Raghavendra Anjanappa

Product Manager

Bengaluru, Karnataka, India18 yrs 7 mos experience
Highly Stable

Key Highlights

  • Led Package Design team at Tata Electronics.
  • Established a center of excellence for global package design.
  • Expert in Signal and Power Integrity analysis.
Stackforce AI infers this person is a Semiconductor and Automotive Design Expert with a focus on Package Design and Signal Integrity.

Contact

Skills

Core Skills

Package DesignSimulationEdaSignal IntegrityPcb DesignPower Integrity

Other Skills

Assembly Design KitsElectrical SignoffEDA SupportHyperlynx DRC ExecutionTiming AnalysisEMI/EMCThermal AnalysisMixed SignalAnalogElectronicsASICHardware ArchitectureVerilogModelSimEmbedded Systems

About

Currently working as Package Design Manager at Tata Electronics Private Limited (TSAT) Vemgal responsible for leading the Package Layout Team and Electrical Signoff. Aiming to mark Technology Development Group at TSAT for Package Design as Centre of excellence for Global Package Design and Simulations.

Experience

18 yrs 7 mos
Total Experience
2 yrs 3 mos
Average Tenure
--
Current Experience

Tata electronics

Manager - Package Design

Dec 2024May 2025 · 5 mos · Vemagal · On-site

  • Making TSAT a centre of excellence for package design and simulation. Work closely with the Assembly team and develop Assembly Design Kits for both Flipchip & wirebond Technology. Develop a Package design and simulation team within TSAT to service customers for various package design requirements.
Package DesignSimulationAssembly Design KitsElectrical Signoff

Micron technology

Manager PDE

Aug 2022May 2024 · 1 yr 9 mos · Hyderabad · Hybrid

  • Package Design and Development
  • EDA Support
  • Package Electrical Sign off
  • Hyperlynx DRC Execution
  • Customer Experience Centre - MIEC
  • TLP - Key member
Package DesignEDA SupportElectrical SignoffHyperlynx DRC ExecutionEDA

Wuerth elektronik india pvt. ltd

Team Lead - SI PI & EMI Analysis

Aug 2018May 2022 · 3 yrs 9 mos · Karnataka, India

Trident techlabs pvt. ltd.

Sr FAE System Design

Mar 2017Aug 2018 · 1 yr 5 mos · Bangalore

Asm technologies limited

Technical Centre Manager

Jan 2015Mar 2017 · 2 yrs 2 mos · Bengaluru Area, India

Prevas ab

Senior Design Engineer

Oct 2012Feb 2015 · 2 yrs 4 mos · Bengaluru Area, India

  • Signal integrity timing analysis for the iMX6 DDR3, Delivery of PCB from schematic to PCB design, interactions with the fabrication and the assembly house. Interaction with the mechanical team for validation of the product design and drawings.
  • Worked on automotive projects for Volvo Construction Equipment (VCE Germany) in designing various control units from EMI/EMC perspective.Integrated Library development, validation and management using the Altium Software. Documentation of the project for design checklists for EMI/EMC compliance.
Signal IntegrityTiming AnalysisPCB DesignEMI/EMC

Trident techlabs pvt. ltd.

Team Lead (Technical Manager)

Sep 2010Oct 2012 · 2 yrs 1 mo · Bangalore

  • Handling a team of 6 and working on various designs including Signal Integrity,Power Integrity and Thermal Analysis.
  • Conducting Lab sessions for Signal Integrity training conducted by our CTO Mr SLN Murthy.
Signal IntegrityPower IntegrityThermal Analysis

Tejas networks pvt ltd

senior design engineer

Dec 2005Sep 2010 · 4 yrs 9 mos · Bangalore

  • i worked as consultant in TEJAS NETWORKS PVT LTD
  • for 4.5 years.

Education

MANIPAL UNIVERSITY

MASTER OF SCIENCE — MICROELECTRONICS

Jan 2011Present

HKBK COLLEGE OF ENGINEERING

BACHELOR OF ENGINEERING — ELECTRONICS AND COMMUNICATION

Jan 2005Present

ST THOMAS SCHOOL

Schooling

Jan 1986Jan 1998

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