H

Hemant Jain

Software Engineer

Bengaluru, Karnataka, India25 yrs 6 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • Over 20 years of experience in semiconductor design.
  • Led teams on ASIC development generating over $1 billion in revenue.
  • Expert in physical design methodologies across multiple process nodes.
Stackforce AI infers this person is a Semiconductor Design Expert with extensive experience in ASIC and physical design.

Contact

Skills

Core Skills

Physical DesignPower DeliveryIntegrationAsicChipset DesignAnalog DesignCircuit DesignDigital DesignVerification

Other Skills

Floor planningAuto placement and routePhysical verificationPower Delivery networkPower gating designDesign of RDL layersTape-in and tape-outHierarchical partitioningBus/Feedthrough planningPower, DFM, DFD implementationTape-outPower implementationMethodology developmentIR/EM analysisPower grid design

About

Proven senior level design engineer expertise with more than 20 years of experience in the development of high quality, mass market products in the processor , chipsets and Consumer Electronics industry. My goal is to seek a responsible and challenging position in a technology driven company and use my experience to lead a team of world class engineering professionals who can deliver technology and products of the future. Achievements: * Leading/working with geographical distributed teams on the ASIC development activities. * Responsible for the Tape-out of the products generating revenue of $1billion dollar plus * Contributed significantly into methodology for the product design. Specialties: * Immense experience in all stages of the physical design of processor graphics, chipsets and SOCs * Expertise in the various process technologies ranging from 250nm to 14nm * Expertise in the industry standard tools from Synopsis, cadence,mentor, etc. * Overall experience of full design and development from RTL coding, RTL verifcation, Analog circuit design and Physical design. * In depth knowledge gained in the Floorplan, Power Delivery network, Power gating and Integration of Complex Large Design like Chipsets, Graphics.

Experience

25 yrs 6 mos
Total Experience
12 yrs 9 mos
Average Tenure
19 yrs 11 mos
Current Experience

Intel corporation

5 roles

Principal Engineer

Promoted

Jan 2022Present · 4 yrs 4 mos

Floorplan and Integration Lead

Jan 2017Jan 2022 · 5 yrs

Senior Technical Lead

Apr 2015Jan 2017 · 1 yr 9 mos

Lead Graphics Design Engineer

Promoted

Apr 2010Mar 2015 · 4 yrs 11 mos

  • Experienced in project planning, setting strategies, cross site execution and Stakeholder management
  • Mentored a large team and delivered successful products
  • Responsible for the leading the floor plan, auto place and route and the physical verification of the graphics a(GMCH) and the Processor Graphics
  • Completed Projects includes world class processor integrated graphics - Intel HD Graphics and Intel Iris graphics code named Haswell, Ivybridge, Sandybridge.
  • Specialist in the Power Delivery network, Power gating design and implementation, and Design of the RDL layers.
  • Working knowledge of ESD planning.
  • Core competencies are the Floor planning, Auto placement and Route, Physical Layout Verification, Integration and expertise in the Tape-out at the process nodes ranging from 90nm to 14nm
  • Currently I am floorplan & integration lead for the Intel's next generation processor graphics in 14nm process technology.
Floor planningAuto placement and routePhysical verificationPower Delivery networkPower gating designDesign of RDL layers+2

Senior Component Design Engineer

Apr 2006Mar 2010 · 3 yrs 11 mos

  • Responsibilities includes the diesize commitment/exploration, and understand the graphics architecture for optimal floorplan.
  • The responsibilities include the tape-in and tape-out of the chipset product & Processor Graphics and productize it.
  • Completed chipsets include the Crestline (Santa-Rosa Platform), Cantiga (Montevina platform) and Ironlake (Calpella Platform) chipsets
  • Responsibilities includes hierarchical partitioning into sections/partition, driving the optimal pin placement while interacting with section owners and partition owners, Bus/Feedthrough planning to get optimal timing/routability.
  • Implementation of all the power, DFM, DFD and other process requirements to meet the yield targets.
Tape-in and tape-outHierarchical partitioningBus/Feedthrough planningPower, DFM, DFD implementationASICPhysical Design

Genesis microchip / sage inc.

3 roles

Member of Technical Staff Physical Design

Jul 2003Mar 2006 · 2 yrs 8 mos

  • Worked on several projects in the physical design:
  • + 130nm ASIC Burbank (first 130nm design for GNSS)(DTV/LCD monitor chip)
  • + Physical design of 180nm ASIC (Insam) (multi function monitor display chip)
  • + IR/EM analysis of the various 180nm asic like Hudson, Tuscon, frontier and phoenixU monitor SOC.
  • Responsiblity
  • + Productization of the chip involving the methodology development and flow development for the physical design.
  • + Developed make-flow using the synopsys tools PC and Astro to perform the physical synthesis and routing.
  • + Worked on the floorplan, power grid design,CTS,routing, extraction,DFM implementation,IR/EM analysis.
  • + IO ring design to meet the Power delivery/ESD requirement and IR/EM requirement of the chip.
  • + Integration of analog macros while understanding requirements of the gaurd-rings, substrate noise, ESD, etc
  • + Physical verification Antenna/LVS/DRC/DFM using teh Calibre.
  • + Development of utility runsets in calibre for example to find floating gates in design.
  • + Implementation of the ECOS, development of the metal eco methodology, decap estimation/addition and design of decap cells.
  • + Library collaterals verification and Library preparation of the macros.
Physical designMethodology developmentIR/EM analysisPower grid designPhysical DesignASIC

Member of Technical Staff Analog Design

Promoted

Aug 2001Jul 2003 · 1 yr 11 mos

  • LVDS Receiver in 0.13um technology10 Bit, 108Mhz High speed LVDS Receiver
  • Responsibilities: Architecture, Design, simulation, and integration of LVDS receiver. The individual blocks involved are Analog front end – input buffer /equalizer amplifier, sampler and Phase locked loop for high speed clock (800Mhz) generation and right sampling phase recovery and serial to parallel converter. The challenge involved is to generate right sampling phase for perfect data recovery, eye - equalization of received data and sampling of data.
  • Mini-LVDS, LVDS & RSDS Transmitter integrated in
  • TSMC 0.18um LogicTechnology :To drive the column drivers on the Flat Panel Monitors: Design, simulation, integration, layout and physical design, LVS and DRC check of Mini-LVDS and RSDS and integration of LVDS, Mini-LVDS and RSDS in a single integrated solution to achieve better performance and reduction in area. The challenge was involved in generation of the high-speed clocks for a wide range of frequencies accurately for serialization on the dual edge of the clock. The another challenge was to have integrated driver for the Mini-LVDS, RSDS and LVDS which can do high speed (250Mhz to 1.65Ghz) drive up to 10m of cable length accurately with varying eye opening requirements for the macro (150mv to 900mv).
  • DVI Transmitter for 0.18um Technology:It consists of a 10:1 parallel to serial converter, a PLL which gives clock to the Serializer, Output driver and Band-gap reference circuit. The challenge involved in was to serialize input data (25 MHz to 165 MHz) to 10 times speed (250 MHz to 1.65 GHz).
  • Responsibilities: Involved in design of architecture, design and integration of circuits, simulation of circuits, and layout using Cadence Virtuoso, LVS and DRC using Calibre and Hercules.
  • Band-gap reference circuit for 3.3v, 0.18um Responsibilities:Schematic Capture was done using Virtuoso schematic composer and layout was done in Virtuoso layout editor, simulations was done using hspice.
Architecture designSimulationIntegrationLayout designAnalog DesignCircuit Design

Member of Technical Staff Front End Design

Aug 2000Aug 2001 · 1 yr

  • Digital Capture PLL:Clock Recovery circuit for data capture on front end.The main challenge was to transfer the design from 0.25um design into 0.18um technology.
  • Responsibilities: Modeling of the individual blocks of PLL in Verilog.
  • Flamingo (FLI2300):A de-interlacer, scaler, and enhancer (Digital Format Converter) chip for TV and DVD segment.
  • Responsibilities:
  • + Handled the verification of vertical scalar, Frame Rate Converter (FRC) and the SDRAM Controller. The SDRAM controller has 2 write clients and 8 read clients and has bandwidth of 160 MHz.
  • + Developed the pseudo clients (de-interlacer and Vertical Scalar) in Verilog for the SDRAM controller to verify it. Designed the Interface for the memory (64x40 RAM and 64x32 RAM) with the vertical scaler, horizontal scaler and The external host (ex. Micro-controller or I2C).
  • + The integration of the memory controller into the full chip and verified it.
  • + Designed the double buffering module for the critical registers in the chip, which normally involves in the mode change of the chip by the users.
  • Integrated the double buffering module and verified in the full chip.
  • + Designed the frame rate conversion bypass mode that involves choice of FIFO and interface of FIFO with Vertical Scalar and integrated it.
  • + Full chip netlist simulation of flamingo by NC-Verilog and Verilog-XL.
  • Jag2S: Display Processor with a Timing Controller targeted for LCD monitors.
  • + Verification of scaler and Design of the transition minimization block to be used for minimizing the transitions on a 48 /24/18 bit wide bus to be interfaced with the LCD panel.
  • Responsibilities:
  • Synthesis and physical design of the Micro-controller core to target Xilinx Vertex Series FPGA for verification of the core.
ModelingVerificationSynthesisPhysical DesignDigital Design

Education

Birla Institute of Technology and Science, Pilani

Master of Science - MS — Microelectronics (CGPA 9.86/10)

Jan 2003Jan 2005

Devi Ahilya Vishwavidyalaya

BE (Distn) — Electronincs and Telecommunication Engg. (77.31% Distn)

Jan 1996Jan 2000

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