Abhishek Chaubey

Software Engineer

Bengaluru, Karnataka, India4 yrs 7 mos experience
Most Likely To Switch

Key Highlights

  • Expert in Power Analysis and EDA tools.
  • Proficient in Python for automation and analysis.
  • Experience in multi-die design validation.
Stackforce AI infers this person is a Semiconductor Engineer with expertise in Power Analysis and EDA tools.

Contact

Skills

Core Skills

MethodologyPower AnalysisEda

Other Skills

PythonRedhawk Sc advance trainingVoltusCMOSEMIRDigital ElectronicsPython (Programming Language)Very-Large-Scale Integration (VLSI)InnovusSTACadence Virtuoso Layout EditorAutodesk TinkercadXceliumApplication-Specific Integrated Circuits (ASIC)Circuit Analys

Experience

4 yrs 7 mos
Total Experience
1 yr 1 mo
Average Tenure
1 yr 6 mos
Current Experience

Broadcom

IC Design Engineer

Dec 2024Present · 1 yr 6 mos

Ansys

2 roles

Prodcut Specialist 2

Oct 2024Dec 2024 · 2 mos · Bengaluru, Karnataka, India · Hybrid

Application Engineer 2 SCBU

Mar 2023May 2024 · 1 yr 2 mos · Bengaluru, Karnataka, India · On-site

  • Providing Support for RedHawk-Sc to Customers.
Methodology

Intel corporation

Signal & Power Integrity Engineer

May 2024Oct 2024 · 5 mos · Bengaluru, Karnataka, India · Hybrid

Cadence design systems

2 roles

Product Engineer I(PDN Analaysis Engineer)

Aug 2021Feb 2023 · 1 yr 6 mos · Noida, Uttar Pradesh, India

  • Thermal Analysis(VOLTUS)
  • Root level analysis of temperature impact on Resistance & EM on various customer designs
  • Developing Spec for supporting merging of powermap & Enabling Early stage Chip Temperature Map identification.
  • Created Python Scripts to mantain the quality of results builds to builds with TAT to process 10M lines in 5min.
  • Setup regression flows for features coverage of thermal & Self Heating flows, and specific features like trilib_interpolation,Merge_vtm_flow,thermal_aware_emir & coded scripts to automate their validity.
  • CELSIUS(Thermal_Simulation_Tool)
  • Generated Chip_Temperature map file based upon following parameter
  • Power_density,Heat_sink,thermal_conductivity,moulded_compound,air_flow & feed the generated temperature_map file into voltus & validate the results of thermal_aware_emir on multiple segments in multiple scenarios.
  • Vectorless_power
  • Validated power & rail results in CAT with identifying the scheduling & corresponding switching time calculation based on multiple_user_defined_activity & twf.
  • Created scripts to get cyclewise_instance_switching report for every type of cells(i.e seq,comb,clkcomb etc)can process 10M lines in 5min & generates intermediate files cell_wise make easier to analyse the switching profile.
  • 3DIC_Validation
  • Converted single_die designs into multi_die with interposer & die_stack_mapping_file.
  • Validation of reff & rlrp path tracing of multi_die designs with pkg substrate.
  • Automation
  • Created multiple python scripts to improve TAT for debugging.
  • Thermal_power_map & metal_density QA
  • SelfHeat reports QA
  • n number macro_based_deisgn creation script with mention -n <number> it can create rtl2gds processs with design having n macros like py macro.py -n 300 gets 300 macro design
  • Cycle_wise_coverage script helps in giving instance switching info cyclewise with each category differentiated based on cell_types(macro.seq.comb,io etc)
  • avgToggleRate script to get each instance avg toggle_rate.
Power AnalysisEDA

Power/Signal Integrity Analysis Trainee

Jan 2021Jul 2021 · 6 mos · Noida, Uttar Pradesh, India

  • RTL2GDS & PDN(genus-innovus-voltus)
  • Synthesis, floor-planning (place-route, power grid creation) and simulation (vectors - vcd, shm, fsdb, phy, saif) of digital blocks incorporating advanced cells i.e. scan flops, multi-bit flops, integrated clock gating cells to experiment and develop the functionalities of static and transient power.
  • Created CPF based 2 power_domain designs & done power & rail analysis on it.
  • Evaluating switching, power reporting and dynamic current waveforms, instances voltage drops of instances in digital chip by computation of energy tables in Non Linear Delay Models (NLDM), Effective Current Source Model (ECSM) and Composite Current Source Model (CCS-P) liberties based on factor of input slew and output load.
  • Analyzing violations reported based on current density during electromigration (EM) analysis in signal and power/ground nets of design chip w.r.t to EM rules mentioned in technology file & created scripts to get the layerwise worst resistor segments.
  • Virtuoso_layout_editor
  • Created Custom layouts to improve extraction on RDL Layer shapes & Run power & rail anlysis to see false em violation & false resistor fracturing.
Power AnalysisEDA

Education

J.C. Bose University of Science and Technology, YMCA

Bachelor of Technology - BTech — ECE

May 2017Jun 2021

Indian Institute of Technology, Delhi

CERTIFICATE — MICROELECTRONICS AND NANOELECTRONICS (ELL732)

Aug 2022Nov 2022

Stackforce found 100+ more professionals with Methodology & Power Analysis

Explore similar profiles based on matching skills and experience