VIGNESH M — Software Engineer

I am an Electronics Engineer specialized in design and development of SoC's & Hardware boards for various applications. ✓ 7+ years of experience as a HW/PCB and IC Package Design Engineer with SI/PI Analysis expertise. ✓ Complete knowledge of Hardware Product Life Cycle Management. ✓ Expertise in component selection, BOM optimization and Schematic Design. ✓ 1+ years of experience in Signal and Power Integrity. ✓ IR drop and PDN analysis for the Core and SerDes powers. ✓ Have designed High speed interfaces such as LPDDR5, USB3.0, PCIe, CSI, DSI, UART and SPI. ✓ Have strong knowledge in DFA, DFM and DFT processes & requirements. ✓ Have designed Up-to 14 Layers HDI Design with Laser via technology and up-to 52 Layer with TH via technology. ✓ Strong experience in routing feasibility to finalize the BGA pin maps for SoC. ✓ Strong experience in handling up to 0.35mm Pitch HDI designs with Analog, Digital and Mixed signals, RF signals. ✓ Have strong expertise to handle the design for Mobile, Compute and Wearables. And ATE platforms with uFlex and s93k testers for Load Board/DIB and Probe Card designs. Tools Used : Schematic : OrCad Capture, Layout : Cadence Allegro and Xpedition Gerber Check : CAM350, Valor NPI, Simulation : Power SI, Power DC, Sigrity Lab Tools : DMM, Spectrum Analyzer, Oscilloscope.

Stackforce AI infers this person is a skilled Electronics Engineer specializing in hardware design and development for high-speed applications.

Location: Palghat, Kerala, India

Experience: 6 yrs 9 mos