A

Arun Kumar E R

Software Engineer

San Ramon, California, United States16 yrs 11 mos experience
Most Likely To Switch

Key Highlights

  • 20+ critical tape-outs in RTL2GDS expertise
  • Led teams in advanced methodologies for power/performance improvements
  • Hands-on experience with major backend tools across multiple process nodes
Stackforce AI infers this person is a Semiconductor Engineering Expert with a focus on Physical Design and SoC integration.

Contact

Skills

Core Skills

Physical DesignSocMethodology Implementation

Other Skills

Timing ClosureLow Power designPVPlace and RouteFull ChipPower IntegrityPackaging DesignPhysical VerificationLogic SynthesisComputer-Aided Design (CAD)RoutingClock Tree SynthesisTeam LeadershipStatic Timing AnalysisLEC

About

Engineering Management - IC Design | Project Management | Technology Leadership | SoC | ASIC | Hardware Accelerators | Automotive | High-Performance Cores | Low Power Expertise | Network on Chip Expertise. Proven RTL2GDS expertise with 20+ critical tape-outs Over 15years of technical and managerial experience. Expertise in Hierarchical Chip Physical Design, SoC integration, and IP/Core hardening for a wide range of product line ranging from high performance processors, mobile phones, virtual reality gaming engines, ethernet switches, 5G wifi, extremely low power IoT, and home entertainment devices. Led teams to implement RTL2GDS. Managed projects for various products which are critical in power and performance. Defined and implemented advanced methodologies targeted for improving Power/Performance/Area & Time to Market through flow improvements. Worked on various process nodes from 130nm/90nm/65nm/45nm/40nm/32nm/28nm/22nm-FDSOI/16nm/12nm/7nm/5nm/4nm/3nm with various foundries such as INTEL/TSMC/GF/UMC. Hands-on experience with industry-standard P&R & SignOff tools. Looking for Leadership Roles Only.

Experience

16 yrs 11 mos
Total Experience
2 yrs 5 mos
Average Tenure
3 yrs
Current Experience

Broadcom

Principal Engineer

May 2023Present · 3 yrs · San Jose, California, United States · On-site

  • Building SoCs for variety of products
Timing ClosureLow Power designPVPlace and RouteFull ChipPower Integrity+3

Google

Sr Silicon Engineer

May 2022Apr 2023 · 11 mos · Mountain View, California, United States

  • TPU implementation & methodology Lead
  • Driving the implementation of Google's FlagShip IP for Pixel SoC.
  • Driving the methodology for TPU implementation
Physical VerificationLogic SynthesisComputer-Aided Design (CAD)Methodology ImplementationRoutingPhysical Design+8

Synapse design inc.

Director - Physical Design

Mar 2022Jul 2022 · 4 mos · Santa Clara, California, United States

Meta

Physical Design Lead / Manager

Mar 2020Mar 2022 · 2 yrs · Menlo Park, California, United States

  • Hands-on Leader driving Physical Design activities towards implementing HardWare Accelerators for various Gaming Devices in sub7nm processes.
  • > BackEnd Ownership from Spec Generation (SDC/UPF) , Synthesis , Design Planning, Place & Route, Timing & PV closure.
  • > Driving methodology development with multiple CAD tool vendors
  • > Driving Hierarchical /Top Level / Chip DesignPlanning/implementation/Integration
  • > Leading Provider for tool-agnostic strategies for design convergence
  • > Co-Work with Front End & Architecture team to fix design issues
  • Hands-on experience on all Major Backend tools

Qualcomm

Sr staff ( Manager)

Oct 2019Mar 2020 · 5 mos · Ireland

  • Managing medium size Physical Design Team for IP delivery for 5G MODEM product lines.
  • Individual contributions on Hierarchical Design Ownerships
  • Focus on team building & training
  • Focus on ECO's for quicker Time to Market
  • Focus on Performance & Power of Designs
  • Focus on Hierarchical Design Partitioning and Closures

National university of singapore

Invited Guest Speaker

Oct 2018Oct 2018 · 0 mo · Singapore

  • Invited Guest Lecturer for Computer Architecture Course
  • The Lecture was to introduce the origin and trends of computing architectures at a bird's eye view.
  • The talk also explained why ASIC and SoC are getting popular; due to the
  • advancements in heterogeneous computing architectures and semiconductor technology.
  • And it also touch upon hot topics such as Data centres, Artificial Intelligence, Machine Learning and IOT, and what the trends and challenges faced by the computing world to cater to these upcoming product streams.

Mediatek

2 roles

Technical Manager

Promoted

Feb 2016Oct 2019 · 3 yrs 8 mos

  • Project and Technology Management with comprehensive project delivery records over last 4years with multiple business units and customers like SONY /MICROSOFT/APPLE

Member Of Technical Staff

May 2014May 2016 · 2 yrs

  • Working as Full Chip Owner in Home Entertainment Group
  • 1) Responsible for the Full chip Design Planning,Partitioning,Budgeting,CTS,Routing,PV and STA
  • 2) Responsible for the R&D on emerging Low Power Methodologies.
  • 3) Convergence & Live QA Tools for MultiMillion Chips
  • Working as a Full chip owner for 10Million+ chips (28nm/16nm) (Wireless Team)
  • 1) Responsible for the Full chip Design Planning,Partitioning Budgeting,CTS,Routing,PV and STA
  • 2) Responsible for the R&D on emerging Low Power Methodologies for Wireless Chips.
  • 3) Development of Full Chip Low Power Methodology for Low Cost / Fast turn around time.
  • Product lines:
  • Wifi Routers
  • Network Processor
  • Working on Physical Design (Netlist to GDS) of ETHERNET SWITCH Products (Data Center Networks Team)
  • Handling 3.5Million instance highly congested and timing critical designs.
  • Developing advanced CTS algorithms for extreme low latency,skew designs (Also reducing power by 20% )
  • Developing tools for Congestion aware Automatic floorplaner for designs more than (1000+ SRAMS)
  • Strategies for Faster Closure for High instance count design (>3Million instances)

Broadcom

Senior Staff Engineer, IC Design

Jun 2013May 2014 · 11 mos · Bengaluru, Karnataka, India

  • Worked on 3G & 4G modem and Smart phone SoC's for two generations. Responsible for Netlist to GDS implementation with challenging area and power targets.
  • Methodology innovator for unsupervised learning techniques based CAD flows for power reduction, on-demand channel, island based feedthrough etc for aggressive power and area reduction.

Intel

Senior Component Design Engineer

Mar 2007Apr 2013 · 6 yrs 1 mo · Bengaluru, Karnataka, India

  • Worked on implementation from RTL to GDS of various products ranging from Processors, Servers ,Chipsets, X86 Application specific SoC's across the process generations from 90nm to 14nm.
  • Worked on methodology development and pioneering for Power reduction and Area Reduction for Better Power Performance of Intel Products.
  • Owned & Designed the core for worlds first Solar powered IA-core
  • Designed world first cloud computer on a chip
  • Developed various Low Power Methodologies for Intel Processors for upto10X Active Power Reduction

Indian institute of science (iisc)

Researcher

Aug 2006May 2007 · 9 mos · Bangalore

  • Thesis: Research prototype for high throughput bandwidth manager with QoS control using intel network processor and FPGA/ARM subsystem.
  • client: MROTEK Bangalore

Education

Indian Institute of Science (IISc)

M.Tech — MicroElectronics

Jan 2005Jan 2007

College of Engineering Trivandrum

Btech

Jan 2001Jan 2005

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