Sagar Undale — Director of Engineering
• Have successfully done high quality and high volume ASIC chip/tape-outs in very tight schedules. • Worked in leading semiconductor companies like ST, NXP, ARM, XILINX. Worked on .25um down to 7nm technology. • Strong rtl2gds2, manufacturability, process variability and tape out background • Strong understanding on IP and foundry business and models. Expertise: SoC Design Implementation and Tapeout , flow/methodology development. People and project management.
Stackforce AI infers this person is a semiconductor design expert with a focus on ASIC and SoC technologies.
Location: Bengaluru, Karnataka, India
Experience: 21 yrs 11 mos
Career Highlights
- Expert in high-quality ASIC chip tape-outs.
- Extensive experience with leading semiconductor companies.
- Strong background in SoC design and implementation.
Work Experience
Intel Corporation
Senior Manager (2 yrs 3 mos)
AMD
Senior Engineering Manager (1 yr 11 mos)
XILINX INDIA TECHNOLOGY SERVICES PRIVATE LIMITED
Design Engineering Manager (10 mos)
Staff Design Engineer (3 yrs 5 mos)
ARM Embedded Technologies Pvt Ltd
Staff Design Engineer (4 yrs 9 mos)
ARM Embedded Technolgies
SR. DESIGN ENGINEER (3 yrs 11 mos)
Mirafra Technologies
SR. DESIGN ENGINEER (10 mos)
Dgipro Systems
SR. DESIGN ENGINEER (3 yrs 7 mos)
New Tech Solutions
Testing Engineer (5 mos)
Education
B.E. at Visvesvaraya Technological University