Manish Kumar Jain

Software Engineer

North Delhi, Delhi, India16 yrs 3 mos experience
Highly Stable

Key Highlights

  • Over 16 years in VLSI Physical Design.
  • Led 27+ successful full chip tape outs.
  • Expert in full design cycle and SOC floorplanning.
Stackforce AI infers this person is a VLSI Physical Design expert with extensive experience in semiconductor design and engineering.

Contact

Skills

Core Skills

Physical DesignVlsiSocHierarchical Partitioning

Other Skills

FloorplanningRDLPADRINGPDNMacrosCadence EncounterStatic Timing AnalysisTiming ClosureDRCPower AnalysisLogic SynthesisPhysical VerificationLogic DesignFunctional VerificationTCL

About

Total 16+ years of experience in the field of Physical Design of VLSI and have been part of 27+ successful full chip Tape outs. @ Qualcomm, my area of exposure has been Full chip Floorplan (all aspects), working with multiple teams (Architecture, Design/Integration, Package, Board, Cores etc) for an optimal SOC floorplan, Place and Route. Extensive work on IO limited designs. Gained knowledge of full design cycle. @Cadence, my work area was Hierarchical Partition domain and responsibility was to take care of Hierarchical partitioning, Feed through insertion and pin assignment related work. @Wipro Tecnologies, My main area of experience had been VLSI Physical Design Flow of multi-million gate full-chips. In the due course of project development related activities, I had complete exposure of full P&R flow and subsequently have gained experience over the project development lifecycle, client requirements and customer expectations. Area of Interest: VLSI – Complete Physical Design Flow (From Synthesis to Tapeout), Digital Logic Design Specialties: Full chip Floorplan (all the aspects), Communication Skills.

Experience

16 yrs 3 mos
Total Experience
3 yrs 9 mos
Average Tenure
1 yr 3 mos
Current Experience

Arm

Principal Engineer

Feb 2025Present · 1 yr 3 mos

Qualcomm

5 roles

Senior Staff Engineer/Mgr

Promoted

Nov 2022Feb 2025 · 2 yrs 3 mos · On-site

FloorplanningRDLPhysical DesignVLSI

Staff Hardware Engineer

Dec 2019Nov 2022 · 2 yrs 11 mos · On-site

  • SoC Floorplan (all the aspects) and PnR, PDN.
PADRINGPDNPhysical DesignSoC

Lead Engineer, Sr

Dec 2016Dec 2019 · 3 yrs · On-site

  • SoC, Physical Design
SoCFloorplanningPhysical DesignVLSI

Senior Engineer - Physical Design

Promoted

Nov 2013Jan 2016 · 2 yrs 2 mos

  • Testchips (14nm to 10nm), SOC Floorplan, PnR, Data Preparation, Calibre DRC etc
MacrosPADRINGPhysical DesignSoC

Engineer - Physical Design

Dec 2011Oct 2013 · 1 yr 10 mos

  • Testchips (20nm to 16nm), SOC Floorplan, PNR, Calibre DRC,
Cadence EncounterFloorplanningPhysical DesignSoC

Cadence design system

Lead Product Engineer

Jan 2016Dec 2016 · 11 mos · Noida Area, India · On-site

  • Hierarchical partitioning & Pin assignment
FloorplanningHierarchical PartitioningPhysical Design

Wipro technologies

VLSI - Physical Design Engineer

Jan 2010Dec 2011 · 1 yr 11 mos · Bangalore

  • Netlist to GDSII Flow, Layout Design (Floorplan & Powerplan), DDR2/DDR3 SRAM Layout and timing closure, CTS, STA, Timing Closure, EM/ IR-Drop Check, Physical Verification checks.
Cadence EncounterSoCPhysical DesignVLSI

Education

Vellore Institute of Technology

B. Tech — Electronics and Communication Engineering

Jan 2005Jan 2009

Shri Mahaveer Digamber Jain Sr. Sec. School, C-scheme, Jaipur

11th & 12th — PCM

Jan 2003Jan 2005

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