Siddheshwar A — Software Engineer
Technical Lead Physical Design/ Implementation Technical Expertise in Test chip and Macro implementation and signoff • Floorplaning of SOC and Block level (Placement of Micros, Voltage island creation, Power planning) • Placement • CTS(Clock Tree Synthesis) • Route • Timing closure • Physical verification • Power analysis and optimize • Convenient in handling Heard macro with multimillion instance and Hierarchical design. • Experience in working on various tools. • Test Chip implementation and signoff o Creation of IO ring o IO PAD placement (Signal PAD and PG PAD placement as per guidelines) o PG Ring creation o BUMP placement as per implementation guidelines o BUMP assignment o RDL routing o Entire PnR and all sign off activities
Stackforce AI infers this person is a Physical Design Engineer specializing in SoC implementations within the semiconductor industry.
Location: Bengaluru, Karnataka, India
Experience: 15 yrs 3 mos
Skills
- Physical Design
- Soc
Career Highlights
- Expert in Physical Design and SoC implementation.
- Led multiple projects in test chip and macro design.
- Recipient of Outstanding Performer award at SmartPlay.
Work Experience
Qualcomm
Staff Engineer ,SOC Physical Design,Floorplan (4 yrs 6 mos)
Samsung
PD Project Lead consultant (4 yrs)
MediaTek
Senior Consultant (5 mos)
Qualcomm
Engineer 3 (1 yr 8 mos)
Mindlance Technologies
Technical Lead (2 yrs 3 mos)
PMC-Sierra
Senior Physical Design Engineer (As a consultant). (1 yr 7 mos)
Qualcomm
Senior Physical Design Engineer Block level ( As a Consultant ) (4 yrs 2 mos)
Smartplay Technology
Physical Design Engineer (5 yrs)
Education
Bachelor of Engineering - BE at Basaveshwar Engineering College, BAGALKOT
Diploma in Electronics and Communication at S.J.P.N Trust Nidasoshi under D.T.E