Shylesh Srinivasan — Product Engineer

I design mixed signal circuits and device models for circuit simulations. Got my hands on circuit design, floor planning, silicon layout, tape-out, wafer level testing, packaged devices/product testing and custom testing hardware development. I use TCAD, ADS and other multi physics simulation tools for device modelling. I also develop embedded systems, firmware and PC software. My professional and academic interests are developing ASIC architectures, mixed signal circuits, transistors (SiC, GaN, Ga2O3) and diodes (Schottky, Super Barrier, SiC, PN junction), device packaging, HDI PCB technologies, thermal and electrical impedance management technologies for high frequency, voltage and power applications. I have also been exploring novel approaches of radiation hardening of microelectronics for aerospace applications. Apart from my specialization, my experience includes working on electromechanical systems such as articulated robots, parallel link manipulators, ground robots, custom actuators, numerical control, pneumatic, hydraulic systems, aero modelling, building drones, embedded software and full-stack product development. You'll mostly find me in the lab. Love having great food and listening to music.

Stackforce AI infers this person is a Semiconductor and Electronics Engineering expert with a focus on embedded systems and circuit design.

Location: Boston, Massachusetts, United States

Experience: 10 yrs 5 mos

Skills

Asic
Mixed Signal Circuits
R&d
Tcad
Device Design
Circuit Design
Embedded Systems
Product Development

Career Highlights

Expert in mixed signal circuit design and ASIC development.
Experience in high-frequency and power applications.
Strong background in embedded systems and firmware development.

Work Experience

Finwave Semiconductor, Inc.

Hardware Engineer 2 (2 yrs 9 mos)

University at Buffalo School of Engineering and Applied Sciences

Research Assistant (3 mos)

Research Student (1 yr 6 mos)

NSRCEL

Incubated Business (8 mos)

Incoen Systems

Hardware Engineer & Cofounder (1 yr 4 mos)

Aura Labs SIIC

Technical Head (6 mos)

Electronic Systems Engineer (2 yrs 6 mos)

Nokia

Engineering Trainee (0 mo)

SRM Innovation and Incubation Centre

Technical Associate (2 yrs 6 mos)

Bharat Electronics

Electrical Engineering Intern (0 mo)

SRM TEAM ROBOCON

Team Manager (9 mos)

Electrical and Electronic System Engineer (1 yr 9 mos)

Education

Master of Science - MS at University at Buffalo

Incubation Program at Indian Institute of Management Bangalore

Bachelor of Technology at SRM IST Chennai

STEM Foundations at FIITJEE

Higher and lower secondary education beginning from 1st grade at Kendriya Vidyalaya

Shylesh Srinivasan

Product Engineer

Boston, Massachusetts, United States10 yrs 5 mos experience

Most Likely To Switch

Key Highlights

Expert in mixed signal circuit design and ASIC development.
Experience in high-frequency and power applications.
Strong background in embedded systems and firmware development.

Stackforce AI infers this person is a Semiconductor and Electronics Engineering expert with a focus on embedded systems and circuit design.

Contact

shylesh060897@gmail.com LinkedIn

Skills

Core Skills

AsicMixed Signal CircuitsR&dTcadDevice DesignCircuit DesignEmbedded SystemsProduct Development

Other Skills

AestheticsAnalog, digital, mixed signal circuits designAnsys LumericalApplication-Specific Integrated Circuits (ASIC)AutoCAD MechanicalBoard Bring-upC++CoachingDebuggingEagle PCBElectrical DesignElectrical EngineeringElectrical TroubleshootingElectrical WiringElectromechanical systems

About

Experience

10 yrs 5 mos

Total Experience

2 yrs

Average Tenure

2 yrs 9 mos

Current Experience

Finwave semiconductor, inc.

Hardware Engineer 2

Sep 2023 – Present · 2 yrs 9 mos · Boston, Massachusetts, United States · On-site

GaN on Silicon RF ASIC hardware development.
Mixed signal and analog circuit design.
Physical design and tape-out.
On-wafer device characterization and circuit testing.

GaN on Silicon RF ASIC hardware developmentMixed signal and analog circuit designPhysical design and tape-outOn-wafer device characterization and circuit testingASICMixed signal circuits

University at buffalo school of engineering and applied sciences

2 roles

Research Assistant

May 2023 – Aug 2023 · 3 mos · University at Buffalo, New York, United States · On-site

Design and characterization of Through Silicon Thermal Via (TSTV) technology for high power density and radiation hardened semiconductor devices.

Laboratory SkillsResearch and Development (R&D)Synopsys Sentaurus TCADR&DTCAD

Research Student

Nov 2021 – May 2023 · 1 yr 6 mos · University at Buffalo, New York, United States · On-site

Developed 2D and 3D device design & simulation models, fab mask design.
Developed custom CAD workflows involving cross integration of TCAD, EDA, multi-physics CAD modelling and simulation software tools.
Worked with teams developing β-Ga2O3 devices for HV and RF applications.

Laboratory SkillsSynopsys Sentaurus TCADApplication-Specific Integrated Circuits (ASIC)ASICDevice design

Nsrcel

Incubated Business

Sep 2020 – May 2021 · 8 mos · Bengaluru, Karnataka, India

Department of Science and Technology (DST), Gov. of India funded business incubated at NSRCEL, Indian Institute of Management Bangalore (IIMB).
Learning by experience of starting a business and mentorship from accomplished faculties of business & management having rich industrial background.
Sharing and learning with fellow incubates and startups incubated at NSRCEL.

Incoen systems

Hardware Engineer & Cofounder

Apr 2020 – Aug 2021 · 1 yr 4 mos · Chennai, Tamil Nadu, India · On-site

Managing & executing various aspects of the business as the co-founder of the company. As an engineer:
Developed the Inkless Plasma Printing technology.
Developed the MOPFET (Metal Over Paper Field Effect Transistor) model central to the electrical & thermal characterization, calibration & plasma process repeatability.
Designing, simulating, analyzing, prototyping, debugging & iterating the analog, digital, mixed signal & high-speed circuits, DC/DC & AC/DC convertors, HV & power electronic circuits.
Engineering electronic modules for signal and power integrity and EMI/EMC control.
Developed firmware / embedded software for MCU & SoC.
Developed and fabricated electro-mechanical systems and assemblies.

Inkless Plasma Printing technologyMOPFET model developmentAnalog, digital, mixed signal circuits designFirmware developmentElectromechanical systemsCircuit design+1

Aura labs siic

2 roles

Technical Head

Jun 2019 – Dec 2019 · 6 mos · Chennai, Tamil Nadu, India

Electronic Systems Engineer

Mar 2018 – Sep 2020 · 2 yrs 6 mos · Chennai, Tamil Nadu, India

Working on Ink-less Printing Technology, RF Impulse Triggered Vacuum Tube Switching Device, Facility Equipment, Multi-Stage Electro-Pneumatic Hybrid Delta Robot System | Research in Electronics and Robotics | Mechanical Design | Prototyping, Fabrication and Debugging of Product Minimum Viable Prototypes (MVP)

Embedded SystemsElectronic EngineeringPower ElectronicsProduct DevelopmentPython (Programming Language)C+++4

Nokia

Engineering Trainee

Mar 2019 – Mar 2019 · 0 mo · Greater Chennai Area

PCB Fabrication Line
PCB Testing Line
PCB Assembly Line
Automated RF Blocks Testing and Calibration
Industry 4.0 Architecture, Work Cells and Industrial Networks

Srm innovation and incubation centre

Technical Associate

Mar 2018 – Sep 2020 · 2 yrs 6 mos · Chennai, Tamil Nadu, India

Working with the SIIC technical team to evolve the SIIC Infrastructure and the FabLab facility in terms of its technical capabilities, equipment and technical expertise.