Aman Sandiliya

Operations Associate

India5 yrs 4 mos experience

Most Likely To SwitchAI Enabled

Key Highlights

Expert in semiconductor manufacturing and defect analysis.
Proficient in process engineering and fab automation.
Strong background in data analysis and AI applications.

Stackforce AI infers this person is a Semiconductor Manufacturing Engineer with expertise in process optimization and defect analysis.

Contact

kra9193@gmail.com LinkedIn

Skills

Core Skills

Fab AutomationProcess EngineeringProcess IntegrationManufacturing SystemsDefect AnalysisYield Engineering

Other Skills

Microsoft Power BISi view MESEquipment ConfigurationProcess ModificationAutomationMESAMHSEngineering Change ManagementRoute ValidationDefect classificationRoot cause analysisYield analysisScanning Electron Microscopy (SEM)Microsoft Excel MacrosData Analysis

About

I am Aman graduated in 2019 in Bsc electronic. Currently I am working for Global Foundries as Principal Associate Process Engineer

Experience

5 yrs 4 mos

Total Experience

2 yrs 8 mos

Average Tenure

4 yrs 9 mos

Current Experience

Globalfoundries

3 roles

Principal Associate Factory System Setup Engineer

Promoted

Apr 2026 – Present · 2 mos · On-site

Process Modification.
New Recipe/Process Defination/Module Introduction to Fab system.
Equipment Configuration.
New Product Group/Technology introduction to Fab system.
New Equipment Introduction to Fab.
Addition of Chambers in tools.
Configring equipments to AMHS.
Proactively working on automation/Optimising of SOP on factory System Setup, ensuring less cycle time of request.

Microsoft Power BISi view MESEquipment ConfigurationProcess ModificationAutomationFab Automation+1

Senior Associate Integration Engineer

Jun 2024 – Apr 2026 · 1 yr 10 mos · On-site

Partners with Process Integration team to make changes to route in Si-view
Setting up route of Engineering Change Management (ECM) and Engeneering Request Form (ERF)
Validation of route before release to production.

MESAMHSEngineering Change ManagementRoute ValidationProcess IntegrationManufacturing Systems

Senior Associate Process Engineer

Sep 2021 – Jun 2024 · 2 yrs 9 mos · On-site

Defect Classification/Review of FEOL, MEOL and BEOL layers of chip using SEM Image Based Classification software.
Disposition of OoC lots to correct module team.
Trained new team members.
Worked on 40nm (NVM), 22nm (FDX), 28nm (SLP) and 14nm (FinFET) technology.

Defect classificationRoot cause analysisYield analysisScanning Electron Microscopy (SEM)Defect AnalysisYield Engineering