Krishna Prabhu

Software Engineer

Bengaluru, Karnataka, India7 yrs 9 mos experience
Highly Stable

Key Highlights

  • Over 5 years of experience in Physical Design Engineering.
  • Expertise in multiple advanced semiconductor technologies.
  • Proven track record in high-frequency automotive core design.
Stackforce AI infers this person is a Semiconductor Physical Design Engineer with extensive experience in ASIC design and implementation.

Contact

Skills

Core Skills

Physical DesignAsic FlowStatic Timing Analysis

Other Skills

SynthesisPNRSkewClock Tree SynthesisEngineeringLVSDesign Rule Checking (DRC)Low LatencyLogic SynthesisPhysical SynthesisVerilogDigital Logic DesignTCLPerlMicrosoft Office

About

Career Objective A dedicated and hardworking Physical Design Engineer with an ambition to enhance my skills and knowledge by tackling tough challenges. Core Competency • Good Knowledge on ASIC Flow. (RTL to GDSII) • Total 5.6 year of experience. 4.2 year in Intel and 1.4 year in MediaTek as contractor. • Hands on experience in quickly analyzing the Data-flow model and perform Floor-plan involving High-macro count to meet timing and congestion goals with minimum iterations. • Good Knowledge on Synopsys Design compiler and Fusion Compiler for Synthesis. • Expertise in using Synopsys ICC2 and Fusion Compiler for PNR implementation. • Hands-on experience in Static timing analysis (STA) using Primetime tool (Synopsys STA tool). • Experience in analyzing timing reports with CRPR, MCMM, Clock Skew, Identifying timing exceptions. • Expertise in using Synopsys IC Compiler II (ICC2) tool for Floorplan, Power Plan, Placement, CTS, Routing. • Experience in handling the issues related to Placement with aggressive Timing and Area optimization. • Setup and Hold optimization by using the Synopsys concurrent clock and data optimization algorithm. • Performed CTS and skew optimization to fix setup and hold violations. • Expertise in working multi-voltage design, balancing the clock latency. • Performed Parasitic extraction using STAR-RC tool. • Fixing DRC, LVS, ERC and Antenna to improve the yield. • Experience working LLC (Last Level Cache partition) with clock frequency is around 5GHz. • Expertise in building the U2C (Core to Un-core) and C2U (Un-core to Core) path. • Hands-on experience in Intel Tyche technology and Power Via/backend power structure. • Handling of high pressure and delivery of high-quality results. • Basic knowledge about scripting with TCL and Unix Shell scripting. • Experience in INTEL 10nm, INTEL 14nm, INTEL 7 & INTEL 20A. TSMC 16nm ,28nm 7nm &3nm technology.

Experience

7 yrs 9 mos
Total Experience
3 yrs 5 mos
Average Tenure
11 mos
Current Experience

Tenstorrent

Staff Engineer (RISC-V CPU Back -End Implementation Engineer)

Jun 2025Present · 11 mos · India · On-site

  • Tenstorrent :Physical Design Group
  • Experience in working with tsmc 3nm,tsmc 6nm and tsmc 12nm.
  • Tenstorrent : Silicon: Physical Design
  • Experience in working on RISC -V Full chip core flat implementation with respect tsmc 6nm.
SynthesisPNRPhysical DesignASIC Flow

Stmicroelectronics

2 roles

Staff Engineer (Silicon Back -End Implementation Engineer)

Apr 2024Jun 2025 · 1 yr 2 mos · Bengaluru, Karnataka, India · On-site

  • MDRF --> Experience in working with STM 28nm: Stellar Full chip PNR Implementation.
  • Full chip PNR Implementation on 28nm & Instance Count 10M.
  • Responsible for Placement timing closure & Congestion cleanup.
  • Performing various CTS iterations for latency reduction using exceptions and custom skew groups.
  • Regular interaction with Synthesis and STA team for constraints validation and timing debug.
  • Interacted with Project Lead on schedule planning.

Technical Lead Engineer

Jan 2023Apr 2024 · 1 yr 3 mos · Bengaluru, Karnataka, India · On-site

  • ADG (Automotive and Discrete Group)
  • STMicroelectronics ADG team Experience in working in FULL CHIP design with TSMC 7nm technology. (7th Tape -out).
  • STMicroelectronics ADG team Experience in Working in High Frequency Automotive Core In TSMC 5nm technology. Support for multiple blocks LVS/DRC/Antenna cleanup. (8th Tape-out)
Static Timing AnalysisSkewPhysical Design

Intel corporation

SoC Design Engineer

Aug 2018Jan 2023 · 4 yrs 5 mos · Bangalore

  • Mainstream Project :
  • Intel® Graphics and HPG team: Experience in working with Intel 10nm technology. (3rd Tape-in Intel 10nm technology)
  • Intel® HPG team : Experience in working with Intel 14nm Enhanced FINFET technology. (4th Tape-in Intel 14nm Enhanced FINFET technology)
  • Intel® HPG team : Experience in working with TSMC N6 node or 6nm technology.
  • Intel® HSPE team : Experience in working with Intel 7 technology. (5th Tape-in Intel 7 technology)
  • Intel® HSPE and DDG team: Experience in working with TSMC N3 node or 3nm technology.
  • Intel® NEX and DDG team : Experience in working with Intel 20A and power Via technology.
  • ECO Projects:
  • Intel® HPG team : Experience in working with Intel 10nm technology. (5 Partition Hold fix in Metal ECO & Signoff With LV team) -> Intel's latest Atom x6000 E Series (Tape-in).
  • Intel® HPG team : Experience in working with Intel 14nm Enhanced FINFET technology. (B0,C0 Version with 4 partition FECO &Timing ECO) --> 11th Gen Desktop processors (Tape-in).
  • Intel® HSPE team : Experience in working with Intel 7 technology. (14 partition Automation flow extraction ,STA runs) -->13th-generation mobile processor ( Tape-in).
Clock Tree SynthesisPhysical DesignASIC Flow

Mediatek

Physical Design Engineer

Apr 2017Jul 2018 · 1 yr 3 mos · Bengaluru, Karnataka, India

  • Experience in working with 28nm TSMC technology : Tape-out. (2nd tape out TSMC technology)
  • MediaTek client.
  • Experience in working with 16nm TSMC technology: Tape-out. (1st tape out TSMC technology)
  • MediTek client.
Engineering

Education

N M A M Institute of Technology, NITTE

Electronics and Communications Engineering

Jan 2013Jan 2016

RV College Of Engineering

Physical Design Engineering — Advanced Diploma In ASIC DESIGN

Jan 2016Jan 2017

Nitte Education Trust

Diploma in Electronic and communication Engineering

Jan 2010Jan 2013

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