Mentor Graphics tools inside customer projects to enable business success for Mentor Graphics
• Provided training and technical support to customers using Mentor Graphics tools
• Worked on medium to complex multi-layer printed circuit boards & Hands-on experience on PCB schematics, layout, simulation and Analysis of high speed digital, mixed-signal or RF circuits

Jun 2012 – Mar 2017 · 4 yrs 9 mos · Bengaluru Area, India

• Roles and Responsibilities:
• Helped to drive Cadence SPB pre-sale business activities in the areas of High-Speed PCB/Package CAD Design (HW/Layout), System Analysis (SI/PI/EMI/Thermal) and Manufacturing using Allegro & Sigrity tools at various multiple customers place with techno-commercial stand-point by understanding customer needs & addressing gaps.
• Pre-sale, Post-sale, Proliferation, early adoptions activities through Technical product presentations & demonstrations; Methodology/flow development, evaluation/benchmark, Tool deployment and adoption, drive competitive replacements. Creation of innovative Govt. Tender technical specifications, documentation, Tool Training's and workshops.
• Worked collaboratively with sales team, marketing team, and R&D teams.
• Published solution Articles in knowledge content.
• Delivered Allegro & Sigrity Technology Seminars presentations and demonstrations to promote and create demand in the market.
• Participated in Conferences CDNLive, Trade shows and Seminars.
• Technical Skills:
• Worked on medium to complex multi-layer, High-speed, RF, Rigid-flex and Embedded boards.
• Hands-on experience on Design entry schematics, PCB layout, SI / PI / EMI / Thermal simulations & Analysis of high speed digital, mixed-signal or RF circuits.
• Got exposure to PCB manufacturing process, DFM issues.
• Worked on high-speed board design issues, signal-integrity (SI) and Power-integrity (PI) analysis and debug, techniques to solve SI/PI issues on boards, Memory interfaces (DDR’s) & SERDES simulations.
• Working knowledge on Allegro & Sigrity platform tools OrCAD Capture CIS, PSpice – AMS simulation, Allegro Design Entry HDL, Allegro PCB Editor, Analog/RF designs/ Miniaturization, SpectraQuest, Sigrity SI Base, Sigrity PI Base, Sigrity PowerSI, Sigrity 3DEM, Sigrity PowerDC, Speed2K, Sigrity SystemSI – Parallel Bus Analysis & Serial Link Analysis, Sigrity OptimizePI, Sigrity T2B and Sigrity XtractIM, Co-design, IP Design kits knowledge.