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Dilip Kashyap

Product Engineer

Bengaluru, Karnataka, India12 yrs 1 mo experience

Key Highlights

  • Expert in power and signal integrity analysis.
  • Led advanced packaging initiatives for tier-1 clients.
  • Developed innovative solutions leveraging machine learning.
Stackforce AI infers this person is a Semiconductor professional specializing in power and signal integrity analysis.

Contact

Skills

Core Skills

Power IntegritySignal IntegrityGigabit Ethernet

Other Skills

RedhawkTotemHSPICEAdvanced Packaging3DICVoltusLPDDRPCIeDDRInterface IPMIPIPower-over-CoaxConnectorsSimulationsEMIR

About

Semiconductor professional with experience in the field of signal and power integrity across multiple domains(Data Server, Interface IP, and Automotive) • System-level Signal Integrity of serial and parallel interfaces (3D-EM extraction and optimization of interconnects leveraging machine learning solutions, channel simulation with equalization, timing analysis with SIPI co-simulation) • System and chip-level power integrity at leading edge nodes till 18A (MiM optimization, CPM/CMM generation, power gate modelling, jitter transfer function accounting PSIJ, time and frequency domain correlation for complex multi-PHY configurations up to 16DDR5 instances on a single package) • Multi-die full system power delivery analysis i.e., VR+PCB+PKG+Interposer+Die(s) (early rail analysis till sign-off, Static and Dynamic IR drop, CPM/die-model generation for stacked dies, PGV generation, PCB/PKG decap optimization, temperature aware DC Drop analysis for PCB/PKG) EDA: Voltus, Totem, Redhawk-SC, Ansys EM-suite, Keysight ADS, Sigrity EM suite, HSPICE, and Spectre.

Experience

12 yrs 1 mo
Total Experience
2 yrs
Average Tenure
1 yr 10 mos
Current Experience

Intel corporation

Power Integrity Lead

Jun 2024Present · 1 yr 10 mos

  • Power Delivery for high speed IPs based on I18A/I3 nodes and SoC System Integration
RedhawkTotemHSPICEPower Integrity

Cadence design systems

Principal Solutions Engineer - 3DIC/SIPI

Apr 2022Jun 2024 · 2 yrs 2 mos · Bengaluru, Karnataka, India

  • SIPI Lead focused on 2.5D/3D-IC for Strategic Accounts(marquee/tier-1 customers), Solutions Engineering Group
  • Owned below (primary) responsibilities:
  • EMIB (2.5D-IC) reference flow for HBM - PI
  • Intel’s Atom core (3D-IC) flow- PI
  • Machine learning based optimization of Interposer cross-section - SI
  • Help build a team in India for advanced packaging
Power IntegrityAdvanced Packaging3DICSignal IntegrityVoltus

Synopsys inc

Signal and Power Integrity Engineer - II

May 2020Apr 2022 · 1 yr 11 mos · Bengaluru, Karnataka

  • Signal and Power Integrity Engineer for DDRx/LPDDRx/PCIe IP (Solutions Group)
Power IntegrityLPDDRSignal IntegrityPCIeDDRInterface IP

Aptiv

Electrical Analysis Engineer-Signal and Power Integrity

Sep 2019Apr 2020 · 7 mos · Bengaluru Area, India

  • SI/PI Engineer for Advanced Safety and User Experience (ASUX) Hardware Ops Group
  • (formerly Delphi/General Motors)
Power IntegrityLPDDRSignal IntegrityMIPIPower-over-Coax

Molex

Electrical Engineer

May 2017Aug 2019 · 2 yrs 3 mos · Bangalore

  • Part of DSS-PCB-SI Group – Copper Solutions Business Unit, supporting 100G ethernet solutions
Gigabit EthernetConnectors

Tata consultancy services

System Engineer

Dec 2013Apr 2017 · 3 yrs 4 mos · Bangalore

  • High Speed Digital Engineer for:
  • Motorola Solutions(Zebra Technologies Corp.)
  • Danaher- Hach Lange GmbH
  • Cisco- Edge Routing Business Unit (ERBU)

Education

B. V. Bhoomaraddi College of Engg. & Tech., Hubli

B.E — Electronics and Communication

Jan 2009Jan 2013

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