Jan 2022 – Jul 2023 · 1 yr 6 mos · Noida, Uttar Pradesh, India · On-site

• Key Responsibilities:
• Designed and developed embedded hardware circuits for Power Section, Audio Amplifiers, and Power over Ethernet (PoE).
• Designed and optimized Class D audio amplifier circuits for high-efficiency, low-noise performance in VoIP and multimedia devices.
• Developed Power over Ethernet (PoE) circuits to deliver power and data over a single cable, ensuring compliance with IEEE 802.3af/at standards.
• Integrated audio codecs (e.g., I2S, PDM interfaces) and HDMI interfaces for high-fidelity audio/video transmission in embedded systems.
• Created 4-layer and 6-layer PCB designs using Altium Designer for Video IP Phones and Audio IP Phones, integrating high-speed interfaces including:
• Gigabit Ethernet, WiFi & Bluetooth, GPS, LCD (LVDS, MIPI), Camera (MIPI), Audio Codec, HDMI.
• Collaborated in end-to-end product development, from schematic design to PCB layout and testing.
• Worked on multiple projects, including:
• Video IP Phone – Integrated HDMI, Class D amplifiers, and PoE in a compact form factor. Designed high-speed signal integrity PCBs with multimedia interfaces.
• Audio IP Phone – Optimized audio codec circuits, keypad circuits and noise reduction techniques. Developed compact PCB layouts with PoE and audio processing.
• Emergency Help Point – Designed Audio amplifer circuits, power management using LDO, audio induction loop, Engineered robust embedded systems for critical communication.