Akshay Girijan

CEO

Bengaluru, Karnataka, India8 yrs 10 mos experience

Highly Stable

Key Highlights

8+ years of experience in high-speed PCB design.
Recognized with Intel’s Budding Star and Customer Excellence Awards.
Expert in driving innovation for next-gen computing platforms.

Stackforce AI infers this person is a PCB Design Engineer specializing in high-speed, multi-layer board design for advanced technology platforms.

Contact

Skills

Core Skills

Pcb DesignHigh-speed Design

Other Skills

DFMEngineering query resolutionSignal IntegrityPower IntegrityFlexible PCB DesignPrinted Circuit Board (PCB) DesignCadenceDDR RoutingConstraint SettingLength MatchingTeam workCross-functional Team LeadershipTeam LeadershipMicrosoft ExcelMicrosoft Office

About

I’m a results-driven PCB Layout Engineer with over 8 years of experience designing high-speed, multi-layer boards (up to 22 layers) for cutting-edge platforms including AI PCs, laptops, graphics cards, and test systems. My journey spans across Intel Technology and Wipro Technologies, where I’ve led complex layout projects from concept to tape-out with precision and speed. My core strengths lie in high-speed routing, signal and power integrity, HDI design, and flexible PCB (FPC) development. I’m proficient in Cadence Allegro and have deep expertise in DDR4/DDR5, LPDDR5, PCIe, HDMI, USB 3.2, and eDP interfaces. I’ve consistently delivered manufacturable, cost-effective designs that meet stringent electrical, thermal, and mechanical requirements. I take pride in translating customer requirements into robust PCB architectures while collaborating cross-functionally with hardware, mechanical, and manufacturing teams. My work has earned me recognition through Intel’s Budding Star and Customer Excellence Awards for delivering high-impact solutions under aggressive timelines. Looking ahead, I’m passionate about driving innovation in PCB design for next-gen computing platforms, mentoring future engineers, and solving layout challenges that push the boundaries of performance and reliability.

Experience

8 yrs 10 mos

Total Experience

4 yrs 2 mos

Average Tenure

5 mos

Current Experience

Cadence

Lead PCB Design Engineer

Nov 2025 – Present · 5 mos · Bengaluru, Karnataka, India · Hybrid

Intel corporation

PCB Layout Engineer

May 2024 – Sep 2025 · 1 yr 4 mos · Bengaluru, Karnataka, India · Hybrid

Contributing to next-generation AI PC initiatives by driving PCB design solutions and delivering cost-effective, high-performance layouts aligned with Intel’s product roadmap. Specialized in developing add-in cards and flexible PCB designs.
Led PCB design for mainstream AI PC platforms, optimizing performance, reliability, and manufacturability.
Designed high-speed add-in cards with adherence to signal integrity (SI) and power integrity (PI) guidelines.
Engineered flexible PCB (FPC) solutions to meet stringent mechanical and electrical requirements.
Collaborated cross-functionally with hardware, mechanical, power, and manufacturing teams to ensure seamless tape-out and on-time project delivery.

DFMEngineering query resolutionPCB DesignHigh-Speed Design

Wipro

Printed Circuit Board Design Engineer

Apr 2017 – May 2024 · 7 yrs 1 mo · Kochi, Kerala, India · Remote

❖ Handled both Type 3 & Type 4 designs having multiple layers (Up to 16 layers).
❖ Estimating the timeline for layout activities.
❖ Took full ownership of a design from placing of the component to Gerber release.
❖ Designed different laptop designs for Intel in various platforms.
❖ Worked for different FRD designs for Intel .
❖ Workstation and Graphic card designs.
❖ Supported ATE test board design.
❖ Flexible PCB designs.
❖ Expertise in DDR routing, constraint setting & length matching.
❖ Knowledge and experience in different memory technologies like DDR5, LPDDR5 etc.
❖ Worked for complex high speed designs.
❖ Well aware of different highspeed routing techniques like Arc routing, fiber weave routing and expert in length/phase matching of differential signals.