R

RudreshaN ...

CEO

Bengaluru, Karnataka, India20 yrs 2 mos experience
Highly Stable

Key Highlights

  • 20 years of experience in Wireless Communication
  • Expert in LTE and WCDMA system design
  • Proven track record in team leadership and project delivery
Stackforce AI infers this person is a Telecommunications expert with extensive experience in signal processing and physical layer development.

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Skills

Core Skills

Lte Physical LayerSignal Processing

Other Skills

Software Product ManagementArchitectsLTETeam LeadershipReal-Time Operating Systems (RTOS)DSP Layer-1 system designMemory ManagementIntegrationMobile WiMAXDebuggingFirmwareSemiconductorsEmbedded SystemsEmbedded SoftwareC

About

20 Years of Experience in the field of Wireless Communication and Signal Processing. "Skilled in team leadership and collaboration, with a track record of uniting diverse teams to achieve high-performance outcomes and exceed organizational goals" LTE Layer 1 Line Manager,Led a team of 24 engineers in the development and optimization of LTE Layer 1 features. Provided both technical and managerial support, ensuring timely delivery of project milestones. Facilitated regular team meetings, performance reviews, and career development planning. Collaborated closely with cross-functional teams including systems, integration, and testing. Oversaw workload distribution, project planning, and resource management. Implemented process improvements that enhanced team efficiency and reduced debugging time. Experience in system integration, signal chain development, Framework (infra) development for different specifications of Wireless( LTE, WiMAX 16E and 16d) and Wireline (ADSL, VDSL) on COTS and customer platforms. Expertise in Real time system design and programming of Multicore DSPs ( TI DSP 6670 , Freescale MSC8156 DSP ,Coolflux Complex DSP,Customer platform). using DSP/BIOS,smart DSP OFDM, Time & Frequency Synchronization,Turbo codes,LTE, WIMAX, ADSL/VDSL, WCDMA System Debugging, Firmware developer and Verification Engineer. Experience in commercial embedded software development specific to signal processing applications. Good working knowledge of Cavium Processor, TI Nyquist DSP processor of C6670 as well as Freescale MSC8156 Processor. Worked on LTE eNodeB and UE Firmware development. Worked on software tools like Code composer studio (CCS), Freescale's Code Warrior, Microsoft visual studio and Matlab. Involved in Framework development and MAC-PHY integration of LTE Layer1 uplink module. Working experience on WCDMA, physical layer for 3G Layer1. Hands on experience on R&S, Agilent Test Equipments. Specialties: LTE, WCDMA, Wimax, PHY Layer Development, MAC Phy Integration.

Experience

20 yrs 2 mos
Total Experience
3 yrs 6 mos
Average Tenure
3 yrs 2 mos
Current Experience

Mavenir

RAN Physical layer Manager

Apr 2023Present · 3 yrs 2 mos · Bengaluru, Karnataka, India · Hybrid

  • Led a L1 team for development and optimization of LTE Layer 1 features.
  • Provided both technical and managerial support, ensuring timely delivery of project milestones.
  • Facilitated regular team meetings, performance reviews, and career development planning.
  • Collaborated closely with cross-functional teams including systems, integration, and testing.
  • Oversaw workload distribution, project planning, and resource management.
  • Implemented process improvements that enhanced team efficiency and reduced debugging time.
Software Product ManagementArchitectsLTE Physical layerSignal Processing

Tata elxsi

Senior Technical Specialist

Jan 2019Mar 2023 · 4 yrs 2 mos

  • 4G Physical layer design for Viavi Solutions E500/TM500. 4G Technical architect for cross-functional agile team.
LTE Physical layerReal-Time Operating Systems (RTOS)Signal Processing

Viavi solutions

Technical Architect/Component Architect

Jan 2019Mar 2023 · 4 yrs 2 mos · Bengaluru, Karnataka, India

Sasken technologies limited

Principal System Engineer

Jan 2015Jan 2019 · 4 yrs · Bengaluru, Karnataka, India

  • Satellite Phone terminal(UTH)development,The UTH(Mobile Phone )is designed with TI DM3730 chip set DM3730 consist of TI64x+ DSP and MCU Processor,C64x+ is used for Layer1(L1C,Algo,RFIC driver, SIM driver and PS)and MCU is used for UTH application.
  • DSP Layer-1 system design, Memory,Mips Analysis and Management/Mapping
  • Design and development of OS abstraction layer for the OS used system(TI sysbios is used)
  • Integration of L1 controller,Algo and RFIC driver along with OS abstraction layer.
  • Mailbridge implementation to have communication b/w dsp and MCU
  • DSP Power management design and development

Tata elxsi ltd

Specialist

Dec 2008Jan 2015 · 6 yrs 1 mo · Bengaluru, Karnataka, India

  • L1 of 3GPP LTE Release 8 FDD eNB / UE, , Mobile WiMAX (Commercial 3 sector BS) baseband design, development, integration, RF Integration, optimization (MIPS, Memory, TI c64x Handcoded parallel assembly) debugging and IOT (Interoperability testing).

Centillium communications

semiconductor

Dec 2006Oct 2008 · 1 yr 10 mos

Conexant india pvt ltd

Firmware Engg

Jan 2006Dec 2006 · 11 mos

Education

National Institute of Technology Karnataka

Master of Technology (MTech) — Digital Electronics and Advanced Communication

Jan 2003Jan 2005

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