Satish Chandra Dixit

Software Engineer

Noida, Uttar Pradesh, India12 yrs 4 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • 12 years of experience in CPU subsystem design.
  • Led multiple tape outs across various technology nodes.
  • Expert in timing closure methodologies and power recovery.
Stackforce AI infers this person is a Semiconductor Engineering expert with a focus on CPU design and physical verification.

Contact

Skills

Core Skills

Static Timing AnalysisCpu DesignSystem On A Chip (soc)Low-power DesignTiming SignoffIntegrated Circuits (ic)Semiconductor Engineering

Other Skills

Engineering LeadershipPhysical DesignTiming Closurehigh perfornmaceECOHardwareTCLProcessorsCPULogic SynthesisDigital ElectronicsVLSIMixed SignalVerilogPNR

About

> Currently working as a Staff Engineer in Qualcomm CPU PD team, having 12 years of experience in PD & STA, of High Performance CPU Subsystems, High speed IPs, frequency ranging from 500Mhz to 3.6+ Ghz. > Worked for 15+ tape outs for Tech Nodes- 60nm, 45nm, 40nm, 32nm, 28nm, 22nm, 14nm, 11nm, 8nm, 7nm, 5nm, 4nm and different technology variant like BCD, IMG, BICOMOS, FDSOI, FinFet. >Tools- Innovuus/ICC PrimeTime/Tempus, Tweaker, Redhawk, Calibre, Satr-RC/QRC , DC and Virtuoso. * Expertise in CPU subsystem level STA, timing closure methodologies, timing corners, modes and process variations and optimization. * Hands on experience on power recovery and signoff. * Expertise in PGV/rail aware STA at subsystem level. * Handled Sub-system level constraints clean up for multiple chips. * Worked on Complex subsystem interface timing closure and IO Budgeting. * Having architecture level understanding and data flow know how of ARM Cores A7/A55/A56/Clen/A73/A75/A78 and other high performance custom CPU-cores. * Abstraction expertise like Hyperscale/Context and ETM/SDF delivery. * Expertise in timing ECOs (Engineering Change Order) manually as well as using tools like PTECO/tempus/tweaker and coordinating with Frontend and Backend Designers to close timing. * Expertise in power recovery - leakage and dynamic using various tools. * Knowledge of low power techniques including clock-gating, power-gating and multi-voltage designs * Experienced with OCV/AOCV/POCV/LVF variations and margining. * Expertise in Clock tree analysis , DCD simulation and High frequency Clock tree signoff. * Participate in Mentoring new hires in the group on technical skills. * Provide inputs for CAD/DA team from Design Implementation perspective. * Part of various workgroups and initiatives to bring development and change into tool/flows/methodology. * Hands on experience on PNR and PV (complete RTL2GDS) closure for MSIP blocks. * Hands on experience for PDN closure for small blocks using Redhawk. * Good team player with good oral, written and verbal communication skill. Must be able to negotiate with cross-functional teams for convergence. * Work closely with Principal Engineer / Project leader for creating schedule, tracking and raising issues / risks to project management.

Experience

12 yrs 4 mos
Total Experience
6 yrs 2 mos
Average Tenure
8 yrs 11 mos
Current Experience

Qualcomm

4 roles

Senior Staff Engineer

Promoted

Nov 2025Present · 5 mos

  • Leading the sign-off of the High-Performance CPU Subsystem for Snapdragon SoCs, deployed across multiple platforms including Mobile, Automotive, XR, and IoT.
Engineering LeadershipStatic Timing AnalysisPhysical DesignCPU designTiming Closurehigh perfornmace+1

Staff Engineer

Nov 2022Nov 2025 · 3 yrs

System on a Chip (SoC)HardwareIntegrated Circuits (IC)Low-power DesignSemiconductor EngineeringTCL

Senior Lead Engineer

Dec 2019Nov 2022 · 2 yrs 11 mos

System on a Chip (SoC)ProcessorsCPU designCPUHardwareIntegrated Circuits (IC)+4

Senior Engineer

Apr 2017Nov 2019 · 2 yrs 7 mos

  • Responsible for Physical Implementation, Timing Signoff (STA), Power Recovery and PPA trials of latest ARM cores like A76, A75, A73, A53, A7 for Qualcomm Snapdgragon Mobile processor and High performance Modems.
  • Worked on 5G modem CPU subsystem , designed at 7nm technology node.
  • Worked on Gold core implementation of Snapdragon 855 at techno node 7nm.
  • Worked Timing Signoff of CPUSS for Snapdragon 632 at Techno Node 14nm.
  • Worked on Timing Signoff of mid Level HM (MHM) for processor Snapdragon 450.
System on a Chip (SoC)HardwareIntegrated Circuits (IC)Low-power DesignSemiconductor EngineeringTCL

Stmicroelectronics

2 roles

Senior Design Engineer

Promoted

Jul 2015Apr 2017 · 1 yr 9 mos · Noida Area, India

  • Responsible for PNR, Timing, Power and Physical Signoff of Digital Blocks Different Mixed Signal IPs.
  • Mixed Signal IPs incluseds High Frequency ADC, 8, 14.16 Bit DAC, HDMI, PLL Blocks like SSCG, FRAC, different sensor like CPR, Voltage , Current, and Voltage and Current Sensor.
  • Worked on Techno nodes 45nm, 40nm, 32nm, 28nm, 22nm.
HardwareLogic SynthesisIntegrated Circuits (IC)Semiconductor Engineering

Design Engineer

Oct 2013Jun 2015 · 1 yr 8 mos · Noida Area, India

  • Worked on Physical Design of Digital Block Different Mixed Signal IPs, Those are USB, DPHY , MPHY. HDMI, ADC, DAC, Voltage Sensore, Curent Sensoer, Voltage and Current Snsor, Frac Controller, SSCG etc.
  • Worked on different techno nodes i.e. 320nm BCD, 180nm BCD, 90nm, 60nm,
HardwareIntegrated Circuits (IC)Semiconductor Engineering

Tech vulcan

Associate Engineer

Jul 2013Sep 2013 · 2 mos · Bangalore India

  • Worked on Designing of USB IP 3.0.
Integrated Circuits (IC)Semiconductor Engineering

Education

Motilal Nehru National Institute Of Technology

Bachelor of Technology (BTech) — Electronics and Communications Engineering

Jan 2009Jan 2013

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