Navneet Kishan — Product Engineer
As a seasoned SoC Design Engineer with over 7 years of experience at Intel Corporation, I bring a wealth of expertise in layout verification (LV), SubFC Integration, Die File Creation, Physical Design and VLSI design. My career has been marked by significant contributions to multiple node technologies, including 7nm, 6nm, 4nm, and 10nm. Technical Expertise: ● Physical Design Verification: Proficient in leading LV analysis and cleanup for complex SoC projects. ● LV/SubFC Integration: Skilled in coordinating SubFC integration and managing die file creation. ● VLSI Design: Experienced in developing novel XSI-based die file flows and optimizing PNR ECO processes. ● Multi-Technology Expertise: Adept at resolving complex issues across various node technologies while collaborating with cross-functional teams. Leadership & Collaboration: ● Team Leadership: Proven track record of training teams on LV flows and managing multiple projects simultaneously. ● Cross-Functional Collaboration: Successfully worked with diverse teams to deliver projects on time, ensuring technical and design requirements are met. Research & Innovation: ● Earthquake Prediction: Contributed to a research project at NESAC focused on predicting earthquakes using multi-parameter analysis. ● SCADA Systems: Gained hands-on experience in SCADA systems and automation during my internship at C-DAC Bangalore. Education & Background: ● B.Tech. in Electronics and Communications Engineering: Graduated with a CGPA of 8.67 from National Institute of Technology, Sikkim. ● Campus Ambassador: Served as a Campus Ambassador for LearnVern and Internshala, enhancing my communication, outreach, and leadership skills. Professional Highlights: ● Published Work: Developed a novel XSI-based die file flow published at DTTC. ● Event Coordination: Successfully coordinated events like the college tech fest "Abhiyantran" and secured sponsorship from Internshala. ●Growth Hacking: Facilitated outreach efforts and onboarded a significant number of students for ePoise. I am passionate about leveraging my technical expertise to drive innovation and efficiency in semiconductor design. My experience spans from leading complex SoC projects to contributing to cutting-edge research initiatives. I am always eager to collaborate with like-minded professionals and contribute to the advancement of technology. Feel free to connect with me to explore opportunities for collaboration or to discuss the latest trends in SoC design and VLSI technology.
Stackforce AI infers this person is a Semiconductor Design Engineer with expertise in VLSI and Physical Design.
Location: Bengaluru, Karnataka, India
Experience: 8 yrs
Skills
- Physical Design Verification
- Vlsi Design
- Lv/subfc Integration
- Physical Design
Career Highlights
- Expert in Physical Design Verification and VLSI Design.
- Published novel XSI-based die file flow at DTTC.
- Led successful integration of SubFCs across multiple projects.
Work Experience
Intel Corporation
SoC Design Engineer (7 yrs 11 mos)
Physical Design Intern (8 mos)
CDAC Bangalore
Intern (2 mos)
Learnvern
Campus Ambassador (1 yr)
North Eastern Space Applications Centre (NESAC)
Research Internship (1 mo)
Internshala
Internshala Student Partner 6.0 (5 mos)
ePoise
Growth Hacker Intern (2 mos)
Education
Bachelor of Technology (B.Tech.) at National Institute Of Technology Sikkim
12th at Sri Chaitanya Vidyaniketan,Visakhapatnam
10th at D.A.V. Public School,Begusarai