Tilak Wadhwa

Product Manager

Noida, Uttar Pradesh, India22 yrs 5 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • 22 years of experience in semiconductor industry.
  • Led physical design of multi-core automotive SoCs.
  • Achieved multiple First Pass Silicon successes.
Stackforce AI infers this person is a Semiconductor Design Expert with extensive experience in Physical Design and SoC development.

Contact

Skills

Core Skills

Physical DesignPpa Optimization

Other Skills

AutomationAutomotiveCCLPCadence EDICadence InnovusCadence VirtuosoCadence-EDICharacterizationDDR IPsDesignSyncDigital IPsEDAEmbedded SystemsFirst Pass Silicon success

About

~22 years of experience with top US/EU/IN based Semiconductor/IT MNCs. 16+ SOCs tapeout experience in various tech nodes - 12+ as hands-on/PnR Lead and 4 as PD Lead. Last led physical design of a multi-core, multi-partition automotive SoC in 28nm. Currently working on a next gen automotive SoC in 7nm and also leading PD of a revision chip in 28nm. Specialities: Execution Leadership, Die-size estimation, PPA optimization, Physical Design, PnR, Timing Closure, Automation, Floorplanning, Power routing, IR analysis, CTS, DRC, LVS, Standard cells, Layout, Characterization Tools: Cadence-Innovus, Synopsys-ICC2, Fusion compiler, Magma-BlastFusion/Talus, Technologies - TI-90nm,65nm,45nm; TSMC-55nm(shrink),40nm,28nm(ARM), 28nm(FDSOI),16FF, 7nm [both HP/LP flavors] IP implementation - DDR, DDLL and Integrated macros Languages - Shell, Perl, Tcl on platforms ranging from Sun-Solaris to Unix/RH-Linux Compute/Version Control - LSF farm, Design Sync, Clearcase

Experience

Stmicroelectronics

3 roles

Sr. Principal Engineer

Promoted

Dec 2024Present · 1 yr 3 mos

Principal Engineer

Jul 2021Nov 2024 · 3 yrs 4 mos

  • Led physical design (RTL2GDSii) of 2 automotive SOCs ranging from 80-115mm2 die area, ~10 partitions, 6+ Arm cores, 7M+ chip_top, multiple PDs and 25+ member teams. Strong PPA optimization focus, cycle time reduction and 1st Pass Silicon success!!
Physical DesignPPA optimizationTeam Leadership

Sr Staff Engineer

Jul 2018Jun 2021 · 2 yrs 11 mos

  • Led PnR of 10+ partitions and hands on chip_top P&R of 2 automotive SoCs. >130mm2 die, 9M+ chip_top handling using Cadence Innovus. PPA optimization for best in class area of Stellar uCs.
Physical DesignPPA optimizationCadence Innovus

Nxp semiconductors

Staff Design Engineer

Mar 2015Jul 2018 · 3 yrs 4 mos · Noida Area, India

  • Led physical design for 2 SoC's with First Pass Silicon success ! Also, worked on 16FF high freq partitions of multi million instance count using both Synopsys & Cadence tool sets
Physical DesignFirst Pass Silicon success

Freescale semiconductor

Staff Design Engineer - Physical Design

Dec 2012Mar 2015 · 2 yrs 3 mos · Noida Area, India

  • Completed 1 tapeout leading to 1st pass Silicon while working on top level P&R of a 31M gate SoC in 28nm with ARM library set. Targeted for automotive ADAS-vision segment, design was spread across 15 physical partitions with a drawn die size of ~68.7mm2. It included 4 ARM-Cortex-A53 cores running at 1Ghz, 2 APEX2 cores running at 500Mhz and GC3000 GPU3D running at 600Mhz with external memory i/f data rate of 1066MHz (DDR3).
  • Completed 1 Test Chip tapeout based on TSMC 28nm node using ARM library set. Handled end-end APR including CTS for ~7mm2 flat design which included ~12 analog IPs. This provided an opportunity to understand C28 flow and gather important learning.
  • Completed 1 tapeout while working on top level P&R of a quad-core uC for safety critical automotive applications in 55nm FG process. Chip complexity included > 9M gates across 3 physical partitions with a die size ~69mm2. Top critical path performance target was 320MHz while cores worked at 266MHz/133MHz.
  • Key new skills - Cadence EDI, Design Sync, QRC
Physical DesignP&RCadence EDI

Texas instruments

4 roles

Subsystems Lead - MCU Physical Design

Aug 2011Dec 2012 · 1 yr 4 mos · Bangalore

  • Worked on PD aspects of ARM-R4 based low power MCUs for Safety critical applications. Chips were executed in TI 65nm FG Flash process.
  • Completed 1 tapeout for a new product and 2 tapeouts for revisions.
Physical DesignTapeout

Subsystems Lead - ASIC Physical Design

Promoted

Nov 2007Jul 2011 · 3 yrs 8 mos · Bangalore

  • Worked on physical design/timing closure of complex blocks for WW ASIC customers - Canon and Ericsson. Have experience in blocks closure at TI-45nm low power node on Canon-Digic 5 processor and TSMC-40nm high performance node (500MHz) on Ericsson Hermes program.
  • Defined and automated a unified flow which was used across 32 partitions on the program.
Physical DesignTiming Closure

Sr. Design Engineer - Lead DDR IPs

Promoted

Jan 2005Oct 2007 · 2 yrs 9 mos · Bangalore

  • Worked on DDR, DDLL IPs for DDR, DDR-II, QDR, MDDR standards with prime focus on Physical Design and flows in 90nm, 65nm high performance as well as low power nodes. Extensive experience in working with Internal/external Customers and WW cross-functional teams.
  • Was key contributor in defining the PD flow for Integrated DDR, IOs and DDLL macros (IDID).
  • Managed a team of 4 Wipro engineers for one of the IDID developments. Received Star performer award for this in 2007.
Physical DesignDDR IPs

Circuit Design Engineer

Jun 2004Dec 2004 · 6 mos · Bangalore

  • Designing core cells for high performance Digital IPs
Digital IPs

Infosys

Software Engineer

Jun 2003Jun 2004 · 1 yr · Hyderabad, Bangalore

  • June 2003 - Sep 2003 (Hyderabad)
  • Joined Infy straight out of campus. Was trained at their Hyderabad facility in Open Systems. Got exposure to Global Delivery Model, Outsourcing and technical concepts in programming - C, OOPS, DBMS, UNIX, VB, SDLC. On Soft aspects - got training in project leading, cross culture sensitivity, communication skills to name a few. Overall a great learning experience.
  • Sep 2003 - June 2004 (Bangalore)
  • Worked as Software Engineer in BOFA account of BCMD division at Bangalore. Major responsibilities included manual testing and automation of test scripts for a Stock Market application. Got exposure to Win-runner, Test Director and programming in Perl. Also got good exposure to financial domain.
ProgrammingTesting

Aem

Engineer Trainee

Jun 2002Dec 2002 · 6 mos · Noida, Uttar Pradesh, India

  • My first industry experience in embedded systems domain as intern.
  • Worked on 2 major projects-
  • 1. GPS/GSM based vehicle tracking system - for a Mumbai based Cab services client.
  • 2. Machine Networking System - a data logging project for automation of machine floor of Sona Koyo Steerings, Gurgaon.
  • Key Learnings - Embedded systems, Micro-controllers 8051, Rabbit-2000, Dynamic C, RS-232 protocol, AT-command set for GSM modems, Product Development Life Cycle.
  • In addition, got a unique exposure that is rare to get in a traditional planned internship. e.g.-
  • 1. Assembled my 1st PC from scratch (back in 2002). Took this learning to set a 4-PC lab in Electronics Lab at college.
  • 2. Almost made a functional GSM mobile phone board as part of Vehicle tracking system.
  • 3. Got an early customer interaction exposure with managers and shop floor workers at Sona Koyo for Machine Netwroking System.
  • 4. Rare opportunity to read Texas Instruments manuals (the blue/yellow bibles)
Embedded Systems

Education

YMCA University of Science & Technology

Gold Medalist — Electronics Instrumentation & Control (Electronics Engineering)

Jan 1999Jan 2003

Indian Institute of Technology, Delhi

Dropped out — M.Tech. IEC

Shiksha Bharti, Rohtak

School Topper

Jan 1997Jan 1999

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